LFXP6C-3FN256C

The LFXP6C-3FN256C is a non-volatile LatticeXP field programmable gate array (FPGA) packaged in a 256‑ball fpBGA (17 × 17 mm). It provides approximately 6000 logic elements and roughly 72 Kbits of on-chip RAM, combined with a flexible I/O count of 188 and multi‑voltage support for system-level integration.

Designed for cost-effective system designs and embedded applications, the device emphasizes instant-on operation, in-field reconfiguration capabilities, and compact board-level integration through its surface-mount 256‑BGA package.

Key Features

• Non‑volatile, instant‑on architecture — On-chip non‑volatile configuration enables power-up in microseconds and removes the need for external configuration memory.
• Reconfiguration and security — Supports in-field reprogramming and design security with no external bitstream exposure.
• Logic capacity — Approximately 6000 logic elements for mid-density designs and custom logic implementation.
• Embedded memory — Approximately 72 Kbits of on-chip RAM for distributed and block memory use in embedded functions.
• Flexible I/O and voltage support — 188 I/O pins with device operation across a broad supply range of 1.71 V to 3.465 V to support mixed-signal interfaces and multiple I/O standards.
• Clocking and timing — Family-level support includes analog PLLs for multiply/divide and phase shifting (as detailed in the LatticeXP family datasheet).
• Low-power modes — Sleep-mode capability for substantial static current reduction (family-level feature provided in the LatticeXP data sheet).
• Package and mounting — 256‑BGA (256‑FPBGA, 17 × 17 mm) surface-mount package suited for compact board designs.
• Commercial temperature grade — Rated for 0 °C to 85 °C operation and RoHS compliant.

Typical Applications

• Embedded systems — Implements custom control logic, protocol bridging, and peripheral interfaces using the device’s logic elements and on-chip RAM.
• Secure, instant-on devices — Non-volatile configuration and no external bitstream storage provide an architecture suited to applications that require rapid startup and design protection.
• Memory-interface designs — On-chip RAM and family-level DDR support options make the device applicable for designs requiring local buffering and memory control.
• Low-power and battery‑sensitive equipment — Sleep-mode capability enables reduced static current for power-conscious applications.

Unique Advantages

• Instant-on operation: Eliminates external configuration memory and enables fast system startup.
• Integrated memory and logic: Approximately 72 Kbits of embedded RAM with ~6000 logic elements reduces external component count and simplifies board design.
• Flexible I/O and voltage range: 188 I/Os and support from 1.71 V to 3.465 V allow straightforward integration with multiple I/O standards and supply domains.
• Compact package: 256‑ball fpBGA (17 × 17 mm) allows high I/O density in space-constrained applications.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product deployments.

Why Choose LFXP6C-3FN256C?

The LFXP6C-3FN256C delivers a mid-density FPGA solution that balances logic capacity, embedded memory, and extensive I/O within a compact 256‑BGA package. Its non-volatile architecture and family-level features such as instant-on operation, reconfiguration, and low-power sleep mode make it well suited to embedded and system-level designs that require rapid startup, design security, and flexible integration.

This device is ideal for design teams seeking a commercial-grade FPGA with approximately 6000 logic elements, around 72 Kbits of on-chip RAM, and 188 I/Os—offering a scalable option within the LatticeXP family for cost-conscious, space-constrained applications.

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