LFXP6E-3T144C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 100 73728 6000 144-LQFP |
|---|---|
| Quantity | 1,166 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 100 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 720 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of LFXP6E-3T144C – XP Field Programmable Gate Array (FPGA) IC 100 73728 6000 144-LQFP
The LFXP6E-3T144C is a LatticeXP family FPGA providing a non-volatile, infinitely reconfigurable logic platform. The device integrates approximately 6,000 logic elements, about 73,728 bits of on-chip RAM, and 100 programmable I/Os in a 144-pin LQFP surface-mount package.
Designed for cost-sensitive system designs and embedded applications, this commercial-grade FPGA offers instant-on, in-field reconfiguration capabilities and flexible I/O support to simplify board-level architecture and enable rapid design iteration.
Key Features
- Core Logic 6,000 logic elements for implementing custom combinational and sequential logic functions in a compact footprint.
- Embedded Memory Approximately 73,728 bits of on-chip RAM (embedded SRAM) plus distributed memory resources for buffering, state storage, and small data structures.
- Programmable I/O 100 I/Os in a 144-LQFP (20×20 mm TQFP footprint listing) package, with a programmable sysIO buffer that supports multiple interface standards as described in the device family documentation.
- Non-volatile, Instant-on Architecture LatticeXP family architecture provides instant-on behavior without external configuration memory and supports secure, reconfigurable operation.
- In-field Reconfiguration TransFR™ reconfiguration enables design updates while the system is operating, allowing rapid feature updates or fixes without replacing hardware.
- Low-power Modes Family sleep mode capability (allows up to 1000× static current reduction as noted in family documentation) for power-sensitive applications.
- Clocking and Memory Interfaces On-chip PLL resources for clock management (LFXP6 family devices provide 2 PLLs) and dedicated DDR memory interface support up to DDR333 (166 MHz) as described in the family datasheet.
- Power and Operating Range Core supply range specified at 1.14 V to 1.26 V; device is commercial grade with an operating temperature range of 0 °C to 85 °C.
- Packaging and Compliance Surface-mount 144-LQFP package (supplier device package 144-TQFP 20×20) and RoHS compliant.
Typical Applications
- Embedded Systems Use the device for control, glue-logic, and protocol adaptation in compact embedded designs where on-chip memory and flexible I/O reduce external BOM.
- Interface Bridging Implement custom interface logic and low-latency bridging between peripherals, leveraging the programmable I/O buffer options and on-chip memory.
- Field-updatable Logic Deploy systems that require in-field updates or feature additions using the device’s TransFR reconfiguration capability without external configuration memory.
Unique Advantages
- Non-volatile, instant-on operation: Eliminates the need for external configuration memory and enables immediate device availability after power-up.
- Compact, integrated solution: Combines logic, embedded RAM and flexible I/O in a 144-LQFP package to reduce board area and simplify layout.
- Field reconfiguration support: TransFR capability lets designers update logic in deployed systems, reducing maintenance cycles and enabling feature rollouts.
- Power management options: Family sleep mode provides substantial static current reduction for lower standby power.
- Design ecosystem support: Family documentation notes availability of design tools and pre-designed IP to accelerate implementation and reduce time-to-market.
Why Choose LFXP6E-3T144C?
The LFXP6E-3T144C positions itself as a practical, reconfigurable FPGA option for commercial embedded and system-level designs that require a balance of logic capacity, embedded memory, and a moderate I/O count in a compact surface-mount package. Its non-volatile architecture and in-field reconfiguration options help simplify system configuration and secure designs without external configuration devices.
This part is suited to teams seeking a scalable, reprogrammable device with approximately 6,000 logic elements, roughly 73.7 Kbits of embedded RAM, 100 I/Os, and documented family support for flexible I/O standards, clocking, and memory interface options. The commercial temperature range and RoHS compliance make it appropriate for mainstream electronic products and prototypes.
Request a quote or submit an RFQ to obtain pricing, availability, and lead-time information for the LFXP6E-3T144C.