LFXP6C-3Q208I

IC FPGA 142 I/O 208QFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP

Quantity 349 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case208-BFQFPNumber of I/O142Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs720Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of LFXP6C-3Q208I – XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP

The LFXP6C-3Q208I is a non-volatile FPGA in a 208-BFQFP surface-mount package designed for industrial applications. It combines approximately 6,000 logic elements with on-chip memory and flexible I/O to support control, interface and system-level functions across embedded and industrial markets. Key value comes from its instant-on, reconfigurable architecture, wide supply voltage window and extended operating temperature range.

Key Features

  • Logic Capacity — 6000 logic elements provide programmable logic resources for mid-density designs.
  • On-chip Memory — Approximately 72 Kbits (73,728 bits) of embedded RAM for data buffering, state storage and small memory blocks.
  • I/O Count and Flexibility — 142 I/Os in a 208-pin package with a programmable sysIO buffer supporting multiple signaling standards.
  • Non-volatile, Instant-On — Device powers up without external configuration memory and supports instant-on operation and secure configuration.
  • Reconfiguration and In-field Updates — Supports in-system reconfiguration capabilities for updating logic while deployed.
  • Clocking — Up to 2 analog PLLs for clock multiplication, division and phase control.
  • Power and Voltage — Operates across a broad supply range from 1.71 V to 3.465 V to accommodate multiple I/O and core domains.
  • Package and Mounting — 208-BFQFP (28 × 28 mm) surface-mount package suitable for standard PCB assembly processes.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for demanding environments.
  • Standards and System Support — Includes IEEE 1149.1 boundary-scan and internal logic analysis capabilities for debugging and board-level test.
  • Low-Power Mode — Sleep mode enables significant static current reduction for power-sensitive applications.
  • RoHS Compliant — Conforms to RoHS environmental requirements.

Typical Applications

  • Industrial Control — Implement custom control logic, sensor interfacing and deterministic I/O handling within industrial equipment operating across extended temperatures.
  • Interface Bridging — Use the flexible I/O and programmable buffers to implement protocol conversion and interface glue logic between subsystems.
  • Embedded Processing Acceleration — Offload deterministic low-latency tasks or implement state machines and peripheral controllers using on-chip logic and RAM.
  • In-field Updatable Systems — Leverage non-volatile instant-on behavior and reconfiguration features to deploy field updates without external configuration memory.

Unique Advantages

  • Instant-on, Secure Configuration: Non-volatile architecture eliminates the need for external configuration memory and protects bitstreams from interception.
  • Mid-density Integration: 6000 logic elements with ~72 Kbits of embedded RAM provide a balance of logic and memory for control and interface functions while minimizing external components.
  • Flexible I/O and Voltage Support: 142 I/Os and a wide supply range (1.71 V–3.465 V) support mixed-voltage systems and a variety of signaling standards.
  • Industrial Reliability: Rated for −40 °C to 100 °C operation and supplied in a rugged 208-BFQFP package for robust deployment.
  • Onboard System Features: Includes PLLs for clock management and IEEE 1149.1 boundary-scan for testability and easier board bring-up.
  • Power Management: Sleep mode enables large reductions in static current to support energy-conscious designs.

Why Choose LFXP6C-3Q208I?

The LFXP6C-3Q208I positions itself as a compact, non-volatile FPGA option for mid-density embedded and industrial designs that require reliable operation across temperature extremes, flexible I/O and on-chip memory. Its combination of approximately 6,000 logic elements, 142 I/Os and instant-on capability reduces the need for external configuration components and simplifies system architecture.

Designers targeting control, interface bridging, and in-field updatable systems will find the device practical for reducing BOM complexity while retaining reconfigurability, on-board clock management and test support for faster development cycles.

Request a quote or submit an inquiry to get pricing, lead time and availability for the LFXP6C-3Q208I. Our team will respond with the information needed to move your design forward.

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