LFXP3E-3TN144C

The LFXP3E-3TN144C is a member of the LatticeXP family of non-volatile, reconfigurable FPGAs. This surface-mount, commercial-grade device integrates approximately 3,000 logic elements, on-chip memory and flexible I/O in a 144-pin LQFP package, delivering an integrated solution for designs that require instant-on configuration and compact package options.

With 100 available I/Os, approximately 55 Kbits of total on-chip RAM and support for system-level features described in the LatticeXP family data sheet, the LFXP3E-3TN144C targets embedded designs that need reconfigurable logic, secure configuration and a compact footprint.

Key Features

• Core Logic  Approximately 3,000 logic elements for implementing combinational and sequential logic functions.
• Embedded Memory  Total on-chip RAM of 55,296 bits (approximately 55 Kbits) to support distributed and block memory requirements.
• I/O Density  100 I/O pins available in the 144-LQFP package for versatile interfacing and board-level routing.
• Non-volatile, Reconfigurable Architecture  Part of the LatticeXP family, which provides non-volatile, infinitely reconfigurable devices with instant-on capability and no external configuration memory.
• Power and Voltage  Device supply range specified at 1.14 V to 1.26 V for core operation; surface-mount package minimizes board-level assembly complexity.
• Power Management  Family features include a sleep mode that enables significant static current reduction for low-power operation.
• In-field Reconfiguration  TransFR™ reconfiguration capability (family feature) enables in-field logic updates while the system operates.
• Clocking  LatticeXP family devices include analog sysCLOCK PLLs; the LFXP3 family provides two PLLs for clock multiplication, division and phase shifting.
• Package and Mounting  144-LQFP (supplier package 144-TQFP, 20 × 20 mm) in a surface-mount form factor, commercial grade.
• Operating Range and Compliance  Commercial operating temperature from 0 °C to 85 °C; RoHS compliant.

Typical Applications

• Embedded systems requiring instant-on  Non-volatile configuration enables rapid power-up and eliminates the need for external configuration memory.
• Designs needing flexible I/O and memory  Approximately 55 Kbits of on-chip RAM and 100 I/Os support embedded memory blocks and a range of board-level interfaces described for the family.
• Field-updatable logic  TransFR reconfiguration (family feature) supports in-field updates to firmware and logic while systems remain operational.

Unique Advantages

• Instant-on, non-volatile architecture: Eliminates external configuration memory and reduces system boot time.
• Compact, high-density packaging: 144-LQFP (20 × 20 mm) surface-mount package with 100 I/Os simplifies board layout for space-constrained designs.
• Integrated memory and logic: Around 3,000 logic elements and approximately 55 Kbits of on-chip RAM reduce external component count and simplify system BOM.
• Reduced static power options: Family sleep-mode capability supports significant static current reduction for power-sensitive applications.
• Robust clock management: Two PLLs in the LFXP3 family provide on-chip clocking flexibility for timing-critical designs.
• Commercial-grade reliability and compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product requirements.

Why Choose LFXP3E-3TN144C?

The LFXP3E-3TN144C combines reconfigurable, non-volatile FPGA technology with a compact 144-LQFP package, making it suitable for embedded designs that require rapid power-up, secure configuration and a moderate logic/memory footprint. Its combination of approximately 3,000 logic elements, roughly 55 Kbits of on-chip RAM and 100 I/Os offers a balanced integration that reduces external components and simplifies board-level design.

Ideal for designers and procurement teams seeking a commercial-grade FPGA with family-level features such as sleep mode, in-field reconfiguration and on-chip PLLs, the LFXP3E-3TN144C provides scalability within the LatticeXP family and practical on-board integration for a wide range of embedded applications.

Request a quote or submit a parts inquiry to receive pricing and availability for the LFXP3E-3TN144C. Our team can provide lead-time information and support for your procurement process.