LFXP3E-5QN208C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 136 55296 3000 208-BFQFP |
|---|---|
| Quantity | 165 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 136 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of LFXP3E-5QN208C – XP Field Programmable Gate Array (FPGA) in 208-PQFP
The LFXP3E-5QN208C is a non-volatile FPGA offering approximately 3,000 logic elements and integrated on-chip memory in a 208-pin PQFP (28 × 28 mm) surface-mount package. Designed for commercial embedded and interface applications, this device combines instant-on reconfigurability, flexible I/O capability and compact packaging to support space-conscious system designs.
With 136 available I/Os, dedicated clocking resources and on-chip memory, the LFXP3E-5QN208C provides a balanced platform for control, interface bridging and memory-interface tasks where board-level integration and reprogrammability are priorities.
Key Features
- Core Logic Approximately 3,000 logic elements for implementing combinational and sequential logic in compact FPGA designs.
- Embedded and Distributed Memory Total on-chip RAM of 55,296 bits (approximately 55 Kbits) with family support for distributed and block RAM resources to store state and buffers on-chip.
- I/O Capacity & Packaging 136 I/O pins delivered in a 208-pin PQFP (28 × 28 mm) surface-mount package, suitable for dense signal connectivity in a compact footprint.
- Clocking Device-level PLL resources (as provided by the LatticeXP family) enable clock multiply/divide and phase shifting for flexible timing architectures.
- Non-volatile, Instant-on Architecture Family features include non-volatile configuration with instant-on capability and reconfigurability without external configuration memory.
- In-field Reconfiguration Supports system reconfiguration capabilities (family TransFR™ feature) enabling logic updates while a system is operating.
- Low-power Modes Family sleep-mode support to reduce static current significantly during low-activity states.
- Supply and Operating Range Core supply specified 1.14 V to 1.26 V; commercial operating temperature range 0 °C to 85 °C.
- Standards & Interfaces Family-level programmable I/O buffer support for a wide range of interfaces used in commercial systems, enabling flexible voltage and signaling options.
- RoHS Compliance Device is RoHS compliant for environmental and regulatory alignment.
Typical Applications
- Commercial Embedded Systems Use as a programmable logic hub for sensor aggregation, control logic and user-interface handling in consumer and commercial products.
- Interface Bridging & Protocol Conversion Leverage flexible I/O and plentiful I/O count for bridging between differing serial/parallel interfaces and signal standards.
- Memory Interface Support On-chip memory and family DDR/support features make the device suitable for designs that require local buffering or dedicated memory interfacing.
- Prototyping and In-field Updates Non-volatile instant-on behavior and reconfiguration capability enable rapid development cycles and field updates without external configuration memory.
Unique Advantages
- Instant-on, non-volatile operation: No external configuration memory required, enabling fast power-up and simplified system boot.
- Compact, high-density I/O in PQFP: 136 I/Os in a 208-pin PQFP package reduce board area while maintaining rich connectivity.
- Integrated memory resources: Approximately 55 Kbits of on-chip RAM plus distributed RAM support reduces the need for external buffering and simplifies BOM.
- Field reprogrammability: In-field reconfiguration capability allows logic updates during operation, supporting iterative development and feature upgrades.
- Power management: Family sleep-mode support enables substantial static current reductions for improved energy efficiency in intermittent-use applications.
- Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial deployments.
Why Choose LFXP3E-5QN208C?
The LFXP3E-5QN208C positions itself as a compact, reconfigurable platform for commercial embedded designs that require a blend of logic capacity, on-chip memory and flexible I/O connectivity in a 208-pin PQFP package. Its non-volatile instant-on architecture and in-field reconfiguration capabilities help accelerate development cycles and reduce system complexity by eliminating external configuration memory.
Engineers targeting interface-rich, space-constrained applications will find the LFXP3E-5QN208C provides a practical balance of logic, embedded RAM and I/O density while offering power-saving modes and commercial-grade operating range to meet typical product lifecycles.
Request a quote or submit a pricing inquiry to evaluate the LFXP3E-5QN208C for your next commercial embedded or interface application.