LFXP3E-5Q208C

IC FPGA 136 I/O 208QFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 136 55296 3000 208-BFQFP

Quantity 572 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O136Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells3000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of LFXP3E-5Q208C – XP Field Programmable Gate Array (FPGA) IC, 136 I/O, ~55 Kbit RAM

The LFXP3E-5Q208C is a non-volatile LatticeXP family FPGA offering 3,000 logic elements, 136 user I/Os and approximately 55,296 bits of on‑chip RAM in a 208‑pin BFQFP (28 × 28 mm) package. Designed for commercial‑grade applications, the device provides instant‑on, infinitely reconfigurable FPGA capability without requiring external configuration memory.

Its architecture combines reconfigurable logic, embedded memory and flexible I/O options with system features such as on‑chip PLLs and in‑field reconfiguration, making it suitable for interface bridging, embedded control and memory‑attached designs that require quick boot and secure configuration.

Key Features

  • Core Logic  Approximately 3,000 logic elements enable small to medium complexity FPGA designs and custom logic implementation.
  • On‑chip Memory  Total on‑chip RAM of 55,296 bits (approximately 55 Kbits) supports embedded data buffering and small block storage needs without external RAM.
  • I/O Density  136 user I/Os in the 208‑BFQFP package support a wide variety of external interfaces and peripherals.
  • Non‑volatile, Instant‑on Configuration  Device powers up in microseconds and does not require external configuration memory, simplifying BOM and boot behavior.
  • Reconfiguration and Sleep  Supports in‑field reconfiguration and a sleep mode that reduces static current for low‑power idle states.
  • Clocking  Includes up to 2 sysCLOCK PLLs for clock multiply/divide and phase shifting to support flexible timing architectures.
  • Flexible I/O Standards (Family)  LatticeXP family I/O buffer architecture supports a wide range of signaling standards for adaptable interfacing (as described in family documentation).
  • Power Supply  Specified core voltage range of 1.14 V to 1.26 V for the device core.
  • Package & Mounting  208‑pin BFQFP (28 × 28 mm) surface‑mount package; supplier device package listed as 208‑PQFP (28×28).
  • Commercial Temperature Grade  Operating temperature range 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • Embedded Control & Interface  Implement custom control logic, protocol bridging and peripheral interfaces where compact FPGA resources and numerous I/Os are required.
  • Memory Interface and Buffering  On‑chip RAM and PLL resources support timing and buffering tasks for memory controllers and data path staging.
  • In‑field Reconfigurable Systems  Non‑volatile architecture and reconfiguration features enable field updates and logic changes without external configuration flash.
  • Prototyping and Development  Compact package and moderate logic density make the device suitable for board‑level prototypes and early product development.

Unique Advantages

  • Non‑volatile instant‑on operation: Eliminates the need for external configuration memory and enables very fast device startup.
  • Reduced system BOM: Integrated configuration and on‑chip memory lower component count and simplify board design.
  • Flexible interfacing: 136 I/Os provided in the 208‑pin package support a range of external peripherals and signal standards (per LatticeXP family I/O options).
  • Field reconfiguration: In‑system reconfiguration allows updating logic while deployed, supporting iterative feature upgrades.
  • Design tool and IP support (family): LatticeXP family devices are supported by the vendor’s design tools and pre‑designed IP modules to speed development.
  • Commercial reliability and compliance: Operates across a 0 °C to 85 °C range and is RoHS compliant for standard commercial applications.

Why Choose LFXP3E-5Q208C?

The LFXP3E-5Q208C delivers a compact, non‑volatile FPGA solution for commercial embedded designs that require reconfigurable logic, moderate on‑chip memory and a high density of I/Os in a 208‑pin PQFP package. Its instant‑on behavior and in‑field reconfiguration capabilities reduce system complexity and enable rapid updates without external configuration components.

This device is well suited to designers building interface logic, memory‑attached functions and control subsystems who need a balance of integration, reconfigurability and predictable operating conditions backed by the LatticeXP family toolchain and IP ecosystem.

Request a quote or submit a parts inquiry to receive pricing and availability for the LFXP3E-5Q208C.

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