LFXP3E-4T144C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 100 55296 3000 144-LQFP |
|---|---|
| Quantity | 738 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 100 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of LFXP3E-4T144C – XP Field Programmable Gate Array (FPGA), 100 I/O, ~55 Kbits RAM, ~3,000 logic elements, 144-LQFP
The LFXP3E-4T144C is a non-volatile LatticeXP family FPGA from Lattice Semiconductor designed for compact, reconfigurable system logic. It combines approximately 3,000 logic elements with about 55,296 bits of on-chip RAM and 100 user I/Os in a 144-pin LQFP/TQFP footprint, delivering a tightly integrated solution for embedded logic, protocol bridging and memory-interface tasks.
Built for commercial-temperature applications, the device emphasizes fast start-up, flexible I/O interfaces and in-field reconfiguration capabilities to support iterative development and deployed-system updates.
Key Features
- Core Architecture: Non-volatile, infinitely reconfigurable FPGA architecture with instant-on capability and no requirement for external configuration memory.
- Logic Capacity: Approximately 3,000 logic elements suitable for moderate-density logic integration and glue-logic consolidation.
- On-Chip Memory: Approximately 55,296 bits of embedded RAM with both distributed and block memory options as part of the device architecture.
- I/O and Interface Flexibility: 100 user I/Os with a programmable sysIO buffer supporting a wide range of interfaces (including multiple LVCMOS voltage levels, LVTTL, SSTL, HSTL, PCI, LVDS and other differential standards as defined for the LatticeXP family).
- Dedicated Memory Support: Family-level support for dedicated DDR memory interfaces (DDR up to DDR333 per family data sheet).
- Clocking and Timing: Includes analog PLL resources consistent with LatticeXP family devices to enable clock multiplication, division and phase shifting.
- Low-Power and Sleep: Sleep mode capability to dramatically reduce static current draw, supporting lower-power standby operation.
- Configurable System Access: SRAM and non-volatile memory programming through system configuration and JTAG ports; in-field reconfiguration (TransFR™) supported for logic updates while the system operates.
- Package and Supply: Surface-mount 144-pin LQFP (supplier reference 144-TQFP 20×20 mm) with a device supply range of 1.14 V to 1.26 V and RoHS compliance.
- Commercial Temperature Grade: Rated for 0 °C to 85 °C operation.
Typical Applications
- Embedded Control & Prototyping: Consolidate glue logic, peripheral handling and state machines in compact embedded systems requiring reconfigurable logic and fast start-up.
- Memory Interface Bridging: Implement and test DDR interface logic and buffering where dedicated DDR support and on-chip RAM simplify board-level design.
- Protocol Bridging & I/O Conversion: Use the programmable sysIO buffer and abundant I/O to bridge between different voltage domains and serial/parallel protocols.
- Field Upgradeable Systems: Deploy systems that require in-field logic updates without removing the device, leveraging TransFR™ reconfiguration and JTAG access.
Unique Advantages
- Instant-on, Non-volatile Configuration: Eliminates the need for external configuration memory and enables rapid power-up behavior.
- Compact, High-Function Density: Roughly 3,000 logic elements and ~55 Kbits of embedded RAM in a 144-pin LQFP package reduce board area and component count.
- Flexible Interface Support: Programmable I/O buffers and family-level protocol support simplify integration with a wide range of peripherals and memory technologies.
- In-field Reconfiguration: TransFR™ capability enables updates to implemented logic while the system remains operational, minimizing downtime for fielded products.
- Low-standby Power Option: Sleep mode provides significant static current reduction for energy-sensitive applications.
- Commercial Temperature Rating and RoHS Compliance: Suitable for standard commercial deployments with environmental compliance for lead-free assembly.
Why Choose LFXP3E-4T144C?
The LFXP3E-4T144C positions itself as a compact, non-volatile FPGA option for designers who need moderate logic density, flexible I/O and embedded memory in a small LQFP footprint. Its instant-on behavior, in-field reconfiguration support and programmable I/O make it a practical choice for systems that require rapid boot, iterative updates and interface versatility.
For teams focused on reducing BOM complexity while retaining the ability to update logic in the field, this device offers a balance of integration, configurability and commercial-grade operating range backed by the LatticeXP family features documented in the product datasheet.
If you would like a formal quote or have questions about integrating the LFXP3E-4T144C into your design, submit a request for a quote or sales inquiry referencing the part number LFXP3E-4T144C.

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