LFXP6C-3F256C

The LFXP6C-3F256C is a non-volatile LatticeXP family FPGA delivering 6,000 logic elements and 73,728 bits of on-chip RAM in a compact 256-ball fpBGA (17×17 mm) package. Designed for commercial-grade embedded applications, it integrates programmable logic, flexible I/O and on-chip memory to accelerate system integration and reduce external component count.

Key value propositions include instant-on non-volatile configuration, in-field reconfiguration capability, and a wide I/O count (188) suitable for dense interface requirements in consumer and communications products.

Key Features

• Core Architecture Non-volatile, infinitely reconfigurable LatticeXP family FPGA architecture that supports instant-on operation and in-field reconfiguration.
• Logic Capacity 6,000 logic elements (cells) and 720 logic block resources for implementing medium-complexity designs.
• Embedded Memory 73,728 bits of on-chip RAM (embedded and distributed memory resources) to support buffering, FIFOs and small data stores without external memory.
• I/O and Packaging 188 user I/Os in a 256-ball fpBGA (17×17 mm) surface-mount package for high pin-count interface integration.
• Power and Operating Range Voltage supply range 1.71 V to 3.465 V and commercial operating temperature 0 °C to 85 °C; RoHS compliant.
• Reconfiguration & Power Modes Instant-on non-volatile configuration with sleep mode capability for significant static current reduction and TransFR™ Reconfiguration for updating logic in-field.
• Clocking and Timing Device-level PLL support (LFXP6 family) to enable clock multiplication, division and phase shifting for flexible timing domains.
• System Diagnostics & Debug Family-level support for IEEE 1149.1 boundary scan and internal logic analysis features to aid board bring-up and debug.

Typical Applications

• Embedded Consumer Electronics — Implement custom control logic, peripheral aggregation and user-interface handling while minimizing external components.
• Communications & Networking — Bridge multiple interfaces and implement protocol translation using the device’s 188 I/Os and on-chip memory resources.
• Test & Measurement — Create custom data-capture, preprocessing and control logic leveraging the FPGA’s reconfiguration and internal RAM.
• Prototyping & Development Platforms — Use instant-on, non-volatile configuration and in-field reconfiguration to iterate firmware/hardware designs quickly.

Unique Advantages

• Non-volatile instant-on deployment: Eliminates external configuration memory and enables fast power-up behavior for systems that require immediate availability.
• In-field reconfiguration: TransFR™ capability allows logic updates while the system remains operational, simplifying feature upgrades and fixes.
• High I/O density in a compact package: 188 user I/Os in a 17×17 mm 256-ball fpBGA package reduce PCB area while supporting rich peripheral connectivity.
• On-chip RAM for system integration: 73,728 bits of embedded memory lower external memory needs for buffering and local data storage.
• Power flexibility: Broad supply voltage support (1.71 V–3.465 V) and a sleep mode for static current reduction help adapt designs to different power budgets.

Why Choose LFXP6C-3F256C?

The LFXP6C-3F256C balances programmable logic capacity, embedded memory and a high I/O count in a compact, RoHS-compliant fpBGA package tailored for commercial embedded designs. Its non-volatile architecture and in-field reconfiguration options reduce BOM complexity and streamline maintenance and field updates.

This device is well suited to designers who need a medium-density FPGA with instant-on behavior, flexible interfacing and on-chip memory to consolidate functions and accelerate time to market while maintaining commercial-temperature operation.

Request a quote or submit an RFQ to receive pricing and availability details for the LFXP6C-3F256C.