LFXP6E-5F256C

IC FPGA 188 I/O 256FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 188 73728 6000 256-BGA

Quantity 1,384 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O188Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs720Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of LFXP6E-5F256C – XP Field Programmable Gate Array (FPGA) IC, 188 I/Os, 256‑BGA

The LFXP6E-5F256C is a commercial-grade FPGA from the LatticeXP family offering non-volatile, infinitely reconfigurable logic in a 256-ball fpBGA (17×17 mm) package. It integrates 6,000 logic elements, approximately 73,728 bits of embedded RAM, and up to 188 user I/Os to support compact, high-density commercial embedded designs.

Designed for applications that require instant-on reconfiguration, flexible I/O and on-chip memory, this device delivers a combination of configurability and integration for protocol bridging, embedded control, and memory-interface tasks in commercial electronic products.

Key Features

  • Core Logic — 6,000 logic elements providing a flexible fabric for implementing control, protocol, and signal-processing functions.
  • Embedded Memory — Approximately 73,728 bits (≈72 Kbits) of on-chip RAM to support buffering, small FIFOs and local data storage.
  • I/O Density & Package — 188 user I/Os in a 256-ball fpBGA (256‑FPBGA, 17×17 mm) package; surface-mount mounting type for compact board designs.
  • Non-volatile, Instant-On Architecture — LatticeXP family features include non-volatile configuration with instant-on capability and no requirement for external configuration memory.
  • Reconfiguration & Power Modes — Supports in-field reconfiguration (TransFR™) and a Sleep Mode that enables significant static current reduction.
  • Flexible I/O Standards — Family-level sysIO™ programmability supports a wide range of interfaces including LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, LVDS, SSTL, HSTL and PCI signaling options.
  • Clocking & Memory Interface — Up to 2 analog PLLs on LFXP6 devices and dedicated DDR memory support (interface up to DDR333 / 166 MHz) for synchronous memory designs.
  • Power & Temperature — Core supply range 1.14 V to 1.26 V; commercial operating temperature range 0 °C to 85 °C; RoHS compliant.
  • Design & Test Support — Family data sheet notes support for IEEE 1149.1 boundary scan and ispTRACY™ internal logic analyzer capability; supported by ispLEVER design tools and available ispLeverCORE IP modules.

Typical Applications

  • Embedded Control — Implement real-time control logic and state machines for commercial embedded systems that benefit from reconfigurable hardware.
  • Interface & Protocol Bridging — High I/O count and flexible I/O standards enable protocol bridging and interface adaptation between different voltage and signaling domains.
  • Memory Interface — Use on-chip RAM and DDR interface capability to implement memory controllers, buffering and data-path logic for moderate-speed memory systems.
  • User Interfaces & Peripheral Glue — Integrate multiple peripheral interfaces and simple HMI logic in a single device to reduce board-level component count.

Unique Advantages

  • Instant-On, Non-Volatile Configuration: Eliminates the need for external configuration memory and enables rapid startup behavior.
  • Reconfigurability in the Field: TransFR™ reconfiguration and JTAG/system configuration support let you update logic without replacing hardware.
  • High I/O Count in a Compact Package: 188 I/Os in a 17×17 mm fpBGA delivers dense connectivity for multi-interface designs while minimizing PCB area.
  • On-Chip Memory for Local Storage: Approximately 73,728 bits of embedded RAM reduce dependence on external SRAM for small buffers and FIFOs.
  • Power Management Options: Sleep Mode enables large static current reduction for power-conscious commercial designs.
  • Tooling and IP Ecosystem: Supported by ispLEVER tools and pre-designed ispLeverCORE modules to accelerate development and integration.

Why Choose LFXP6E-5F256C?

The LFXP6E-5F256C combines non-volatile, instantly available logic with a compact, high-I/O package and integrated memory to address a wide range of commercial embedded design needs. Its balance of 6,000 logic elements, significant on-chip RAM and 188 I/Os makes it well-suited for applications that require flexible interfacing, in-field updates and compact board layouts.

With family-level features such as programmable sysIO buffering, DDR interface support and toolchain/IP support from ispLEVER, the device provides a practical platform for engineers seeking a reconfigurable, integrated solution with verifiable operating and power parameters.

Request a quote or submit an inquiry to receive pricing and availability for the LFXP6E-5F256C for your next commercial FPGA design.

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