LFXP3E-3QN208I

The LFXP3E-3QN208I is a non-volatile LatticeXP family FPGA from Lattice Semiconductor designed for compact, industrial-grade embedded logic applications. It combines reconfigurable logic, embedded RAM and flexible I/O in a 208-pin BFQFP package, delivering instant-on capability and in-field reconfiguration for system-level adaptability.

This device is suited to industrial and system-control designs that require approximately 3,000 logic elements, 136 I/Os and on-chip memory, with a core voltage supply range of 1.14 V to 1.26 V and an operating temperature range of −40°C to 100°C.

Key Features

• Core Logic Approximately 3,000 logic elements organized across device logic resources to implement combinational and sequential logic for control, interfacing and data-processing tasks.
• Embedded Memory Approximately 55 Kbits of on-chip RAM (55,296 bits) providing distributed and block memory for FIFOs, buffers and small data storage needs.
• I/O 136 user I/Os in the 208-BFQFP package for diverse peripheral and bus interfacing requirements.
• Non-volatile, Instant-on Architecture ispXP-based non-volatile architecture with instant-on behavior and no external configuration memory required.
• Reconfiguration and In-Field Update Supports in-field reconfiguration capabilities (TransFR™) and system configuration via JTAG, enabling logic updates while deployed.
• Power and Low-Power Modes Core supply range of 1.14 V to 1.26 V and a Sleep Mode that enables large static current reduction for lower standby power.
• Clocking Multiple analog PLLs are available in the LatticeXP family for clock multiplication, division and phase shifting to support system timing requirements.
• Package and Thermal 208-BFQFP (28 × 28 mm PQFP footprint) surface-mount package rated for industrial operation from −40°C to 100°C.
• Standards and Interfaces (Family Capability) Family architecture supports a wide range of I/O standards and dedicated DDR memory interfaces; use this device where those family-level capabilities align with system I/O and memory needs.

Typical Applications

• Industrial Control Integration of machine control logic, sensor interfacing and deterministic I/O handling within industrial environments with extended temperature requirements.
• Memory Interface and Buffering Implement DDR interface logic and on-chip buffering where the device’s embedded memory and family-level DDR support are required.
• Protocol Bridging and Interface Conversion Serve as a compact bridge between different logic domains and peripheral buses using the device’s flexible I/O and programmable logic.
• In-field Upgradable Systems Systems that require secure, non-volatile, instant-on logic with the ability to receive updates in the field via JTAG or system configuration paths.

Unique Advantages

• Instant-on Non-Volatile Operation: Eliminates the need for external configuration memory and enables rapid power-up behavior for systems that require immediate availability.
• In-field Reconfiguration: TransFR™ capabilities and JTAG/system configuration access allow logic updates and incremental feature deployment without board-level changes.
• Compact, Industrial-Grade Package: 208-BFQFP surface-mount package with an operating range of −40°C to 100°C supports deployment in industrial environments.
• Integrated Memory and I/O Count: Approximately 55 Kbits of embedded RAM and 136 I/Os reduce external component count for control and buffering tasks.
• Low-Power Standby: Sleep Mode capability enables significant static current reduction for power-sensitive applications.
• Vendor Ecosystem: Leverages the LatticeXP family architecture for migration and family-level feature familiarity across similar-density devices.

Why Choose LFXP3E-3QN208I?

The LFXP3E-3QN208I provides a balanced combination of reconfigurable logic, embedded memory and flexible I/O in a compact 208-BFQFP package tailored for industrial and embedded applications. Its non-volatile instant-on architecture, in-field reconfiguration capabilities and sleep-mode power savings make it a practical choice for systems that require fast startup, secure configuration and the ability to evolve in the field.

This device is well suited for design teams seeking a scalable FPGA resource within the LatticeXP family, enabling reduced board-level complexity and reliable operation across a wide temperature range backed by Lattice family features and design tool support.

Request a quote or submit an RFQ to obtain pricing and availability for LFXP3E-3QN208I. Our team can provide lead-time information and support for your procurement and integration planning.