LFXP6E-3F256I

IC FPGA 188 I/O 256FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 188 73728 6000 256-BGA

Quantity 1,384 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O188Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs720Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of LFXP6E-3F256I – XP FPGA, 6000 logic elements, 256‑BGA, Industrial

The LFXP6E-3F256I is a Lattice XP family field-programmable gate array (FPGA) in a 256-ball fpBGA (17×17 mm) package, offered in an industrial grade variant. The device integrates 6000 logic elements with on-chip RAM and a flexible, programmable I/O architecture to support embedded and industrial system designs that require non‑volatile instant-on operation and in-field reconfiguration.

Designed for systems that need fast startup, secure configuration and flexible interfaces, this FPGA balances integration and deterministic behavior with industry-proven FPGA features such as sleep modes, on-chip memory, and programmable PLLs.

Key Features

  • Core Architecture Non‑volatile, infinitely reconfigurable FPGA architecture with instant-on capability (powers up in microseconds) and no external configuration memory required.
  • Logic Capacity 6000 logic elements to implement control, glue-logic, protocol handling and mid-density processing tasks.
  • Embedded Memory Approximately 72 Kbits of on-chip RAM (total RAM bits: 73,728) for embedded buffers, FIFOs and small data stores.
  • I/O and Interface Flexibility 188 user I/Os with a programmable sysIO™ buffer supporting a wide range of standards including LVCMOS (1.2–3.3 V), LVDS, PCI, SSTL, HSTL and LVPECL, enabling diverse interface implementations.
  • Clocking and Timing Integrated analog PLL resources (2 PLLs for LFXP6 devices) for clock multiplication, division and phase shifting to simplify system clock management.
  • Power and Low-Power Modes Core supply range 1.14 V to 1.26 V; supports a Sleep Mode that enables large static current reduction for power-sensitive designs.
  • Reconfiguration and Field Updates Supports TransFR™ in-field reconfiguration for logic updates while the system remains operational, plus programmable SRAM and non‑volatile memory via system configuration and JTAG.
  • Package and Environmental 256-ball fpBGA (256‑FPBGA, 17×17 mm) surface-mount package; industrial operating temperature range from −40 °C to 100 °C; RoHS compliant.

Typical Applications

  • Industrial Control Implement real-time control logic, sensor interfaces and deterministic I/O handling in industrial automation and instrumentation.
  • Communications and Protocol Bridging Use the programmable I/O standards and embedded memory to implement protocol translators, interface bridges and data buffering.
  • Memory Interface and DDR Support Suitable for designs that require dedicated DDR memory support and controlled clocking using the onboard PLL resources.
  • Field-Upgradeable Systems Enable in-field updates and iterative feature deployment using TransFR™ reconfiguration and non‑volatile configuration storage.

Unique Advantages

  • Instant-on non‑volatile operation: Eliminates the need for external configuration memory and reduces system startup time to microseconds.
  • Flexible I/O standards: Broad sysIO support simplifies multimodal interface designs and reduces the need for external level‑shifters or translators.
  • Power-aware features: Sleep Mode provides substantial static current reduction for energy-sensitive or battery-backed industrial applications.
  • Field reconfiguration capability: TransFR™ allows logic updates while the system is operating, enabling maintenance and upgrades without full system downtime.
  • Industrial temperature rating: Specified −40 °C to 100 °C operation for deployment in demanding environmental conditions.
  • Compact BGA package: 256-ball fpBGA (17×17 mm) provides a high I/O count in a compact surface-mount form factor for space-constrained designs.

Why Choose LFXP6E-3F256I?

The LFXP6E-3F256I delivers a balanced combination of non‑volatile instant-on FPGA capability, mid-range logic capacity (6000 logic elements), and flexible I/O in a compact industrial-grade BGA package. Its integrated memory resources and reconfiguration features make it suitable for embedded and industrial systems that require secure startup, in-field updates and a variety of interface standards.

For designers targeting industrial embedded applications with tight power, interface and space requirements, this FPGA provides a scalable building block with vendor-provided design flows and family-level features that support migration across Lattice XP devices.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the LFXP6E-3F256I.

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