LFXP6C-3TN144I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 100 73728 6000 144-LQFP |
|---|---|
| Quantity | 518 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 100 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 720 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of LFXP6C-3TN144I – XP Field Programmable Gate Array (FPGA), 100 I/O, 6000 logic elements, 144-LQFP
The LFXP6C-3TN144I is a Lattice XP family FPGA delivered in a 144-pin LQFP surface-mount package, offering 6,000 logic elements, approximately 73 Kbits of on-chip RAM, and 100 user I/Os. Designed for industrial applications, this non-volatile, reconfigurable device supports instant-on operation and flexible I/O interfacing for embedded control, industrial systems, and communications logic.
Built on the LatticeXP family architecture, the device provides reconfigurable SRAM logic, low-power modes, and system-level features that simplify integration for medium-density FPGA designs requiring industrial temperature range and broad supply flexibility.
Key Features
- Core Logic: 6000 logic elements suitable for moderate-density designs and custom logic integration.
- On-chip Memory: Total RAM bits: 73,728 (approximately 72 Kbits) of embedded memory for buffering, FIFOs, and small data tables.
- I/O and Interfaces: 100 user I/Os provided in the 144-pin LQFP package to support multiple parallel interfaces and peripheral control.
- Non-volatile, Instant-on Architecture: Family-level ispXP non-volatile technology provides instant-on behavior and eliminates the need for external configuration memory.
- Reconfiguration & Security: Supports rapid reconfiguration of SRAM-based logic and family-level features that protect design bitstreams from external readback.
- Low-power Modes: Sleep mode capability in the LatticeXP family allows substantial static current reduction for power-sensitive systems.
- Programmable Clocking: LatticeXP family support for analog PLLs—device-level PLL count aligns with the LFXP6 device class—to enable clock multiply/divide and phase adjustments.
- Power and Temperature: Supply voltage range of 1.71 V to 3.465 V and rated operating temperature from −40 °C to 100 °C for industrial deployments.
- Package & Mounting: Surface-mount 144-LQFP package (supplier package: 144-TQFP, 20 × 20 mm) for compact PCB integration.
- Compliance: RoHS-compliant for environmental and manufacturing compatibility.
Typical Applications
- Industrial Control: Implement custom control logic, protocol translation, and timing-critical functions within industrial equipment operating across −40 °C to 100 °C.
- Embedded Systems: Add configurable peripheral glue logic, state machines, and I/O expansion in embedded controllers with instant-on capability.
- Communications & Interface Bridging: Create protocol bridges, parallel interface controllers, and timing logic using the device’s 100 I/Os and programmable clocking.
- Instrumentation & Test Equipment: Integrate flexible data paths, buffering, and custom measurement logic using on-chip RAM and reconfigurable logic elements.
Unique Advantages
- Instant-on, non-volatile operation: Eliminates external configuration memory and enables rapid system startup.
- Industrial temperature capability: Rated for −40 °C to 100 °C, supporting deployment in harsh or temperature-variable environments.
- Flexible supply range: Operates across a wide supply range (1.71 V–3.465 V), enabling compatibility with common power domains.
- Compact, surface-mount package: 144-LQFP (20 × 20 mm footprint) balances pin count and PCB area for compact designs.
- Reconfigurable in-field: Family-level reconfiguration features allow logic updates without external configuration memory, aiding long-term product flexibility.
- RoHS compliant: Meets environmental directives for lead-free assembly and manufacturing.
Why Choose LFXP6C-3TN144I?
The LFXP6C-3TN144I positions medium-density FPGA capability into a compact, industrial-grade package. With 6,000 logic elements, approximately 73 Kbits of embedded RAM, and 100 I/Os, it delivers a balanced combination of logic, memory, and interfacing for embedded control, communications bridging, and instrumentation applications. The non-volatile, instant-on architecture and family-level reconfiguration features reduce BOM complexity and simplify system startup and updates.
This device is well suited for designers and procurement teams building robust, field-updatable systems that require industrial temperature range, flexible power compatibility, and compact PCB integration. It offers longevity and design flexibility backed by the LatticeXP family feature set.
If you would like a quote or further product information, submit a request for a quote or contact our sales team to discuss availability and lead times.

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Headquarters: Hillsboro, Oregon, USA
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