LFXP6E-3FN256C

The LFXP6E-3FN256C is a LatticeXP family FPGA from Lattice Semiconductor, delivered in a 256-ball fpBGA (17 × 17 mm) package with 188 user I/Os. It combines non-volatile, reconfigurable logic with on-chip embedded memory and flexible I/O to address compact embedded system designs and connectivity functions.

With 6,000 logic elements and 73,728 bits of on-chip RAM, this commercial-grade device targets applications that require instant-on behavior, in-field reconfiguration and compact, surface-mount packaging while operating across a 1.14 V to 1.26 V supply and a 0 °C to 85 °C temperature range.

Key Features

• Non-volatile, reconfigurable architecture — Instant-on operation with no external configuration memory required and in-field reconfiguration capability for rapid updates.
• Logic capacity — 6,000 logic elements to implement moderate-complexity digital functions and controls.
• Embedded memory — 73,728 total RAM bits (approximately 72 Kbits) of on-chip memory for distributed and block storage.
• I/O and package — 188 user I/Os in a 256-ball fpBGA (17 × 17 mm) surface-mount package for dense, board-level integration.
• Power and thermal — Core supply range specified at 1.14 V to 1.26 V with commercial operating temperature from 0 °C to 85 °C.
• Low-power modes — Sleep mode support for significant static current reduction.
• Clocking and timing — Integrated analog sysCLOCK PLLs (2 PLLs for LFXP6 devices) for clock multiplication, division and phase shifting.
• Memory interface support — Series-level support for dedicated DDR interfaces (up to DDR333) for external memory connectivity.
• Flexible I/O standards — Series sysIO buffer supports a wide range of interface standards to simplify system-level integration.
• Compliance — RoHS compliant.

Typical Applications

• Embedded systems and controllers — Implement control logic, protocol handling and glue functions that benefit from on-chip RAM and moderate logic density.
• Communications and connectivity — Support interface bridging, protocol conversion and timing-intensive functions using integrated PLLs and flexible I/O.
• Memory interface and buffering — Use the device’s DDR interface support and embedded RAM for external memory control and local buffering.
• Product differentiation and in-field updates — Instant-on behavior and in-system reconfiguration enable field updates and feature evolution without external configuration storage.

Unique Advantages

• Instant-on, non-volatile configuration: Eliminates the need for external configuration memory and enables rapid system start-up.
• Reconfigurability in the field: TransFR-style updates allow logic to be refreshed while the system remains in operation, reducing downtime.
• Balanced integration: Combines 6,000 logic elements with approximately 72 Kbits of embedded memory to reduce external component count.
• Compact, high-density I/O: 188 I/Os in a 256-ball fpBGA deliver a small footprint for space-constrained PCBs.
• Power management options: Sleep mode support dramatically reduces static current for lower-power standby and energy-conscious designs.
• Clock and memory support: Integrated PLLs and DDR interface capability simplify clocking and external memory connections.

Why Choose LFXP6E-3FN256C?

The LFXP6E-3FN256C positions itself as a compact, non-volatile FPGA solution for commercial embedded designs that require instant-on behavior, in-field reconfigurability and a balanced mix of logic and on-chip memory. Its 256-ball fpBGA package and 188 I/Os make it suitable for dense board layouts where footprint and integration matter.

Engineers building products that benefit from flexible I/O, integrated PLLs and local RAM will find the device useful for bridging, control and memory-interface roles. The combination of LatticeXP family features, commercial grading and RoHS compliance supports reliable, production-focused implementations with the option to scale to other family densities as designs evolve.

Request a quote or submit a pricing inquiry for LFXP6E-3FN256C to receive availability and ordering information tailored to your project needs.