LFXP3E-3Q208C

IC FPGA 136 I/O 208QFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 136 55296 3000 208-BFQFP

Quantity 1,274 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O136Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells3000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of LFXP3E-3Q208C – XP Field Programmable Gate Array (FPGA) IC 136 55296 3000 208-BFQFP

The LFXP3E-3Q208C is a commercial-grade LatticeXP family FPGA offering 3,000 logic elements in a 208-pin PQFP (28 × 28 mm) surface-mount package. It combines non-volatile, infinitely reconfigurable logic with on-chip memory and flexible I/O to address compact embedded designs that require instant-on configuration and in-field reconfiguration.

Key use cases include general-purpose embedded control, user interface and glue-logic functions, and systems requiring reconfigurable logic with a modest number of I/Os and embedded RAM. The device delivers fast configuration, low-power standby, and a range of system-level features for debug and clock management.

Key Features

  • Core Logic — 3,000 logic elements provide a compact reprogrammable fabric suitable for mid-density functions.
  • Embedded Memory — 55,296 bits of on-chip RAM (approximately 54 Kbits) for distributed and block memory use in control and buffering tasks.
  • I/O Count and Package — 136 I/Os in a 208-BFQFP / 208-PQFP (28 × 28 mm) surface-mount package support a range of external peripherals and interfaces.
  • Non-Volatile Instant-On — ispXP non-volatile architecture enables instant-on operation without external configuration memory and supports secure, reprogrammable logic.
  • Low-Power Sleep Mode — Sleep mode capability providing up to 1000× static current reduction for power-sensitive applications.
  • In-Field Reconfiguration (TransFR™) — Allows updating of SRAM-based logic while the system remains operational for rapid field upgrades.
  • Clocking — LatticeXP family support for on-chip PLLs (LFXP3 devices provide 2 PLLs) for clock multiplication, division and phase control.
  • Flexible I/O Standards — Family-level sysIO buffer support for numerous standards including LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS.
  • System Support — IEEE 1149.1 boundary-scan and ispTRACY internal logic analyzer capability for on-board debug and verification; onboard oscillator for configuration.
  • Supply and Temperature — Core supply range 1.14 V to 1.26 V; commercial operating temperature range 0 °C to 85 °C.
  • RoHS Compliant — Device is RoHS compliant for lead-free assemblies.

Typical Applications

  • Embedded Control and Glue Logic — Implement control state machines, bus bridging and custom peripherals where a compact FPGA with moderate logic density and on-chip RAM simplifies system design.
  • Consumer Electronics — Instant-on non-volatile configuration and low-power sleep mode benefit user interfaces, appliances and consumer modules that require fast startup and power savings within a commercial temperature range.
  • Industrial Automation (Commercial Grade) — Use for machine control logic, protocol conversion and I/O expansion in commercial-temperature automation equipment where reconfigurability and field updates are advantageous.
  • Prototyping and Development — A compact PQFP package and integrated system features (JTAG boundary-scan, internal logic analyzer) make the device suitable for rapid prototyping and iterative development.

Unique Advantages

  • Instant-on, Non-Volatile Architecture: Eliminates the need for external configuration memory and delivers microsecond startup for time-sensitive systems.
  • Field Upgrades Without Downtime: TransFR reconfiguration enables in-field updates to SRAM-based logic while the system remains operational, reducing service cycles.
  • Low-Power Standby: Sleep mode capability allows dramatic static current reduction, extending battery life or lowering standby power in always-on products.
  • Integrated Memory Resources: Approximately 54 Kbits of embedded RAM supports buffering, FIFOs and data storage without external SRAM.
  • Flexible I/O and Clocking: Broad I/O standard support combined with on-chip PLLs simplifies interfacing to a wide range of peripherals and memory types.
  • Compact, Surface-Mount Packaging: 208-pin PQFP (28 × 28 mm) provides high I/O density in a familiar surface-mount form factor for space-constrained PCBs.

Why Choose LFXP3E-3Q208C?

The LFXP3E-3Q208C positions itself as a practical, commercially graded FPGA solution for designs that require reconfigurability, fast startup and modest logic and memory resources. With 3,000 logic elements, roughly 54 Kbits of embedded RAM, and 136 I/Os in a compact 208-pin PQFP package, it supports a broad set of embedded and control applications where instant-on behavior and in-field updates are important.

Designed for developers and procurement teams seeking a balance of integration, configurability and system-level features (boundary-scan, internal logic analysis and PLL-based clock control), this device delivers a clear upgrade path within the LatticeXP family for projects that may evolve in functionality over time.

Request a quote or submit a pricing request to obtain availability and volume pricing for the LFXP3E-3Q208C.

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