LFXP3E-3T100I

The LFXP3E-3T100I is a LatticeXP family FPGA providing a compact, non-volatile programmable logic solution with 3,000 logic elements and approximately 54 Kbits of on-chip RAM (55,296 bits). This industrial-grade device integrates flexible I/O, reconfigurable logic, and instant-on non-volatile configuration in a 100-pin LQFP/TQFP footprint.

Designed for embedded and industrial designs that require low-voltage operation, robust temperature range, and field reconfiguration, the device delivers system-level features such as sleep-mode power reduction and in-field reconfiguration capabilities.

Key Features

• Core Logic  3,000 logic elements provide the programmable fabric for control, glue-logic and mid-density application functions.
• Non-volatile Architecture  Instant-on, non-volatile configuration eliminates the need for external configuration memory and secures design bitstreams.
• Reconfiguration  In-field reconfiguration capabilities allow SRAM-based logic to be updated quickly; the family supports TransFR™ Reconfiguration for live system updates.
• Embedded Memory  Approximately 55,296 bits (~54 Kbits) of on-chip RAM supports distributed and block memory needs for buffering and state storage.
• I/O and Interface Flexibility  62 user I/Os in the 100-pin package enable a variety of peripheral and bus interfaces; the family supports a wide range of I/O standards (documented at the family level).
• Power Management  Low-voltage operation (1.14 V to 1.26 V supply) and a sleep mode that can reduce static current by up to 1000× support energy-conscious designs.
• Clocking  Family-level clock management includes analog PLLs for clock multiply, divide and phase shifting (LFXP3 devices include PLL resources as specified in the family documentation).
• Package and Thermal  Available in a 100-pin LQFP / 100-TQFP (14 × 14 mm) package and rated for industrial operating temperatures from −40 °C to 100 °C.
• Standards and Tools  System-level support includes IEEE 1149.1 boundary-scan and internal logic analysis capabilities as part of the LatticeXP family feature set.
• Environmental Compliance  RoHS-compliant manufacturing.

Typical Applications

• Industrial Control  Use the device for control logic, sensor interfacing and real-time glue logic where industrial temperature rating and 62 I/Os provide reliable connectivity.
• Embedded Systems  Compact FPGA logic and on-chip RAM support custom peripherals, protocol bridging and timing-critical functions in space-constrained boards.
• Communications and Networking  Flexible I/O and clocking resources make this part suitable for protocol adaptation, framing and interface logic in mid-density communication nodes.
• Instrument and Test Equipment  Instant-on configuration and reprogrammable logic enable fast startup and quick in-field updates for instrumentation and test platforms.

Unique Advantages

• Instant-on Non-Volatile Logic: Eliminates external configuration memory and provides immediate device availability at power-up.
• Field Reconfigurability: Reconfigure SRAM-based logic in milliseconds and apply in-field updates without removing the device from the system.
• Low-Power Modes: Sleep mode enables significant static current reduction for power-sensitive applications.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to meet a wide range of industrial deployment conditions.
• Compact, Surface-Mount Package: 100-pin LQFP/TQFP (14 × 14 mm) provides a balance of I/O and board-space efficiency for mid-density designs.
• Vendor Ecosystem: Part of the LatticeXP family with documented system support and development tool flow for rapid implementation.

Why Choose LFXP3E-3T100I?

The LFXP3E-3T100I positions itself as a mid-density, industrial-grade FPGA that combines non-volatile instant-on behavior with field reconfigurability and efficient on-chip memory. Its 3,000 logic elements, ~54 Kbits of embedded RAM and 62 I/Os in a compact 100-pin package make it well-suited for embedded, industrial control and communications tasks where board space, low-voltage operation and reliable temperature performance matter.

Selecting this device gives designers a scalable option within the LatticeXP family, with system-level features and power modes that reduce BOM complexity and support long-term flexibility through in-field updates and standard toolchain compatibility.

Request a quote or submit an inquiry to receive pricing, availability and support information for LFXP3E-3T100I. Our team can provide technical details and ordering guidance to help integrate this FPGA into your next design.