LFXP6C-4QN208C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP |
|---|---|
| Quantity | 1,205 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 142 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 720 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of LFXP6C-4QN208C – XP Field Programmable Gate Array (FPGA), LatticeXP family, 6,000 logic elements, 73,728-bit RAM, 142 I/Os, 208-BFQFP
The LFXP6C-4QN208C is a LatticeXP family FPGA combining non-volatile, reconfigurable logic with embedded memory and flexible I/O in a single surface-mount package. It delivers 6,000 logic elements, approximately 73,728 bits of on-chip RAM, and 142 general-purpose I/Os in a 208‑BFQFP (28 × 28 mm) package.
Designed for system designs that require instant-on operation, in-field reconfiguration and a wide voltage operating range, this commercial-grade device targets applications needing integrated logic, memory and diverse I/O support while minimizing external components.
Key Features
- Non‑volatile, infinitely reconfigurable core Instant-on operation with no external configuration memory and secure configuration storage, enabling fast startup and design security.
- Logic capacity 6,000 logic elements with an architecture providing 720 logic blocks, delivering mid-range combinational and sequential resource density.
- Embedded memory 73,728 bits of on-chip RAM (approximately 72 Kbits) for distributed and block memory requirements.
- Flexible I/O Up to 142 I/Os in the 208‑BFQFP package, with sysIO buffer support across multiple interface standards as described in the LatticeXP family data sheet.
- Voltage and power Operates across a wide supply range of 1.71 V to 3.465 V and includes a Sleep Mode capability for significant static current reduction.
- Reconfiguration and system features Supports TransFR™ in-field reconfiguration for live updates and provides JTAG/system configuration access plus internal logic analysis options referenced in the family data sheet.
- Clocking and memory interfaces Family-level support for analog PLL-based clock manipulation and dedicated DDR memory interface capability (family data sheet details supported rates).
- Package and mounting Surface-mount 208‑BFQFP (28 × 28 mm) supplier package for compact board-level integration.
- Commercial temperature grade Rated for 0 °C to 85 °C operation.
- RoHS compliant Meets RoHS environmental compliance requirements.
Typical Applications
- Configurable system logic — Glue logic, protocol bridging and custom state machines using 6,000 logic elements and flexible I/O.
- Embedded memory functions — Local buffering, FIFOs or small shared memory tasks leveraging approximately 73.7 Kbits of on-chip RAM.
- Instant-on systems — Designs that benefit from non-volatile, instant-on operation without external configuration memory.
- Field-updatable designs — In-field logic updates enabled by TransFR™ reconfiguration to adjust functionality while a system remains in service.
Unique Advantages
- Integrated non-volatile configuration: Eliminates the need for external configuration memory and enables immediate startup.
- Balanced mid-range capacity: 6,000 logic elements and 73,728 bits of RAM provide a compact platform for moderately complex designs without excessive board-level BOM.
- Wide I/O resource set: 142 I/Os in a 208‑BFQFP package allow diverse peripheral and bus connectivity while keeping PCB footprint manageable.
- Flexible power and sleep options: Broad supply range (1.71 V–3.465 V) and a Sleep Mode for major static current reduction help optimize power use across operating modes.
- In-field reconfiguration: TransFR™ capability supports live updates to logic, helping extend system lifetime and simplify post-deployment changes.
- Commercial temperature rating: Specified for 0 °C to 85 °C to match a wide range of general-purpose electronic systems.
Why Choose LFXP6C-4QN208C?
The LFXP6C-4QN208C offers a practical balance of logic capacity, embedded memory and high I/O density in a compact 208‑BFQFP package. Its non-volatile architecture delivers instant-on behavior and design security without external configuration components, while sleep and reconfiguration features support power-conscious and field-updateable designs.
This device is suited to customers building system-level solutions that require integrated logic, local memory and flexible interfacing within the commercial temperature range, offering predictable integration and a clear upgrade path within the LatticeXP family documented in the Lattice data materials.
Request a quote or submit a procurement inquiry to check availability and obtain pricing and lead-time information for LFXP6C-4QN208C.

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