LFXP6C-4T144I

IC FPGA 100 I/O 144TQFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 100 73728 6000 144-LQFP

Quantity 801 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFPNumber of I/O100Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs720Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of LFXP6C-4T144I – XP Field Programmable Gate Array (FPGA) IC 100 73728 6000 144-LQFP

The LFXP6C-4T144I is a non-volatile LatticeXP‑family FPGA in a 144‑lead LQFP/TQFP footprint, designed for industrial applications requiring instant-on reconfigurable logic. This device integrates approximately 6,000 logic elements, roughly 73,728 bits of on‑chip RAM, and 100 I/Os in a surface‑mount 144‑pin package, making it suitable for mid-density control, interface and signal‑processing tasks.

Built on the LatticeXP architecture, the device delivers instant power‑up, in-field reconfiguration and low‑power standby modes, offering a compact, secure and reprogrammable silicon building block for embedded systems.

Key Features

  • Core Logic  Approximately 6,000 logic elements for implementing combinational and sequential logic functions.
  • Embedded Memory  Total RAM bits: 73,728 (approximately 72 Kbits) of on‑chip memory for buffers, FIFOs and small data stores.
  • I/O Count & Package  100 I/Os in a 144‑lead LQFP package; supplier package listed as 144‑TQFP (20 × 20 mm) with surface‑mount mounting.
  • Non‑volatile, Reconfigurable Architecture  LatticeXP family features instant‑on operation with no external configuration memory and support for in‑field reconfiguration (TransFR™), enabling secure, fast start‑up and updates.
  • Low‑Power Modes  Sleep mode capability provides significant static current reduction (datasheet cites up to 1000× reduction) for energy‑sensitive systems.
  • Clocking  Family support includes analog PLLs for clock multiply/divide and phase shifting; LFXP6 devices are defined with two PLLs in the LatticeXP selection guide.
  • Flexible I/O Standards  LatticeXP family supports a wide range of I/O standards (including LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS and others) to simplify interfacing with modern memory and high‑speed link devices.
  • Voltage & Temperature  Device supply range: 1.71 V to 3.465 V; industrial operating temperature range: −40 °C to 100 °C.
  • Compliance  RoHS compliant for environmentally conscious designs.

Typical Applications

  • Industrial Control  Implement custom control logic, sensor aggregation and deterministic I/O bridging with the device’s mid‑density logic and wide temperature range.
  • Interface Bridging  Use the flexible I/O support to translate between voltage domains and serial/parallel interfaces for communications and legacy device integration.
  • Embedded Signal Processing  Deploy the on‑chip RAM and logic elements for buffering, preprocessing and protocol handling in video, imaging or sensor applications.
  • In‑field Updatable Systems  Take advantage of the LatticeXP TransFR reconfiguration capability to update logic in deployed systems without removing the device from service.

Unique Advantages

  • Instant-on non‑volatile architecture: Powers up in microseconds without external configuration memory, simplifying system power‑up and securing the configuration bitstream.
  • Reconfigurable in the field: TransFR™ reconfiguration enables in‑system logic updates while the system remains operational, reducing downtime for firmware/feature updates.
  • Compact mid‑density solution: 6,000 logic elements and ~73.7 Kbits of RAM in a 144‑pin surface‑mount package reduce board area and BOM compared with multi‑component solutions.
  • Low standby power: Sleep mode capability provides a large reduction in static current for battery‑assisted or energy‑conscious designs.
  • Industrial temperature range: Rated for −40 °C to 100 °C operation to meet harsher environmental requirements.
  • Wide I/O flexibility: Family I/O standards coverage simplifies interfacing to modern memory, SERDES and legacy peripherals.

Why Choose LFXP6C-4T144I?

The LFXP6C-4T144I positions itself as a practical, mid‑density FPGA choice for industrial embedded systems that require secure, instant‑on reconfigurability and moderate logic and memory resources. With approximately 6,000 logic elements, ~73,728 bits of on‑chip RAM, 100 I/Os and family‑level features such as in‑field reconfiguration and low‑power sleep modes, this device balances integration and system flexibility in a compact surface‑mount 144‑pin package.

Designers targeting control, interface bridging, or updateable signal‑processing functions will find the device’s mix of logic density, embedded memory and industrial temperature rating attractive for production systems that need long‑term maintainability and reconfiguration capability.

Request a quote or submit a purchase inquiry to evaluate LFXP6C-4T144I for your next embedded or industrial FPGA design.

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