LFXP6E-4F256C

IC FPGA 188 I/O 256FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 188 73728 6000 256-BGA

Quantity 1,140 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O188Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs720Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of LFXP6E-4F256C – XP Field Programmable Gate Array (FPGA) IC 188 73728 6000 256-BGA

The LFXP6E-4F256C is a commercial-grade, non-volatile FPGA from the Lattice XP family, delivered in a compact 256-ball fpBGA (17 × 17 mm) package. It combines reconfigurable logic, embedded memory, and high I/O density to address commercial embedded and communications applications that require fast startup, flexible I/O, and on-chip memory.

With instant-on non-volatile configuration and in-field reconfiguration capability, this device targets applications that benefit from rapid power-up, secure bitstream handling and the ability to update logic while a system is running.

Key Features

  • Core & Reconfiguration  Non-volatile, infinitely reconfigurable architecture with instant-on configuration and in-field reconfiguration (TransFR™); no external configuration memory required.
  • Logic Resources  Approximately 6,000 logic elements and 720 CLBs, providing mid-range combinational and sequential logic capacity for complex glue logic and control functions.
  • Embedded Memory  Approximately 72 Kbits of on-chip embedded RAM (system memory and distributed RAM) for buffers, FIFOs and small data structures.
  • I/O & Interface Flexibility  188 I/Os in the 256-ball fpBGA package to support dense external connectivity and a wide range of interface needs; family-level support for common signaling options and dedicated DDR memory interfaces (up to DDR333) is provided in the LatticeXP family architecture.
  • Clocking  Device-specific support includes 2 PLLs for clock multiplication, division and phase adjustment (as implemented for the LFXP6 device class).
  • Power & Low-Power Modes  Low-voltage core operation with a specified supply range of 1.14 V to 1.26 V and family-level Sleep Mode capability that enables significant static current reduction.
  • Package & Mounting  Supplier device package: 256-FPBGA (17 × 17 mm), surface-mount package suited for compact boards and high-density designs.
  • Commercial Temperature & Compliance  Commercial operating temperature range of 0 °C to 85 °C and RoHS compliant.

Typical Applications

  • Embedded System Control  Mid-density logic and on-chip memory for control, protocol handling, and glue logic in commercial embedded products.
  • Interface Bridging & I/O Expansion  High I/O count and flexible signaling options make the device suitable for bridging between subsystems and expanding I/O capability on compact boards.
  • Memory Interface & Buffering  Supports dedicated DDR memory interfaces and on-chip RAM for buffering and memory controller functions in communication and processing systems.
  • Secure, Instant-On Products  Non-volatile instant-on configuration and secure in-system reconfiguration support applications requiring fast startup and protection of design bitstreams.

Unique Advantages

  • Instant-on, Non-Volatile Operation:  Powers up in microseconds without external configuration memory, simplifying system design and reducing BOM.
  • Field Reconfiguration:  TransFR in-field update capability allows logic updates while the system is operating, enabling feature upgrades and fixes without full system downtime.
  • Balanced Logic and Memory:  ~6,000 logic elements paired with ~72 Kbits of embedded RAM offers a practical balance for mid-range commercial designs that need both logic density and on-chip data storage.
  • High I/O Density in a Compact Package:  188 I/Os in a 256-FPBGA (17 × 17 mm) package supports dense connectivity while keeping board area small.
  • Low-Voltage Core:  1.14 V to 1.26 V core supply support helps optimize power delivery for the FPGA fabric.
  • Standards and Compliance:  Commercial temperature rating (0 °C to 85 °C) and RoHS compliance meet common manufacturing and environmental requirements for commercial products.

Why Choose LFXP6E-4F256C?

The LFXP6E-4F256C delivers a mid-range FPGA solution with a practical mix of logic capacity, embedded memory and high I/O count in a compact fpBGA package. Its non-volatile instant-on architecture and field reconfiguration options are well suited to commercial embedded and communications designs that require fast startup, secure configuration and the ability to update logic in the field.

This device is a fit for engineers seeking a commercially rated FPGA that balances integration, reconfiguration flexibility and compact packaging, while providing RoHS compliance and defined power and temperature parameters for deployment in commercial products.

Request a quote or submit a purchase inquiry to receive pricing and availability information for the LFXP6E-4F256C.

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