LFXP6C-3QN208C

The LFXP6C-3QN208C is a LatticeXP family FPGA offered in a 208-BFQFP surface-mount package. It delivers a mid-range programmable logic solution with 6,000 logic elements and approximately 72 Kbits of embedded memory, making it suitable for commercial embedded systems and communications designs that require reconfigurable logic and flexible I/O.

Built on the LatticeXP architecture, the device combines non-volatile instant-on configuration, in-field reconfiguration capabilities, and programmable I/O to support system designs that need rapid startup, secure configuration, and a range of voltage and interface options.

Key Features

• Logic Capacity — 6,000 logic elements provide a balanced resource set for mid-density designs and IP integration.
• On-chip Memory — Approximately 72 Kbits (73,728 bits) of embedded RAM for distributed and block memory requirements.
• I/O Density & Package — 142 user I/Os in a 208-BFQFP (28 × 28 mm) package; surface mount mounting type suitable for standard PCB assembly.
• Non-volatile, Instant-on Architecture — ispXP™-based non-volatile configuration enables instant-on operation without external configuration memory and secures designs from external bitstream read-back.
• In-field Reconfiguration (TransFR) — Supports reconfiguration of SRAM-based logic while the system operates for rapid updates in the field.
• Power and Voltage Flexibility — Supports supply voltages from 1.71 V to 3.465 V to accommodate multiple I/O and core voltage domains.
• Low-power Modes — Sleep mode capability that can reduce static current significantly for power-sensitive applications.
• Clocking — Family-level sysCLOCK PLL support; LFXP6 devices include 2 PLLs for clock multiply/divide and phase shifting.
• Flexible I/O Standards — Programmable I/O buffer support for a wide range of standards including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS, LVPECL and more (per LatticeXP family specification).
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature and RoHS compliant.

Typical Applications

• Consumer and Embedded Devices — Implement user interfaces, bridging logic, and peripheral management using the device’s moderate logic and I/O count.
• Communications Equipment — Provide protocol adaptation, packet handling, or custom interfacing leveraging flexible I/O standards and on-chip memory.
• Prototyping and OEM Integration — Rapid evaluation and iterative development using in-field reconfiguration and instant-on operation to reduce system bring-up time.
• Display and Video Peripherals — Drive custom timing, buffering, and format conversion tasks using embedded memory and programmable I/O.

Unique Advantages

• Instant-on, Non-volatile Configuration: Eliminates the need for external configuration memory and reduces system complexity at power-up.
• Field Reconfigurability: TransFR capability allows targeted logic updates while the system remains operational, minimizing downtime for in-field changes.
• Flexible I/O and Voltage Support: Broad I/O standard support and a wide supply voltage window (1.71–3.465 V) simplify integration with diverse peripherals and power architectures.
• Balanced Resource Set: 6,000 logic elements and ~72 Kbits of embedded RAM deliver a cost-effective trade-off between capacity and board-level footprint for mid-density designs.
• Compact, Surface-Mount Package: 208-BFQFP (28 × 28 mm) provides high I/O density in a manufacturable surface-mount form factor compliant with RoHS requirements.

Why Choose LFXP6C-3QN208C?

The LFXP6C-3QN208C targets designers who need a mid-density, non-volatile FPGA that combines instant-on behavior, field reconfiguration, and a flexible I/O feature set in a compact surface-mount package. Its 6,000 logic elements, ~72 Kbits of embedded RAM and 142 I/Os make it well suited for commercial embedded systems, communications peripherals, and OEM devices requiring secure, reconfigurable logic with controlled power and voltage options.

Backed by the LatticeXP family architecture and ecosystem, the device offers a clear upgrade path within the family and practical system-level capabilities such as programmable I/O standards and PLL-based clocking, helping streamline design integration and long-term product scalability.

Request a quote or submit a sales inquiry to discuss availability, lead times, and volume pricing for the LFXP6C-3QN208C. Our team can provide detailed ordering information and support for your project requirements.