LFXP6E-3F256C

IC FPGA 188 I/O 256FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 188 73728 6000 256-BGA

Quantity 592 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O188Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs720Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of LFXP6E-3F256C – XP Field Programmable Gate Array (FPGA) IC 188 73728 6000 256-BGA

The LFXP6E-3F256C is a mid-density, non-volatile FPGA in a compact 256-ball fpBGA package designed for commercial embedded applications. Built on the LatticeXP family architecture, it combines approximately 6000 logic elements with on-chip memory and flexible I/O to support functions such as protocol bridging, control logic, and peripheral interfacing in commercial systems.

This device targets designers who need instant-on, reconfigurable logic with a balance of logic capacity, embedded RAM, and a 188-pin I/O count, all within a 17 × 17 mm surface-mount package and a commercial operating range.

Key Features

  • Core Logic Approximately 6000 logic elements provide a mid-density fabric suitable for control logic, protocol handling, and glue logic.
  • On-Chip Memory Approximately 72 Kbits of embedded RAM (73,728 bits) supports distributed and block memory requirements for buffering and small data storage.
  • I/O Capacity and Flexibility 188 I/O pins in the 256-ball fpBGA package enable connection to multiple peripherals and external interfaces while preserving a compact board footprint.
  • Non-volatile, Instant-On Architecture LatticeXP family features non-volatile configuration with instant-on capability and no requirement for external configuration memory, enabling fast startup and design security.
  • Reconfiguration and Power Modes Family-level features include in-field reconfiguration and a sleep mode for significant static current reduction during low-power operation.
  • Clocking and System Support Analog PLLs and system-level features in the LatticeXP family provide clock management and design-support capabilities such as boundary scan and internal logic analysis.
  • Package and Mounting 256-BGA (17 × 17 mm) surface-mount package minimizes PCB area while supporting the device’s 188 I/Os.
  • Power and Temperature Core supply range of 1.14 V to 1.26 V supports low-voltage operation; commercial operating temperature range of 0 °C to 85 °C.
  • Compliance RoHS compliant, meeting common environmental requirements for commercial electronics manufacturing.

Typical Applications

  • Commercial Embedded Systems — Acts as a reconfigurable control element for consumer and commercial products requiring mid-density logic and flexible I/O.
  • Communications and Networking — Implements protocol bridging, packet handling, and peripheral interfacing using the device’s I/O resources and embedded memory.
  • Prototyping and Development — Suitable for development platforms and proof-of-concept designs where instant-on and reconfigurability speed iteration.
  • Instrumentation and Test Equipment — Provides customizable logic and on-chip RAM for data buffering and interface control in bench and benchtop instruments.

Unique Advantages

  • Non-volatile instant-on operation: Eliminates the need for external configuration memory and enables immediate startup behavior.
  • Balanced mid-density resources: 6000 logic elements and ~72 Kbits of embedded RAM provide a compact solution for common control and interfacing tasks.
  • High I/O count in a small package: 188 I/Os in a 17 × 17 mm 256-ball fpBGA reduce PCB real estate while enabling broad peripheral connectivity.
  • Low-voltage core operation: 1.14–1.26 V supply supports designs targeting lower-power core domains.
  • Family ecosystem and tools: Leverages LatticeXP family features such as reconfiguration, PLLs, and design support tools to simplify development and in-field updates.
  • RoHS compliance: Meets common environmental requirements for commercial product manufacturing.

Why Choose LFXP6E-3F256C?

The LFXP6E-3F256C provides a practical balance of logic capacity, embedded memory, and I/O in a compact fpBGA package for commercial embedded applications. Its non-volatile, instant-on architecture and reconfiguration capabilities make it well suited to systems that require fast startup and field updates without external configuration components.

Designed for developers and procurement teams building commercial products, this device delivers scalable mid-range FPGA resources with on-chip RAM and a high I/O count, backed by the LatticeXP family’s system features and development ecosystem.

Request a quote or submit an inquiry to receive pricing and availability information for the LFXP6E-3F256C.

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