LFXP6C-3QN208I

The LFXP6C-3QN208I is a Lattice XP family FPGA offered in a 208-pin BFQFP package. It integrates approximately 6,000 logic elements, about 73 Kbits (73,728 bits) of on-chip RAM, and 142 I/O pins in a non-volatile, reconfigurable architecture.

Designed for industrial applications, this device delivers instant-on configuration, in-field reconfiguration capability, flexible I/O support and multi-voltage operation across a wide supply range. Its combination of embedded memory, programmable I/O and industrial temperature rating makes it suitable for control, communications and interface functions in embedded systems.

Key Features

• Core Density — Approximately 6,000 logic elements provide mid-range logic capacity for system glue logic, protocol bridges and custom peripherals.
• Embedded Memory — Total on-chip RAM of 73,728 bits (approximately 72 Kbits) for distributed and block memory usage in data buffering and state storage.
• I/O Flexibility — 142 general-purpose I/O pins support a wide range of interfaces; the LatticeXP family features programmable sysIO buffers for multiple signaling standards.
• Non-Volatile, Instant-On — LatticeXP architecture is non-volatile and powers up instantly without external configuration memory, enabling fast system startup.
• In-Field Reconfiguration — Supports TransFR™ reconfiguration for updating SRAM-based logic while the system operates and JTAG-based programming for system-level updates.
• Low-Power Modes — Sleep mode capability enables large static current reduction for power-sensitive applications.
• Clocking — Integrated PLL resources for clock multiplication, division and phase shifting to support diverse clocking requirements (device family PLL capabilities documented in the datasheet).
• Power and Temperature — Operates from 1.71 V to 3.465 V and is specified for industrial operating temperatures from −40 °C to 100 °C.
• Package and Mounting — Surface-mount 208-BFQFP package (supplier device package: 208-PQFP, 28 × 28 mm) for board-level integration.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Implement motor control interfaces, protocol conversion and custom logic within industrial equipment where extended temperature range and industrial-grade components are required.
• Embedded Communications — Serve as protocol bridges, packet buffering logic or interface controllers leveraging flexible I/O and embedded memory.
• Memory Interface and Buffering — Use internal RAM and PLLs to support external DDR interfaces and timing-sensitive buffering tasks.
• User Interface and Peripheral Hubs — Consolidate multiple peripheral interfaces and control logic into a single FPGA to reduce system BOM and simplify board routing.

Unique Advantages

• Instant-on, Non-Volatile Operation: Eliminates external configuration memory and enables immediate startup without configuration delays.
• In-Field Reconfiguration: TransFR™ capability and JTAG programmability allow updates to logic while the system remains in service, reducing downtime for field upgrades.
• Flexible I/O and Clocking: Programmable I/O buffers and on-chip PLLs enable support for multiple signaling standards and tailored clock domains.
• Industrial Reliability: Rated for −40 °C to 100 °C and supplied in a rugged surface-mount package suitable for industrial environments.
• Compact Integration: Mid-range logic and embedded RAM in a 208-pin package help reduce board-level component count and simplify system design.
• Regulatory-Friendly: RoHS compliance supports environmental and manufacturing requirements.

Why Choose LFXP6C-3QN208I?

The LFXP6C-3QN208I positions itself as a compact, industrial-grade FPGA solution that combines non-volatile instant-on operation, in-field reconfigurability and a flexible I/O fabric. Its approximate 6,000 logic elements, 73,728 bits of on-chip RAM and 142 I/Os make it well suited to designers who need mid-range logic capacity with embedded memory and robust I/O options in a 208-pin package.

For teams building industrial control systems, embedded communications modules or peripheral hubs, this device offers a balance of integration, configurability and environmental tolerance backed by the LatticeXP architecture and tool ecosystem documented in the datasheet.

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