LFXP6C-5FN256C

IC FPGA 188 I/O 256FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 188 73728 6000 256-BGA

Quantity 266 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O188Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs720Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of LFXP6C-5FN256C – XP Field Programmable Gate Array (FPGA) IC 188 73728 6000 256-BGA

The LFXP6C-5FN256C is a mid-density, non-volatile FPGA from Lattice Semiconductor designed for commercial applications. It combines approximately 6000 logic elements with on-chip embedded memory and flexible I/O to address a range of embedded logic, interface and system-control tasks.

Built on the LatticeXP family architecture, the device offers instant-on, reconfigurable logic and system-level features targeted at designs that require compact package options, a broad supply-voltage range, and a commercial operating temperature rating.

Key Features

  • Logic Capacity  Approximately 6000 logic elements provide mid-range combinational and sequential logic resources for control and glue-logic designs.
  • Embedded Memory  Approximately 72 Kbits of on-chip RAM (73,728 bits total) supports distributed and block memory needs for buffers, FIFOs and small frame storage.
  • I/O Density  188 user I/Os delivered in the 256-ball fpBGA package enable multiple interfaces and peripheral connections from a single device.
  • Package & Mounting  256-ball fpBGA (256-FPBGA, 17 × 17 mm) in a surface-mount format simplifies board-level integration in compact systems.
  • Power  Device supply range specified at 1.71 V to 3.465 V to accommodate varied system power architectures; RoHS compliant.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C to match mainstream commercial product requirements.
  • Non‑volatile, Instant‑On Architecture  LatticeXP family features (non-volatile configuration) enable instant-on operation without external configuration memory and support in-field reconfiguration.
  • Configuration & Security  On-chip non-volatile configuration removes the need for external configuration PROMs and provides design security against bitstream read-back.
  • Clocking  Device family supports integrated PLLs for clock multiply/divide and phase shifting; LFXP6 devices include PLL resources appropriate for mid-density designs.
  • System Support  Family-level features include boundary-scan (IEEE 1149.1) and internal logic analysis capabilities to assist bring-up and debug.

Typical Applications

  • Embedded Control  Use as the programmable logic core for consumer and industrial control systems requiring compact packaging and moderate logic capacity.
  • Interface Bridging  Implement protocol translation, bus bridging and I/O aggregation where 188 I/Os and flexible I/O buffer options enable multiple interface standards.
  • Memory Interface Support  Support dedicated DDR memory interfaces and local buffering using the device's embedded RAM for moderate‑speed memory applications.
  • Sensor and Data Acquisition  Aggregate and pre-process sensor data with on-chip logic and memory before handing off to a host processor.

Unique Advantages

  • Instant‑on, Non‑volatile Configuration  Eliminates external configuration memory and enables immediate operation at power-up, simplifying system design.
  • Compact, High‑I/O Package  256‑ball fpBGA (17 × 17 mm) provides a high I/O count in a small footprint, reducing board area and BOM complexity.
  • Flexible Power Range  Support for a wide supply range (1.71 V to 3.465 V) allows integration into varied system power domains.
  • Integrated Memory Resources  Approximately 72 Kbits of embedded RAM reduces dependence on external SRAM for common buffering and storage tasks.
  • Design and Debug Support  Family-level support for boundary-scan and internal logic analysis aids system bring-up and debug cycles.
  • RoHS Compliant  Meets RoHS requirements for regulatory and environmental compliance in commercial products.

Why Choose LFXP6C-5FN256C?

The LFXP6C-5FN256C positions itself as a practical, mid-density FPGA choice for designers who need around 6000 logic elements, approximately 72 Kbits of embedded memory and up to 188 I/Os in a compact 256‑ball fpBGA package. Its non-volatile architecture and family-level features such as instant-on configuration and in-field reconfiguration simplify system design and deployment.

This device is suitable for commercial-grade systems that benefit from integrated memory, flexible I/O, and the LatticeXP family’s configuration and system-support features. It is a strong option for teams aiming to reduce BOM complexity while retaining reprogrammable logic capability and board-level integration flexibility.

Request a quote or submit a quote request to evaluate LFXP6C-5FN256C for your next design.

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