LFXP3E-4QN208C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 136 55296 3000 208-BFQFP |
|---|---|
| Quantity | 578 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 136 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of LFXP3E-4QN208C – XP Field Programmable Gate Array (FPGA) IC 136 55296 3000 208-BFQFP
The LFXP3E-4QN208C is a Lattice Semiconductor LatticeXP family FPGA offering non-volatile, reconfigurable logic in a 208-pin BFQFP package. It provides approximately 3,000 logic elements, 55,296 bits of on-chip RAM (approximately 54 Kbits), and up to 136 I/O in a compact 28 × 28 mm package.
Designed for applications that require instant-on operation, flexible I/O and in-field reconfiguration, the device combines embedded block RAM, distributed memory and programmable I/O support with low-power modes and dedicated PLL resources described in the LatticeXP family data.
Key Features
- Non-volatile, infinitely reconfigurable logic Instant-on operation with no external configuration memory and secure on-chip configuration storage as described for the LatticeXP family.
- Logic resources Approximately 3,000 logic elements for implementing combinational and sequential logic functions.
- On-chip memory Total RAM bits: 55,296 (approximately 54 Kbits) with support for both distributed RAM and embedded block RAM architectures in the LatticeXP family.
- I/O flexibility Up to 136 I/O pins in the 208-BFQFP (28 × 28 mm) package, with the LatticeXP family supporting a wide range of I/O standards and interfaces.
- Clock and timing Family-level support for analog PLLs for clock multiply/divide and phase shifting; LFXP3 devices include the PLL resources indicated in the LatticeXP selection guide.
- Power and voltage Core voltage supply specified at 1.14 V to 1.26 V; family documentation also describes device operation with standard I/O voltage rails.
- Low-power operation Family-level sleep mode capability provides significant static current reduction for power-sensitive designs.
- Package and grade Surface-mount 208-BFQFP (208-PQFP 28 × 28 mm supplier package) and commercial temperature grade (0 °C to 85 °C).
- Design and debug support LatticeXP family-level system features include JTAG boundary scan and in-system reconfiguration mechanisms as described in the datasheet.
Typical Applications
- System glue logic and interface bridging Use the device’s flexible I/O and programmable logic to implement protocol conversion, bus interfacing and custom glue logic.
- Onboard configurable logic Instant-on and non-volatile configuration make the device suitable for systems that require immediate FPGA functionality at power-up.
- Field-updatable logic In-field reconfiguration capability supports remote or incremental design updates without external configuration memory.
Unique Advantages
- Non-volatile instant-on architecture: Eliminates the need for external configuration memory and enables immediate device operation after power-up.
- Compact, high-density package: 208-BFQFP package delivers up to 136 I/Os and 3,000 logic elements in a 28 × 28 mm footprint to minimize board area.
- Embedded memory resources: Approximately 54 Kbits of on-chip RAM (55,296 bits total) provides both distributed and block RAM options for local buffering and state storage.
- Power management features: Family-level sleep mode and low core voltage operation support designs targeting reduced static power consumption.
- Reconfiguration and debug support: On-chip reconfiguration via system ports and JTAG, plus family-level internal logic analyzer capability, streamline development and updates.
Why Choose LFXP3E-4QN208C?
The LFXP3E-4QN208C brings LatticeXP family capabilities—non-volatile instant-on operation, in-field reconfigurability and flexible I/O—to a compact 208-BFQFP package with approximately 3,000 logic elements and about 54 Kbits of embedded memory. Its combination of on-chip memory, PLL resources and support for a wide range of I/O standards makes it suitable for designs that require immediate availability of programmable logic, adaptable interfaces and field updates.
This device is aimed at commercial-grade designs where compact packaging, configurable system logic and lower power modes are important. It is supported by the LatticeXP design environment and family-level features that help streamline implementation and debugging.
If you would like pricing, availability or to request a quote for LFXP3E-4QN208C, please submit a product inquiry or request a quote through your usual procurement channel.

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