LFXP3E-5QN208C

IC FPGA 136 I/O 208QFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 136 55296 3000 208-BFQFP

Quantity 165 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O136Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells3000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of LFXP3E-5QN208C – XP Field Programmable Gate Array (FPGA) in 208-PQFP

The LFXP3E-5QN208C is a non-volatile FPGA offering approximately 3,000 logic elements and integrated on-chip memory in a 208-pin PQFP (28 × 28 mm) surface-mount package. Designed for commercial embedded and interface applications, this device combines instant-on reconfigurability, flexible I/O capability and compact packaging to support space-conscious system designs.

With 136 available I/Os, dedicated clocking resources and on-chip memory, the LFXP3E-5QN208C provides a balanced platform for control, interface bridging and memory-interface tasks where board-level integration and reprogrammability are priorities.

Key Features

  • Core Logic  Approximately 3,000 logic elements for implementing combinational and sequential logic in compact FPGA designs.
  • Embedded and Distributed Memory  Total on-chip RAM of 55,296 bits (approximately 55 Kbits) with family support for distributed and block RAM resources to store state and buffers on-chip.
  • I/O Capacity & Packaging  136 I/O pins delivered in a 208-pin PQFP (28 × 28 mm) surface-mount package, suitable for dense signal connectivity in a compact footprint.
  • Clocking  Device-level PLL resources (as provided by the LatticeXP family) enable clock multiply/divide and phase shifting for flexible timing architectures.
  • Non-volatile, Instant-on Architecture  Family features include non-volatile configuration with instant-on capability and reconfigurability without external configuration memory.
  • In-field Reconfiguration  Supports system reconfiguration capabilities (family TransFR™ feature) enabling logic updates while a system is operating.
  • Low-power Modes  Family sleep-mode support to reduce static current significantly during low-activity states.
  • Supply and Operating Range  Core supply specified 1.14 V to 1.26 V; commercial operating temperature range 0 °C to 85 °C.
  • Standards & Interfaces  Family-level programmable I/O buffer support for a wide range of interfaces used in commercial systems, enabling flexible voltage and signaling options.
  • RoHS Compliance  Device is RoHS compliant for environmental and regulatory alignment.

Typical Applications

  • Commercial Embedded Systems  Use as a programmable logic hub for sensor aggregation, control logic and user-interface handling in consumer and commercial products.
  • Interface Bridging & Protocol Conversion  Leverage flexible I/O and plentiful I/O count for bridging between differing serial/parallel interfaces and signal standards.
  • Memory Interface Support  On-chip memory and family DDR/support features make the device suitable for designs that require local buffering or dedicated memory interfacing.
  • Prototyping and In-field Updates  Non-volatile instant-on behavior and reconfiguration capability enable rapid development cycles and field updates without external configuration memory.

Unique Advantages

  • Instant-on, non-volatile operation: No external configuration memory required, enabling fast power-up and simplified system boot.
  • Compact, high-density I/O in PQFP: 136 I/Os in a 208-pin PQFP package reduce board area while maintaining rich connectivity.
  • Integrated memory resources: Approximately 55 Kbits of on-chip RAM plus distributed RAM support reduces the need for external buffering and simplifies BOM.
  • Field reprogrammability: In-field reconfiguration capability allows logic updates during operation, supporting iterative development and feature upgrades.
  • Power management: Family sleep-mode support enables substantial static current reductions for improved energy efficiency in intermittent-use applications.
  • Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial deployments.

Why Choose LFXP3E-5QN208C?

The LFXP3E-5QN208C positions itself as a compact, reconfigurable platform for commercial embedded designs that require a blend of logic capacity, on-chip memory and flexible I/O connectivity in a 208-pin PQFP package. Its non-volatile instant-on architecture and in-field reconfiguration capabilities help accelerate development cycles and reduce system complexity by eliminating external configuration memory.

Engineers targeting interface-rich, space-constrained applications will find the LFXP3E-5QN208C provides a practical balance of logic, embedded RAM and I/O density while offering power-saving modes and commercial-grade operating range to meet typical product lifecycles.

Request a quote or submit a pricing inquiry to evaluate the LFXP3E-5QN208C for your next commercial embedded or interface application.

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