LFXP3E-4TN144C

IC FPGA 100 I/O 144TQFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 100 55296 3000 144-LQFP

Quantity 855 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O100Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells3000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of LFXP3E-4TN144C – XP Field Programmable Gate Array (FPGA), 100 I/O, ~55 Kbits RAM, 3,000 logic elements, 144-LQFP

The LFXP3E-4TN144C is a non-volatile LatticeXP family FPGA in a 144-pin LQFP (20 × 20 mm) package optimized for commercial applications. It integrates approximately 3,000 logic elements and 55,296 bits of on-chip RAM with 100 I/O pins, delivering a compact, reconfigurable platform for control, interface and embedded logic tasks.

Designed for instant-on operation and in-field reconfiguration, this surface-mount device is suited to systems that require secure, fast start-up and flexible logic updates while operating within a 0 °C to 85 °C commercial temperature range and a supply window of 1.14 V to 1.26 V.

Key Features

  • Core Logic  Approximately 3,000 logic elements and 384 logic blocks provide the programmable fabric for custom logic and glue-code integration.
  • On-chip Memory  Total of 55,296 bits of embedded RAM for distributed and block memory needs in control, buffering and state-machine applications.
  • I/O and Package  100 user I/Os in a 144-LQFP (20 × 20 mm) supplier package; surface-mount mounting for standard PCB assembly.
  • Non-volatile, Instant-on Architecture  ispXP non-volatile technology enables instant-on operation without external configuration memory and supports secure, reconfigurable designs.
  • Reconfiguration and In-field Update  TransFR™ reconfiguration and JTAG/system configuration ports allow in-field logic updates and system configuration changes.
  • Low-power Modes  Sleep mode capability provides significant static current reduction for energy-efficient standby operation.
  • Clocking  Family architecture provides analog PLL resources for clock multiply/divide and phase shifting (LFXP3 family includes up to 2 PLLs).
  • Programmable I/O Standards  Flexible I/O buffer architecture supports a broad set of interface standards as defined by the LatticeXP family, enabling compatibility with diverse signaling requirements.
  • Commercial Grade  Specified for commercial temperature operation from 0 °C to 85 °C and RoHS compliant.

Typical Applications

  • Embedded Control  Custom control logic and glue functionality for consumer and commercial products where compact, reconfigurable logic is required.
  • Interface Bridging  Protocol adaptation and I/O expansion leveraging programmable I/O standards and 100 available I/Os.
  • In-field Updatable Systems  Products that benefit from field reconfiguration or feature upgrades using JTAG and TransFR™ reconfiguration methods.
  • Low-power Standby Devices  Applications that require deep sleep/static current reduction for energy savings during idle periods.

Unique Advantages

  • Non-volatile, instant-on operation: Eliminates the need for external configuration memory and enables rapid start-up.
  • Compact, high-density integration: ~3,000 logic elements and ~55 Kbits of on-chip RAM in a 144-LQFP package reduce board area and BOM complexity.
  • Flexible reconfiguration: In-field TransFR™ updates and programmable system/JTAG configuration allow design iteration and upgrades post-deployment.
  • Broad I/O capability: 100 I/Os with programmable buffer standards support a wide variety of interface needs without additional interface chips.
  • Power management: Sleep mode enables substantial reductions in static current for lower standby power consumption.
  • RoHS compliant: Meets environmental requirements for lead-free assembly and regulatory compliance in commercial products.

Why Choose LFXP3E-4TN144C?

The LFXP3E-4TN144C positions itself as a compact, reconfigurable FPGA solution for commercial designs that need instant-on behavior, secure non-volatile configuration, and in-field reprogramming. With roughly 3,000 logic elements, approximately 55 Kbits of embedded RAM, and 100 I/Os in a 144-LQFP package, it suits designers looking to integrate control, interface and glue logic while keeping PCB area and part count low.

Its sleep-mode power reduction, flexible I/O standards, and onboard reconfiguration options offer lifecycle flexibility for products that will evolve after deployment. The device is appropriate for development teams and procurement looking for a commercially graded, RoHS-compliant FPGA with a clear, verifiable specification set.

Request a quote or submit an inquiry to receive pricing, availability and support information for LFXP3E-4TN144C. Include your quantity and delivery requirements to expedite a response.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up