LFXP3E-4TN144C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 100 55296 3000 144-LQFP |
|---|---|
| Quantity | 855 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 100 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of LFXP3E-4TN144C – XP Field Programmable Gate Array (FPGA), 100 I/O, ~55 Kbits RAM, 3,000 logic elements, 144-LQFP
The LFXP3E-4TN144C is a non-volatile LatticeXP family FPGA in a 144-pin LQFP (20 × 20 mm) package optimized for commercial applications. It integrates approximately 3,000 logic elements and 55,296 bits of on-chip RAM with 100 I/O pins, delivering a compact, reconfigurable platform for control, interface and embedded logic tasks.
Designed for instant-on operation and in-field reconfiguration, this surface-mount device is suited to systems that require secure, fast start-up and flexible logic updates while operating within a 0 °C to 85 °C commercial temperature range and a supply window of 1.14 V to 1.26 V.
Key Features
- Core Logic Approximately 3,000 logic elements and 384 logic blocks provide the programmable fabric for custom logic and glue-code integration.
- On-chip Memory Total of 55,296 bits of embedded RAM for distributed and block memory needs in control, buffering and state-machine applications.
- I/O and Package 100 user I/Os in a 144-LQFP (20 × 20 mm) supplier package; surface-mount mounting for standard PCB assembly.
- Non-volatile, Instant-on Architecture ispXP non-volatile technology enables instant-on operation without external configuration memory and supports secure, reconfigurable designs.
- Reconfiguration and In-field Update TransFR™ reconfiguration and JTAG/system configuration ports allow in-field logic updates and system configuration changes.
- Low-power Modes Sleep mode capability provides significant static current reduction for energy-efficient standby operation.
- Clocking Family architecture provides analog PLL resources for clock multiply/divide and phase shifting (LFXP3 family includes up to 2 PLLs).
- Programmable I/O Standards Flexible I/O buffer architecture supports a broad set of interface standards as defined by the LatticeXP family, enabling compatibility with diverse signaling requirements.
- Commercial Grade Specified for commercial temperature operation from 0 °C to 85 °C and RoHS compliant.
Typical Applications
- Embedded Control Custom control logic and glue functionality for consumer and commercial products where compact, reconfigurable logic is required.
- Interface Bridging Protocol adaptation and I/O expansion leveraging programmable I/O standards and 100 available I/Os.
- In-field Updatable Systems Products that benefit from field reconfiguration or feature upgrades using JTAG and TransFR™ reconfiguration methods.
- Low-power Standby Devices Applications that require deep sleep/static current reduction for energy savings during idle periods.
Unique Advantages
- Non-volatile, instant-on operation: Eliminates the need for external configuration memory and enables rapid start-up.
- Compact, high-density integration: ~3,000 logic elements and ~55 Kbits of on-chip RAM in a 144-LQFP package reduce board area and BOM complexity.
- Flexible reconfiguration: In-field TransFR™ updates and programmable system/JTAG configuration allow design iteration and upgrades post-deployment.
- Broad I/O capability: 100 I/Os with programmable buffer standards support a wide variety of interface needs without additional interface chips.
- Power management: Sleep mode enables substantial reductions in static current for lower standby power consumption.
- RoHS compliant: Meets environmental requirements for lead-free assembly and regulatory compliance in commercial products.
Why Choose LFXP3E-4TN144C?
The LFXP3E-4TN144C positions itself as a compact, reconfigurable FPGA solution for commercial designs that need instant-on behavior, secure non-volatile configuration, and in-field reprogramming. With roughly 3,000 logic elements, approximately 55 Kbits of embedded RAM, and 100 I/Os in a 144-LQFP package, it suits designers looking to integrate control, interface and glue logic while keeping PCB area and part count low.
Its sleep-mode power reduction, flexible I/O standards, and onboard reconfiguration options offer lifecycle flexibility for products that will evolve after deployment. The device is appropriate for development teams and procurement looking for a commercially graded, RoHS-compliant FPGA with a clear, verifiable specification set.
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