LFXP6C-5FN256C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 188 73728 6000 256-BGA |
|---|---|
| Quantity | 266 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 188 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 720 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of LFXP6C-5FN256C – XP Field Programmable Gate Array (FPGA) IC 188 73728 6000 256-BGA
The LFXP6C-5FN256C is a mid-density, non-volatile FPGA from Lattice Semiconductor designed for commercial applications. It combines approximately 6000 logic elements with on-chip embedded memory and flexible I/O to address a range of embedded logic, interface and system-control tasks.
Built on the LatticeXP family architecture, the device offers instant-on, reconfigurable logic and system-level features targeted at designs that require compact package options, a broad supply-voltage range, and a commercial operating temperature rating.
Key Features
- Logic Capacity Approximately 6000 logic elements provide mid-range combinational and sequential logic resources for control and glue-logic designs.
- Embedded Memory Approximately 72 Kbits of on-chip RAM (73,728 bits total) supports distributed and block memory needs for buffers, FIFOs and small frame storage.
- I/O Density 188 user I/Os delivered in the 256-ball fpBGA package enable multiple interfaces and peripheral connections from a single device.
- Package & Mounting 256-ball fpBGA (256-FPBGA, 17 × 17 mm) in a surface-mount format simplifies board-level integration in compact systems.
- Power Device supply range specified at 1.71 V to 3.465 V to accommodate varied system power architectures; RoHS compliant.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C to match mainstream commercial product requirements.
- Non‑volatile, Instant‑On Architecture LatticeXP family features (non-volatile configuration) enable instant-on operation without external configuration memory and support in-field reconfiguration.
- Configuration & Security On-chip non-volatile configuration removes the need for external configuration PROMs and provides design security against bitstream read-back.
- Clocking Device family supports integrated PLLs for clock multiply/divide and phase shifting; LFXP6 devices include PLL resources appropriate for mid-density designs.
- System Support Family-level features include boundary-scan (IEEE 1149.1) and internal logic analysis capabilities to assist bring-up and debug.
Typical Applications
- Embedded Control Use as the programmable logic core for consumer and industrial control systems requiring compact packaging and moderate logic capacity.
- Interface Bridging Implement protocol translation, bus bridging and I/O aggregation where 188 I/Os and flexible I/O buffer options enable multiple interface standards.
- Memory Interface Support Support dedicated DDR memory interfaces and local buffering using the device's embedded RAM for moderate‑speed memory applications.
- Sensor and Data Acquisition Aggregate and pre-process sensor data with on-chip logic and memory before handing off to a host processor.
Unique Advantages
- Instant‑on, Non‑volatile Configuration Eliminates external configuration memory and enables immediate operation at power-up, simplifying system design.
- Compact, High‑I/O Package 256‑ball fpBGA (17 × 17 mm) provides a high I/O count in a small footprint, reducing board area and BOM complexity.
- Flexible Power Range Support for a wide supply range (1.71 V to 3.465 V) allows integration into varied system power domains.
- Integrated Memory Resources Approximately 72 Kbits of embedded RAM reduces dependence on external SRAM for common buffering and storage tasks.
- Design and Debug Support Family-level support for boundary-scan and internal logic analysis aids system bring-up and debug cycles.
- RoHS Compliant Meets RoHS requirements for regulatory and environmental compliance in commercial products.
Why Choose LFXP6C-5FN256C?
The LFXP6C-5FN256C positions itself as a practical, mid-density FPGA choice for designers who need around 6000 logic elements, approximately 72 Kbits of embedded memory and up to 188 I/Os in a compact 256‑ball fpBGA package. Its non-volatile architecture and family-level features such as instant-on configuration and in-field reconfiguration simplify system design and deployment.
This device is suitable for commercial-grade systems that benefit from integrated memory, flexible I/O, and the LatticeXP family’s configuration and system-support features. It is a strong option for teams aiming to reduce BOM complexity while retaining reprogrammable logic capability and board-level integration flexibility.
Request a quote or submit a quote request to evaluate LFXP6C-5FN256C for your next design.

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