LFXP3E-5T144C

The LFXP3E-5T144C is a non-volatile LatticeXP family FPGA in a 144-pin LQFP surface-mount package. It integrates approximately 3,000 logic elements with 55,296 bits of on-chip RAM and supports up to 100 I/O pins, making it suitable for compact, reconfigurable system designs that require instant-on and in-field programmability.

This commercial-grade device operates from a core supply range of 1.14 V to 1.26 V and is specified for 0 °C to 85 °C. It is RoHS compliant and packaged in a 144-TQFP (20 × 20 mm) form factor for easy PCB integration.

Key Features

• Logic Capacity  Approximately 3,000 logic elements for implementing glue logic, state machines, and medium-complexity custom logic functions.
• Embedded Memory  Approximately 54 Kbits (55,296 bits) of on-chip RAM for FIFOs, small buffers, and distributed memory needs.
• I/O and Packaging  Up to 100 user I/Os in a 144-LQFP (144-TQFP, 20 × 20 mm) surface-mount package for compact board-level designs.
• Power and Temperature  Core voltage supply range of 1.14 V to 1.26 V and commercial operating temperature range of 0 °C to 85 °C.
• Non-volatile, Reconfigurable Architecture  LatticeXP family architecture provides instant-on, non-volatile configuration and the ability to reconfigure logic in-field.
• System Support and Integration  Family-level features include PLL-based clock management, flexible I/O buffer support for multiple interface standards, and IEEE 1149.1 boundary-scan for board-level testability.
• Low-power Modes  Family features include sleep mode capability for significant static current reduction when low power is required.
• Compliance  RoHS compliant for streamlined regulatory acceptance in commercial products.

Typical Applications

• Embedded control and glue logic  Use the LFXP3E-5T144C to implement custom control logic, peripheral bridging, and protocol adaptation in compact systems.
• In-field reconfigurable systems  Non-volatile, instant-on capability supports designs that require fast startup and the option to update logic in the field.
• Interface and buffering  On-chip RAM and flexible I/O make this device suitable for buffering, small FIFO implementations, and managing peripheral interfaces.

Unique Advantages

• Instant-on non-volatile configuration:  Eliminates the need for external configuration memory and enables immediate availability after power-up.
• Compact, board-friendly package:  144-LQFP (20 × 20 mm) surface-mount package allows high I/O count in a small footprint for dense PCB layouts.
• Balanced logic and memory:  Combines ~3,000 logic elements with ~54 Kbits of embedded RAM to support a wide range of mid-range logic and buffering tasks without external memory.
• Designed for testability:  Boundary-scan support simplifies board-level validation and manufacturing test flows.
• Commercial temperature and RoHS compliance:  Specified 0 °C to 85 °C operation and RoHS compliance align with many commercial product requirements.

Why Choose LFXP3E-5T144C?

The LFXP3E-5T144C delivers a practical combination of programmable logic, embedded memory, and flexible I/O in a compact 144-pin package. Its non-volatile, instantly configurable architecture and in-field reconfiguration capability are ideal for compact systems that demand fast startup and easy updates without external configuration components.

This device is well-suited for designers and teams building commercial embedded systems who need a mid-density FPGA with on-chip memory, test support, and a compact surface-mount package. Its balance of integration and board-level friendliness supports scalable designs and efficient BOM management.

Request a quote or submit a product inquiry to receive pricing, availability, and lead-time information for the LFXP3E-5T144C.