LFXP6C-3Q208I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP |
|---|---|
| Quantity | 349 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 142 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 720 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of LFXP6C-3Q208I – XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP
The LFXP6C-3Q208I is a non-volatile FPGA in a 208-BFQFP surface-mount package designed for industrial applications. It combines approximately 6,000 logic elements with on-chip memory and flexible I/O to support control, interface and system-level functions across embedded and industrial markets. Key value comes from its instant-on, reconfigurable architecture, wide supply voltage window and extended operating temperature range.
Key Features
- Logic Capacity — 6000 logic elements provide programmable logic resources for mid-density designs.
- On-chip Memory — Approximately 72 Kbits (73,728 bits) of embedded RAM for data buffering, state storage and small memory blocks.
- I/O Count and Flexibility — 142 I/Os in a 208-pin package with a programmable sysIO buffer supporting multiple signaling standards.
- Non-volatile, Instant-On — Device powers up without external configuration memory and supports instant-on operation and secure configuration.
- Reconfiguration and In-field Updates — Supports in-system reconfiguration capabilities for updating logic while deployed.
- Clocking — Up to 2 analog PLLs for clock multiplication, division and phase control.
- Power and Voltage — Operates across a broad supply range from 1.71 V to 3.465 V to accommodate multiple I/O and core domains.
- Package and Mounting — 208-BFQFP (28 × 28 mm) surface-mount package suitable for standard PCB assembly processes.
- Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for demanding environments.
- Standards and System Support — Includes IEEE 1149.1 boundary-scan and internal logic analysis capabilities for debugging and board-level test.
- Low-Power Mode — Sleep mode enables significant static current reduction for power-sensitive applications.
- RoHS Compliant — Conforms to RoHS environmental requirements.
Typical Applications
- Industrial Control — Implement custom control logic, sensor interfacing and deterministic I/O handling within industrial equipment operating across extended temperatures.
- Interface Bridging — Use the flexible I/O and programmable buffers to implement protocol conversion and interface glue logic between subsystems.
- Embedded Processing Acceleration — Offload deterministic low-latency tasks or implement state machines and peripheral controllers using on-chip logic and RAM.
- In-field Updatable Systems — Leverage non-volatile instant-on behavior and reconfiguration features to deploy field updates without external configuration memory.
Unique Advantages
- Instant-on, Secure Configuration: Non-volatile architecture eliminates the need for external configuration memory and protects bitstreams from interception.
- Mid-density Integration: 6000 logic elements with ~72 Kbits of embedded RAM provide a balance of logic and memory for control and interface functions while minimizing external components.
- Flexible I/O and Voltage Support: 142 I/Os and a wide supply range (1.71 V–3.465 V) support mixed-voltage systems and a variety of signaling standards.
- Industrial Reliability: Rated for −40 °C to 100 °C operation and supplied in a rugged 208-BFQFP package for robust deployment.
- Onboard System Features: Includes PLLs for clock management and IEEE 1149.1 boundary-scan for testability and easier board bring-up.
- Power Management: Sleep mode enables large reductions in static current to support energy-conscious designs.
Why Choose LFXP6C-3Q208I?
The LFXP6C-3Q208I positions itself as a compact, non-volatile FPGA option for mid-density embedded and industrial designs that require reliable operation across temperature extremes, flexible I/O and on-chip memory. Its combination of approximately 6,000 logic elements, 142 I/Os and instant-on capability reduces the need for external configuration components and simplifies system architecture.
Designers targeting control, interface bridging, and in-field updatable systems will find the device practical for reducing BOM complexity while retaining reconfigurability, on-board clock management and test support for faster development cycles.
Request a quote or submit an inquiry to get pricing, lead time and availability for the LFXP6C-3Q208I. Our team will respond with the information needed to move your design forward.

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