LFXP6C-4FN256C

The LFXP6C-4FN256C is a non-volatile LatticeXP family FPGA offering approximately 6,000 logic elements and 73,728 bits of on-chip RAM in a compact 256-ball FPBGA (17×17 mm) surface-mount package. With 188 user I/Os and a flexible voltage supply range, this commercial-grade device targets embedded and system designs requiring instant-on reconfigurability, in-field updates and a broad range of I/O interfaces.

Designed around the LatticeXP architecture, the device combines reconfigurable logic, embedded and distributed memory, and system-level features such as sleep mode and configuration via JTAG or system ports to support a variety of mid-density applications.

Key Features

• Logic Capacity  Approximately 6,000 logic elements, providing mid-range logic density for control, protocol handling and glue-logic functions.
• Embedded and Distributed Memory  Total on-chip RAM: 73,728 bits (approximately 72 Kbits), supporting both distributed and block memory usage patterns.
• I/O Flexibility  188 user I/Os in a 256-ball fpBGA package. The LatticeXP sysIO™ buffer supports a wide range of interface standards documented for the family, enabling mixed-signal and multi-voltage I/O designs.
• Non-volatile, Instant-on Configuration  Family-level ispXP™ non-volatile technology provides instant-on behavior and eliminates the need for external configuration memory. Designs can be reconfigured in-system via JTAG or system configuration ports.
• In-field Reconfiguration and Low-Power Modes  Supports rapid reconfiguration and a sleep mode that enables significant static current reduction for power-sensitive applications.
• Clocking and Memory Interfaces  Includes on-chip PLL resources (2 PLLs for the LFXP6 family) and dedicated support for DDR memory interfaces up to DDR333 as specified for the family.
• Power and Mounting  Operates across a supply range of 1.71 V to 3.465 V and is supplied in a surface-mount 256-FPBGA (17×17 mm) package.
• Commercial Temperature Grade  Specified for operation from 0 °C to 85 °C.
• RoHS Compliant  Meets RoHS environmental requirements.

Typical Applications

• Embedded Control and Processing  Mid-density control logic, protocol bridging and algorithm acceleration where ~6,000 logic elements and on-chip RAM suffice.
• Memory Interface and Buffering  Designs requiring DDR interface capability and dedicated memory support can leverage the family’s DDR333 interface support and on-chip RAM.
• Multi‑Standard I/O Gateways  Systems that need flexible, multi-voltage I/O and various signaling standards can use the programmable sysIO buffers and 188 I/Os to bridge interfaces.
• Field‑Updatable Systems  Products that benefit from in-field logic updates and secure, non-volatile configuration without external memory.

Unique Advantages

• Instant-on, Non-volatile Architecture: Eliminates external configuration memory and enables rapid start-up for systems that require immediate availability.
• Balanced Mid-density Resource Set: Combines ~6,000 logic elements with ~73 Kbits of embedded RAM and 188 I/Os for compact system designs without over-allocating resources.
• Flexible I/O and Voltage Range: Programmable I/O buffering and a wide supply voltage window support mixed-voltage designs and a variety of interface standards.
• In-system Reconfiguration: Supports reconfiguration through system ports and JTAG, enabling field updates and iterative development flows.
• Power Management Options: Sleep mode capability for substantial static current reduction helps lower standby power in battery or energy‑sensitive applications.
• Commercial-grade Reliability: Specified for 0 °C to 85 °C operation in a robust 256-ball fpBGA package suitable for surface-mount assembly.

Why Choose LFXP6C-4FN256C?

The LFXP6C-4FN256C delivers a practical balance of logic capacity, on-chip memory and flexible I/O in a compact fpBGA footprint. It is well suited for designers who need non-volatile, instant-on reconfigurability, in-system update capability and a mid-range resource set for embedded, communications or interface-focused designs.

Its combination of approximately 6,000 logic elements, 73,728 bits of embedded RAM, 188 I/Os and family-level features such as sleep mode and DDR interface support makes it a straightforward choice for projects that demand reliable, reconfigurable logic with concise BOM and board area.

Request a quote or submit a purchase inquiry to check availability and pricing for the LFXP6C-4FN256C. Our team can provide lead-time and procurement options to support your design schedule.