LFXP6E-3F256I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 188 73728 6000 256-BGA |
|---|---|
| Quantity | 1,384 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 188 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 720 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of LFXP6E-3F256I – XP FPGA, 6000 logic elements, 256‑BGA, Industrial
The LFXP6E-3F256I is a Lattice XP family field-programmable gate array (FPGA) in a 256-ball fpBGA (17×17 mm) package, offered in an industrial grade variant. The device integrates 6000 logic elements with on-chip RAM and a flexible, programmable I/O architecture to support embedded and industrial system designs that require non‑volatile instant-on operation and in-field reconfiguration.
Designed for systems that need fast startup, secure configuration and flexible interfaces, this FPGA balances integration and deterministic behavior with industry-proven FPGA features such as sleep modes, on-chip memory, and programmable PLLs.
Key Features
- Core Architecture Non‑volatile, infinitely reconfigurable FPGA architecture with instant-on capability (powers up in microseconds) and no external configuration memory required.
- Logic Capacity 6000 logic elements to implement control, glue-logic, protocol handling and mid-density processing tasks.
- Embedded Memory Approximately 72 Kbits of on-chip RAM (total RAM bits: 73,728) for embedded buffers, FIFOs and small data stores.
- I/O and Interface Flexibility 188 user I/Os with a programmable sysIO™ buffer supporting a wide range of standards including LVCMOS (1.2–3.3 V), LVDS, PCI, SSTL, HSTL and LVPECL, enabling diverse interface implementations.
- Clocking and Timing Integrated analog PLL resources (2 PLLs for LFXP6 devices) for clock multiplication, division and phase shifting to simplify system clock management.
- Power and Low-Power Modes Core supply range 1.14 V to 1.26 V; supports a Sleep Mode that enables large static current reduction for power-sensitive designs.
- Reconfiguration and Field Updates Supports TransFR™ in-field reconfiguration for logic updates while the system remains operational, plus programmable SRAM and non‑volatile memory via system configuration and JTAG.
- Package and Environmental 256-ball fpBGA (256‑FPBGA, 17×17 mm) surface-mount package; industrial operating temperature range from −40 °C to 100 °C; RoHS compliant.
Typical Applications
- Industrial Control Implement real-time control logic, sensor interfaces and deterministic I/O handling in industrial automation and instrumentation.
- Communications and Protocol Bridging Use the programmable I/O standards and embedded memory to implement protocol translators, interface bridges and data buffering.
- Memory Interface and DDR Support Suitable for designs that require dedicated DDR memory support and controlled clocking using the onboard PLL resources.
- Field-Upgradeable Systems Enable in-field updates and iterative feature deployment using TransFR™ reconfiguration and non‑volatile configuration storage.
Unique Advantages
- Instant-on non‑volatile operation: Eliminates the need for external configuration memory and reduces system startup time to microseconds.
- Flexible I/O standards: Broad sysIO support simplifies multimodal interface designs and reduces the need for external level‑shifters or translators.
- Power-aware features: Sleep Mode provides substantial static current reduction for energy-sensitive or battery-backed industrial applications.
- Field reconfiguration capability: TransFR™ allows logic updates while the system is operating, enabling maintenance and upgrades without full system downtime.
- Industrial temperature rating: Specified −40 °C to 100 °C operation for deployment in demanding environmental conditions.
- Compact BGA package: 256-ball fpBGA (17×17 mm) provides a high I/O count in a compact surface-mount form factor for space-constrained designs.
Why Choose LFXP6E-3F256I?
The LFXP6E-3F256I delivers a balanced combination of non‑volatile instant-on FPGA capability, mid-range logic capacity (6000 logic elements), and flexible I/O in a compact industrial-grade BGA package. Its integrated memory resources and reconfiguration features make it suitable for embedded and industrial systems that require secure startup, in-field updates and a variety of interface standards.
For designers targeting industrial embedded applications with tight power, interface and space requirements, this FPGA provides a scalable building block with vendor-provided design flows and family-level features that support migration across Lattice XP devices.
Request a quote or submit an inquiry for pricing and availability to move your design forward with the LFXP6E-3F256I.