LFXP6E-3T144C

IC FPGA 100 I/O 144TQFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 100 73728 6000 144-LQFP

Quantity 1,166 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O100Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs720Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of LFXP6E-3T144C – XP Field Programmable Gate Array (FPGA) IC 100 73728 6000 144-LQFP

The LFXP6E-3T144C is a LatticeXP family FPGA providing a non-volatile, infinitely reconfigurable logic platform. The device integrates approximately 6,000 logic elements, about 73,728 bits of on-chip RAM, and 100 programmable I/Os in a 144-pin LQFP surface-mount package.

Designed for cost-sensitive system designs and embedded applications, this commercial-grade FPGA offers instant-on, in-field reconfiguration capabilities and flexible I/O support to simplify board-level architecture and enable rapid design iteration.

Key Features

  • Core Logic 6,000 logic elements for implementing custom combinational and sequential logic functions in a compact footprint.
  • Embedded Memory Approximately 73,728 bits of on-chip RAM (embedded SRAM) plus distributed memory resources for buffering, state storage, and small data structures.
  • Programmable I/O 100 I/Os in a 144-LQFP (20×20 mm TQFP footprint listing) package, with a programmable sysIO buffer that supports multiple interface standards as described in the device family documentation.
  • Non-volatile, Instant-on Architecture LatticeXP family architecture provides instant-on behavior without external configuration memory and supports secure, reconfigurable operation.
  • In-field Reconfiguration TransFR™ reconfiguration enables design updates while the system is operating, allowing rapid feature updates or fixes without replacing hardware.
  • Low-power Modes Family sleep mode capability (allows up to 1000× static current reduction as noted in family documentation) for power-sensitive applications.
  • Clocking and Memory Interfaces On-chip PLL resources for clock management (LFXP6 family devices provide 2 PLLs) and dedicated DDR memory interface support up to DDR333 (166 MHz) as described in the family datasheet.
  • Power and Operating Range Core supply range specified at 1.14 V to 1.26 V; device is commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Packaging and Compliance Surface-mount 144-LQFP package (supplier device package 144-TQFP 20×20) and RoHS compliant.

Typical Applications

  • Embedded Systems Use the device for control, glue-logic, and protocol adaptation in compact embedded designs where on-chip memory and flexible I/O reduce external BOM.
  • Interface Bridging Implement custom interface logic and low-latency bridging between peripherals, leveraging the programmable I/O buffer options and on-chip memory.
  • Field-updatable Logic Deploy systems that require in-field updates or feature additions using the device’s TransFR reconfiguration capability without external configuration memory.

Unique Advantages

  • Non-volatile, instant-on operation: Eliminates the need for external configuration memory and enables immediate device availability after power-up.
  • Compact, integrated solution: Combines logic, embedded RAM and flexible I/O in a 144-LQFP package to reduce board area and simplify layout.
  • Field reconfiguration support: TransFR capability lets designers update logic in deployed systems, reducing maintenance cycles and enabling feature rollouts.
  • Power management options: Family sleep mode provides substantial static current reduction for lower standby power.
  • Design ecosystem support: Family documentation notes availability of design tools and pre-designed IP to accelerate implementation and reduce time-to-market.

Why Choose LFXP6E-3T144C?

The LFXP6E-3T144C positions itself as a practical, reconfigurable FPGA option for commercial embedded and system-level designs that require a balance of logic capacity, embedded memory, and a moderate I/O count in a compact surface-mount package. Its non-volatile architecture and in-field reconfiguration options help simplify system configuration and secure designs without external configuration devices.

This part is suited to teams seeking a scalable, reprogrammable device with approximately 6,000 logic elements, roughly 73.7 Kbits of embedded RAM, 100 I/Os, and documented family support for flexible I/O standards, clocking, and memory interface options. The commercial temperature range and RoHS compliance make it appropriate for mainstream electronic products and prototypes.

Request a quote or submit an RFQ to obtain pricing, availability, and lead-time information for the LFXP6E-3T144C.

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