LFXP6C-5QN208C

The LFXP6C-5QN208C is a commercial-grade, non-volatile FPGA from the LatticeXP family. It integrates approximately 6,000 logic elements with on-chip memory and flexible I/O in a 208-pin QFP package to support compact system designs.

Designed for instant-on operation without external configuration memory, this device targets system-level and embedded applications that require reconfigurable logic, integrated memory resources, and a wide supply-voltage operating range.

Key Features

• Core Logic  Approximately 6,000 logic elements for implementing combinational and sequential logic functions.
• Embedded Memory  Total on-chip RAM of 73,728 bits (approximately 72 Kbits) for block and distributed memory requirements.
• I/O Capacity  142 user I/O pins, providing flexible interfacing in the 208-pin package.
• Non-volatile, Instant-on Architecture  LatticeXP family architecture provides non-volatile configuration with immediate startup and no external configuration memory required.
• Programmable Clocking  Device-level PLL resources (LFXP6 family configuration) for clock multiply/divide and phase adjustments.
• Flexible Voltage Support  Operates across a wide supply range from 1.71 V to 3.465 V to accommodate multiple I/O and core voltage domains.
• Package and Mounting  208-BFQFP package (supplier package: 208-PQFP, 28 × 28 mm) with surface-mount mounting type for board-level integration.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for commercial applications.
• Standards and Test Support  Family-level system features include IEEE 1149.1 boundary scan and on-chip configuration/test capabilities.
• RoHS Compliant  Device is RoHS compliant for environmental and regulatory adherence.

Typical Applications

• Embedded Control and System Glue Logic  Compact logic integration for control tasks, signal routing, and peripheral bridging in embedded platforms.
• Memory Interface and Buffering  On-chip RAM and PLL support enable implementation of memory controllers, FIFOs, and interface timing adjustments.
• High‑Density I/O Aggregation  142 I/Os in a 208-pin QFP package support aggregation of multiple peripherals and custom I/O requirements.

Unique Advantages

• Non-volatile, instant-on operation: Eliminates the need for external configuration memory and enables rapid startup.
• Integrated memory resources: Approximately 72 Kbits of on-chip RAM reduces external memory requirements and simplifies board design.
• Flexible supply range: Broad voltage support (1.71 V–3.465 V) allows use in mixed-voltage systems and simplifies power-domain planning.
• Compact package with high I/O count: 142 I/Os in a 208-pin surface-mount package deliver a balance of density and board-space efficiency.
• Commercial-grade thermal range: Specified for 0 °C to 85 °C operation for mainstream electronics and consumer applications.

Why Choose LFXP6C-5QN208C?

The LFXP6C-5QN208C combines non-volatile configuration, a practical logic capacity of approximately 6,000 elements, and roughly 72 Kbits of embedded RAM in a compact 208-pin QFP package. Its wide supply-voltage range and substantial I/O complement make it suitable for embedded systems that need instant-on behavior, on-chip memory resources, and flexible interfacing without adding external configuration flash.

This device is well suited to designers seeking a reconfigurable, board-level solution for mid-density logic integration where quick startup, on-chip memory, and a high I/O count in a commercial-temperature part are key requirements.

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