LFXP6C-4QN208C

IC FPGA 142 I/O 208QFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP

Quantity 1,205 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O142Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs720Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of LFXP6C-4QN208C – XP Field Programmable Gate Array (FPGA), LatticeXP family, 6,000 logic elements, 73,728-bit RAM, 142 I/Os, 208-BFQFP

The LFXP6C-4QN208C is a LatticeXP family FPGA combining non-volatile, reconfigurable logic with embedded memory and flexible I/O in a single surface-mount package. It delivers 6,000 logic elements, approximately 73,728 bits of on-chip RAM, and 142 general-purpose I/Os in a 208‑BFQFP (28 × 28 mm) package.

Designed for system designs that require instant-on operation, in-field reconfiguration and a wide voltage operating range, this commercial-grade device targets applications needing integrated logic, memory and diverse I/O support while minimizing external components.

Key Features

  • Non‑volatile, infinitely reconfigurable core Instant-on operation with no external configuration memory and secure configuration storage, enabling fast startup and design security.
  • Logic capacity 6,000 logic elements with an architecture providing 720 logic blocks, delivering mid-range combinational and sequential resource density.
  • Embedded memory 73,728 bits of on-chip RAM (approximately 72 Kbits) for distributed and block memory requirements.
  • Flexible I/O Up to 142 I/Os in the 208‑BFQFP package, with sysIO buffer support across multiple interface standards as described in the LatticeXP family data sheet.
  • Voltage and power Operates across a wide supply range of 1.71 V to 3.465 V and includes a Sleep Mode capability for significant static current reduction.
  • Reconfiguration and system features Supports TransFR™ in-field reconfiguration for live updates and provides JTAG/system configuration access plus internal logic analysis options referenced in the family data sheet.
  • Clocking and memory interfaces Family-level support for analog PLL-based clock manipulation and dedicated DDR memory interface capability (family data sheet details supported rates).
  • Package and mounting Surface-mount 208‑BFQFP (28 × 28 mm) supplier package for compact board-level integration.
  • Commercial temperature grade Rated for 0 °C to 85 °C operation.
  • RoHS compliant Meets RoHS environmental compliance requirements.

Typical Applications

  • Configurable system logic — Glue logic, protocol bridging and custom state machines using 6,000 logic elements and flexible I/O.
  • Embedded memory functions — Local buffering, FIFOs or small shared memory tasks leveraging approximately 73.7 Kbits of on-chip RAM.
  • Instant-on systems — Designs that benefit from non-volatile, instant-on operation without external configuration memory.
  • Field-updatable designs — In-field logic updates enabled by TransFR™ reconfiguration to adjust functionality while a system remains in service.

Unique Advantages

  • Integrated non-volatile configuration: Eliminates the need for external configuration memory and enables immediate startup.
  • Balanced mid-range capacity: 6,000 logic elements and 73,728 bits of RAM provide a compact platform for moderately complex designs without excessive board-level BOM.
  • Wide I/O resource set: 142 I/Os in a 208‑BFQFP package allow diverse peripheral and bus connectivity while keeping PCB footprint manageable.
  • Flexible power and sleep options: Broad supply range (1.71 V–3.465 V) and a Sleep Mode for major static current reduction help optimize power use across operating modes.
  • In-field reconfiguration: TransFR™ capability supports live updates to logic, helping extend system lifetime and simplify post-deployment changes.
  • Commercial temperature rating: Specified for 0 °C to 85 °C to match a wide range of general-purpose electronic systems.

Why Choose LFXP6C-4QN208C?

The LFXP6C-4QN208C offers a practical balance of logic capacity, embedded memory and high I/O density in a compact 208‑BFQFP package. Its non-volatile architecture delivers instant-on behavior and design security without external configuration components, while sleep and reconfiguration features support power-conscious and field-updateable designs.

This device is suited to customers building system-level solutions that require integrated logic, local memory and flexible interfacing within the commercial temperature range, offering predictable integration and a clear upgrade path within the LatticeXP family documented in the Lattice data materials.

Request a quote or submit a procurement inquiry to check availability and obtain pricing and lead-time information for LFXP6C-4QN208C.

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