LFXP6E-5F256C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 188 73728 6000 256-BGA |
|---|---|
| Quantity | 1,384 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 188 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 720 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of LFXP6E-5F256C – XP Field Programmable Gate Array (FPGA) IC, 188 I/Os, 256‑BGA
The LFXP6E-5F256C is a commercial-grade FPGA from the LatticeXP family offering non-volatile, infinitely reconfigurable logic in a 256-ball fpBGA (17×17 mm) package. It integrates 6,000 logic elements, approximately 73,728 bits of embedded RAM, and up to 188 user I/Os to support compact, high-density commercial embedded designs.
Designed for applications that require instant-on reconfiguration, flexible I/O and on-chip memory, this device delivers a combination of configurability and integration for protocol bridging, embedded control, and memory-interface tasks in commercial electronic products.
Key Features
- Core Logic — 6,000 logic elements providing a flexible fabric for implementing control, protocol, and signal-processing functions.
- Embedded Memory — Approximately 73,728 bits (≈72 Kbits) of on-chip RAM to support buffering, small FIFOs and local data storage.
- I/O Density & Package — 188 user I/Os in a 256-ball fpBGA (256‑FPBGA, 17×17 mm) package; surface-mount mounting type for compact board designs.
- Non-volatile, Instant-On Architecture — LatticeXP family features include non-volatile configuration with instant-on capability and no requirement for external configuration memory.
- Reconfiguration & Power Modes — Supports in-field reconfiguration (TransFR™) and a Sleep Mode that enables significant static current reduction.
- Flexible I/O Standards — Family-level sysIO™ programmability supports a wide range of interfaces including LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, LVDS, SSTL, HSTL and PCI signaling options.
- Clocking & Memory Interface — Up to 2 analog PLLs on LFXP6 devices and dedicated DDR memory support (interface up to DDR333 / 166 MHz) for synchronous memory designs.
- Power & Temperature — Core supply range 1.14 V to 1.26 V; commercial operating temperature range 0 °C to 85 °C; RoHS compliant.
- Design & Test Support — Family data sheet notes support for IEEE 1149.1 boundary scan and ispTRACY™ internal logic analyzer capability; supported by ispLEVER design tools and available ispLeverCORE IP modules.
Typical Applications
- Embedded Control — Implement real-time control logic and state machines for commercial embedded systems that benefit from reconfigurable hardware.
- Interface & Protocol Bridging — High I/O count and flexible I/O standards enable protocol bridging and interface adaptation between different voltage and signaling domains.
- Memory Interface — Use on-chip RAM and DDR interface capability to implement memory controllers, buffering and data-path logic for moderate-speed memory systems.
- User Interfaces & Peripheral Glue — Integrate multiple peripheral interfaces and simple HMI logic in a single device to reduce board-level component count.
Unique Advantages
- Instant-On, Non-Volatile Configuration: Eliminates the need for external configuration memory and enables rapid startup behavior.
- Reconfigurability in the Field: TransFR™ reconfiguration and JTAG/system configuration support let you update logic without replacing hardware.
- High I/O Count in a Compact Package: 188 I/Os in a 17×17 mm fpBGA delivers dense connectivity for multi-interface designs while minimizing PCB area.
- On-Chip Memory for Local Storage: Approximately 73,728 bits of embedded RAM reduce dependence on external SRAM for small buffers and FIFOs.
- Power Management Options: Sleep Mode enables large static current reduction for power-conscious commercial designs.
- Tooling and IP Ecosystem: Supported by ispLEVER tools and pre-designed ispLeverCORE modules to accelerate development and integration.
Why Choose LFXP6E-5F256C?
The LFXP6E-5F256C combines non-volatile, instantly available logic with a compact, high-I/O package and integrated memory to address a wide range of commercial embedded design needs. Its balance of 6,000 logic elements, significant on-chip RAM and 188 I/Os makes it well-suited for applications that require flexible interfacing, in-field updates and compact board layouts.
With family-level features such as programmable sysIO buffering, DDR interface support and toolchain/IP support from ispLEVER, the device provides a practical platform for engineers seeking a reconfigurable, integrated solution with verifiable operating and power parameters.
Request a quote or submit an inquiry to receive pricing and availability for the LFXP6E-5F256C for your next commercial FPGA design.