LFXP6E-3Q208C

The LFXP6E-3Q208C is a member of the LatticeXP family of non-volatile, reconfigurable FPGAs. It provides 6,000 logic elements, 142 user I/Os and 73,728 bits of on-chip RAM in a 208‑pin BFQFP (28 × 28 mm) package, targeting compact system designs that require flexible I/O, embedded memory and in-field reconfiguration.

Built for commercial applications with an operating range of 0 °C to 85 °C and a core supply range of 1.14 V to 1.26 V, this device combines instant-on non-volatile behavior, reprogrammability and system-level features such as PLLs and boundary scan to simplify board-level integration.

Key Features

• Core Logic 6,000 logic elements provide a mid-density programmable fabric suitable for control, glue-logic and protocol handling.
• On-chip Memory 73,728 total RAM bits of on-chip memory for embedded data buffering and state storage; the LatticeXP family supports both distributed and block RAM architectures.
• High I/O Count 142 user I/Os in the 208‑BFQFP package enable broad peripheral connectivity and flexible board routing.
• Non-volatile, Instant-on Family-level architecture provides non-volatile configuration with instant-on behavior and no requirement for external configuration memory.
• Reconfiguration and In-field Updates Supports rapid SRAM-based reconfiguration and TransFR™ in-field logic updates to modify device behavior while in system operation.
• Low-power Modes Sleep mode capability enables significant static current reduction (up to 1000× as described for the family), aiding power-sensitive designs.
• Clocking Integrated PLL resources (per LatticeXP family for this density) for clock multiply/divide and phase shifting to support complex timing schemes.
• Flexible I/O Standards Family-level sysIO™ buffer support for a wide range of I/O standards, enabling interface compatibility across multiple voltage domains.
• Package & Temperature 208‑BFQFP (28×28 mm) surface-mount package; commercial grade operation 0 °C to 85 °C.
• Regulatory RoHS compliant.

Typical Applications

• Interface Bridging and Protocol Conversion Flexible I/O and rich clocking support make the device suitable for bridging between different bus and serial standards.
• Embedded System Glue Logic Mid-density logic and on-chip RAM are well suited for combining control logic, peripheral interfaces and small data buffers on a single device.
• Memory Interface and Buffering Built-in memory resources and PLLs support implementations that require synchronized data buffering and DDR interface elements at the system level.
• Field-updatable Logic Non-volatile configuration and TransFR-style reconfiguration enable in-field feature updates and iterative firmware-driven development.

Unique Advantages

• Non-volatile Instant-on: Eliminates the need for external configuration memory and enables immediate device startup at power-up.
• In-field Reconfiguration: Rapid SRAM reprogramming and family-level TransFR capabilities allow logic updates without board replacement.
• Balanced Integration: Combines a mid-range logic element count with substantial I/O and embedded memory to reduce BOM and simplify designs.
• Power Management: Sleep mode delivers dramatic static current reduction for energy-conscious applications.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation, appropriate for a wide range of commercial and consumer systems.
• Compact, Surface-Mount Package: 208‑BFQFP (28 × 28 mm) package supports high I/O density in a board-friendly form factor.

Why Choose LFXP6E-3Q208C?

The LFXP6E-3Q208C delivers a practical balance of programmable logic, embedded memory and high I/O count in a single non-volatile FPGA. Its instant-on capability and in-field reconfiguration options reduce system complexity by removing external configuration memory and enabling field updates. With 6,000 logic elements, 142 I/Os and approximately 73,728 bits of on-chip RAM in a 208‑pin BFQFP package, it is well suited to designers who need a compact, reprogrammable solution for mid-density control, interface and buffering tasks.

Designed for commercial applications and RoHS compliant, this device is appropriate for product lines that require reliable, reconfigurable logic with the flexibility to evolve in the field while maintaining a compact board footprint.

If you would like pricing, availability or to request a quote for the LFXP6E-3Q208C, submit a quote request or sales inquiry and our team will respond with current lead-time and ordering options.