LFXP3E-5T100C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 62 55296 3000 100-LQFP |
|---|---|
| Quantity | 1,168 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-LQFP | Number of I/O | 62 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of LFXP3E-5T100C – LatticeXP Non-Volatile FPGA, 3,000 Logic Elements, 62 I/Os, 100‑LQFP
The LFXP3E-5T100C is a non-volatile LatticeXP family FPGA in a 100‑pin LQFP package designed for commercial embedded systems. It combines approximately 55 Kbits of on-chip RAM with 3,000 logic elements and 62 general‑purpose I/Os to deliver instant-on, reconfigurable logic for a wide range of commercial applications.
Built for fast startup, in-field updates and flexible interfacing, the device targets applications that benefit from non‑volatile configuration, low standby power and integrated memory and I/O resources.
Key Features
- Core Logic 3,000 logic elements (cells) and 384 programmable function units provide the core programmable resources for custom logic and glue‑logic implementations.
- Embedded Memory Total on-chip RAM of 55,296 bits (approximately 55 Kbits) for distributed and block memory use within designs.
- I/O and Interface Flexibility 62 I/O pins in the 100‑LQFP package enable a wide variety of peripheral and bus connections. The LatticeXP family supports programmable sysIO buffer standards as described in the family datasheet.
- Non‑volatile, Instant‑on Configuration ispXP technology provides non‑volatile configuration with instant‑on startup in microseconds and eliminates the need for external configuration memory.
- In‑field Reconfiguration & Security TransFR™ reconfiguration and support for reprogramming through system configuration and JTAG allow in‑field logic updates; non‑volatile configuration secures designs by not exposing a readback bitstream.
- Low Power Modes Sleep mode capability enables significant static current reduction for power‑sensitive systems.
- Clocking and System Support Family documentation describes sysCLOCK PLLs for frequency multiply/divide and phase shifting; LFXP3 family devices include PLL resources suitable for typical clocking needs.
- Package and Supply Surface‑mount 100‑LQFP (100‑TQFP, 14 × 14 mm) with a specified supply voltage range of 1.14 V to 1.26 V and operating temperature 0 °C to 85 °C (commercial grade).
- Standards and Test System‑level support in the family includes IEEE 1149.1 boundary scan and internal debug capability as described in the datasheet.
- Compliance RoHS compliant.
Typical Applications
- Embedded Control Rapid boot and reconfigurable logic make the part suitable for commercial embedded controllers, human‑machine interfaces and system glue logic.
- Field‑Updatable Systems In‑field reconfiguration (TransFR) supports deployed systems that require remote or in‑system logic updates without external configuration memory.
- Interface Bridging and IP Integration The combination of flexible I/O and on‑chip memory is useful for protocol bridging, custom peripheral interfaces and integrating pre‑designed IP cores.
- Low‑Power Commercial Products Sleep mode and non‑volatile configuration support compact commercial designs where reduced standby current and fast resume are important.
Unique Advantages
- Non‑volatile Instant‑on: Powers up in microseconds with no external configuration memory required, simplifying system boot and reducing BOM complexity.
- Field Reconfiguration: TransFR and JTAG/system configuration paths enable in‑field logic updates and quick design iterations without hardware replacement.
- Integrated Memory and Logic: Approximately 55 Kbits of on‑chip RAM alongside 3,000 logic elements provide compact, integrated resources for many control and interface tasks.
- Flexible I/O in Small Package: 62 I/Os in a 100‑pin LQFP (14 × 14 mm) package offers a balance of pin count and compact board footprint for space‑constrained commercial designs.
- Low Standby Power: Sleep mode capability offers substantial static current reduction for energy‑sensitive applications.
- Ecosystem Support: Family documentation and available design tools and IP cores described in the datasheet accelerate development and reduce time to market.
Why Choose LFXP3E-5T100C?
The LFXP3E-5T100C delivers a practical combination of non‑volatile instant‑on configuration, on‑chip memory and a compact 100‑LQFP package tailored for commercial embedded designs. Its reconfiguration capabilities and system support features make it well suited for products that require fast boot, in‑field upgrades and flexible interfacing without external configuration devices.
This device is a fit for engineers seeking a commercially graded FPGA with integrated memory and a balance of I/O and logic capacity, backed by the LatticeXP family design resources and documented system features in the datasheet.
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