LFXP3E-3T144I

The LFXP3E-3T144I is a LatticeXP family FPGA offered in a 144‑pin LQFP (20 × 20 mm) surface-mount package. It delivers approximately 3,000 logic elements, roughly 55 Kbits of on-chip RAM, and 100 available I/O pins in an industrial‑grade device designed for embedded and system-level applications.

As a member of the LatticeXP family, this device provides non‑volatile, reconfigurable FPGA functionality with features geared toward instant-on operation, flexible I/O support, and system-level integration for industrial and embedded designs.

Key Features

• Core capacity — Approximately 3,000 logic elements for mid‑density logic integration suitable for glue logic, control, and protocol bridging tasks.
• Embedded memory — Total on-chip RAM of 55,296 bits (approximately 55 Kbits) for distributed and block memory needs within the design.
• I/O and interfaces — 100 I/O pins in the 144‑LQFP footprint, with family‑level support for a wide range of I/O standards (LVCMOS, LVTTL, SSTL, HSTL, LVDS and others as supported by the LatticeXP family).
• Non‑volatile, instant‑on architecture — Family features include non‑volatile configuration (no external configuration memory required) and instant‑on operation, enabling fast start-up.
• In‑field reconfiguration and low‑power modes — Family capabilities include TransFR reconfiguration for in‑field updates and a sleep mode that can dramatically reduce static current.
• Clocking and system support — LatticeXP family provides sysCLOCK PLLs for clock multiply/divide and phase shifting, plus boundary scan and on‑chip configuration support for system integration.
• Industrial operating range — Rated for industrial temperature operation from −40 °C to 100 °C and RoHS compliant.
• Power supply — Device core voltage specified at 1.14 V to 1.26 V.
• Package and mounting — 144‑pin LQFP (144‑TQFP, 20 × 20 mm) surface mount package for compact board placement and reliable soldering.

Typical Applications

• Industrial control — Implement control logic, sensor interfacing, and protocol bridging in industrial automation systems within an industrial temperature range.
• Embedded systems — Mid‑density FPGA resources and on-chip RAM make the device suitable for embedded processing, glue logic, and peripheral aggregation.
• Communications and networking — Use the flexible I/O and reconfigurable logic to adapt interfaces and implement custom protocol handling.
• Prototyping and field‑upgradeable designs — Non‑volatile configuration and in‑field reconfiguration support rapid prototype iteration and deployed updates.

Unique Advantages

• Non‑volatile, instant‑on capability: Eliminates external configuration memory and enables fast power‑up behavior.
• Mid‑range integration density: About 3,000 logic elements and ~55 Kbits of embedded RAM provide a compact solution for many control and interface tasks without over‑provisioning.
• Flexible I/O in a compact package: 100 I/Os in a 144‑LQFP footprint simplify board layout while supporting a broad set of interface standards at the family level.
• Industrial robustness: Rated for −40 °C to 100 °C operation and supplied in a surface‑mount package suited for industrial embedded assemblies.
• Low‑power and reconfiguration features: Family support for sleep mode and in‑field TransFR reconfiguration enables power management and live updates without full system downtime.
• System integration support: On‑chip clocking (PLLs), boundary scan, and configuration features reduce external component count and simplify system bring‑up.

Why Choose LFXP3E-3T144I?

The LFXP3E-3T144I positions itself as a practical mid‑density FPGA option for engineers who need non‑volatile, reconfigurable logic in a compact industrial‑grade package. With roughly 3,000 logic elements, approximately 55 Kbits of on‑chip RAM, and 100 I/Os in a 144‑LQFP footprint, it balances logic capacity and I/O density for embedded control, communications, and industrial applications.

Its LatticeXP family features — instant‑on configuration, in‑field reconfiguration, flexible I/O support, and system‑level clocking and debug capabilities — deliver a capable platform for designs that require fast startup, field updates, and minimized external BOM. The device is suitable for teams seeking a robust, reconfigurable solution with industrial operating range and RoHS compliance.

Request a quote or submit an inquiry for pricing and availability of LFXP3E-3T144I for your next design.