LFXP3E-3Q208I

The LFXP3E-3Q208I is a member of the LatticeXP family of non-volatile FPGAs from Lattice Semiconductor Corporation, delivered in a 208-BFQFP (28 × 28 mm) surface-mount package. It integrates approximately 3000 logic elements, on-chip embedded RAM, and flexible I/O to support compact, reconfigurable system designs.

Designed for industrial applications, this device offers instant-on non-volatile operation, in-field reconfiguration capabilities, and a wide operating temperature range, making it suitable for designs that require fast startup, secure configuration, and reliable operation across environments.

Key Features

• Core Logic Approximately 3000 logic elements provide a compact programmable fabric for control, glue logic, and mid-density processing tasks.
• Embedded Memory Approximately 54 Kbits (55,296 bits) of on-chip RAM for distributed and block memory requirements.
• I/O Density & Flexibility Up to 136 I/Os available in the 208-BFQFP package to support a variety of peripheral interfaces and board-level connections.
• Non-volatile, Instant-On Architecture LatticeXP family features non-volatile configuration for instant-on startup without external configuration memory and secure bitstream handling.
• In-Field Reconfiguration & Sleep Mode Supports reconfiguration in the field and a sleep mode that can reduce static current substantially for low-power standby.
• Clocking Integrated PLL resources (device-class specification) for clock multiply/divide and phase shifting to simplify timing architectures.
• Power Supply Core supply range specified at 1.14 V to 1.26 V for the device.
• Package & Mounting 208-BFQFP (supplier device package: 208-PQFP, 28 × 28 mm), surface-mount mounting for compact board layouts.
• Industrial Grade & Temperature Range Rated for industrial use with operating temperature from -40 °C to 100 °C.
• Standards & Compliance RoHS compliant.

Typical Applications

• Industrial Control & Automation — Instant-on capability, industrial temperature rating, and flexible I/O make this FPGA suitable for control logic, motor drives interface, and industrial communication endpoints.
• Embedded Systems — Compact package and integrated memory provide building blocks for embedded glue logic, protocol bridging, and custom peripheral control.
• Communications & Networking — Flexible I/O and programmable clocking support adaptable interface implementations and timing-critical links.
• Test & Measurement — Fast startup and reconfigurability enable adaptable instrument front-ends and feature updates without hardware changes.

Unique Advantages

• Non-volatile Instant-On: Powers up in microseconds with no external configuration memory required, reducing system BOM and simplifying start-up sequences.
• Secure, Reconfigurable Platform: On-chip configuration eliminates an external bitstream and enables in-field updates while protecting design IP.
• Low-Power Standby: Sleep mode delivers substantial static current reduction for energy-conscious systems.
• Flexible I/O Count in Compact Package: 136 I/Os in a 208-BFQFP package provide a balance of connectivity and small board footprint.
• Industrial Robustness: Industrial-grade qualification and a -40 °C to 100 °C operating range make the device appropriate for demanding environments.

Why Choose LFXP3E-3Q208I?

The LFXP3E-3Q208I combines a compact, industrial-grade package with a non-volatile, instantly available FPGA fabric—delivering a practical solution for designers who need reliable startup behavior, in-field reconfigurability, and flexible I/O in a mid-density device. Its roughly 3000 logic elements and on-chip memory make it well suited for control, interface bridging, and embedded processing tasks where space, power, and secure configuration matter.

For development and scaling, the device benefits from the LatticeXP family architecture and tool ecosystem, providing a migration path across higher-density family members when designs require increased resources.

Request a quote or submit an inquiry for availability and pricing for the LFXP3E-3Q208I. Our team can provide lead-time and ordering information tailored to your project needs.