LFXP3E-3T144C

IC FPGA 100 I/O 144TQFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 100 55296 3000 144-LQFP

Quantity 383 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O100Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells3000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of LFXP3E-3T144C – XP Field Programmable Gate Array (FPGA) IC 100 55296 3000 144-LQFP

The LFXP3E-3T144C is a mid-density, non-volatile FPGA in a 144-LQFP surface-mount package designed for commercial embedded systems. It combines approximately 3,000 logic elements, 384 logic blocks and roughly 55 Kbits of embedded RAM with up to 100 I/O pins to implement control, interfacing and signal-processing functions.

Based on the LatticeXP family architecture, this device offers instant-on, non-volatile configuration with in-field reconfiguration capability, low-voltage core operation and support for a broad set of I/O standards and memory interfaces suitable for system-level designs that require fast startup and flexible reprogramming.

Key Features

  • Non-volatile, instant-on architecture Powers up without external configuration memory and enables immediate start-up behavior for systems that need fast initialization.
  • Logic resources Approximately 3,000 logic elements organized across 384 logic blocks to implement medium-complexity control and glue-logic functions.
  • Embedded memory Total on-chip RAM of 55,296 bits (approximately 54 Kbits) for distributed and block memory use within designs.
  • I/O and package 100 I/O pins in a 144-LQFP (144-TQFP 20×20) surface-mount package, offering a compact footprint for board-level integration.
  • Power Core voltage supply range of 1.14 V to 1.26 V to match low-voltage system designs.
  • Clocking LatticeXP family support includes dedicated PLL resources; the LFXP3 class provides 2 PLLs for clock multiply/divide and phase shifting.
  • System-level features Family-level capabilities include in-system reconfiguration, internal logic analysis and boundary-scan support for verification and debug.
  • Commercial temperature and compliance Commercial grade operation from 0 °C to 85 °C and RoHS compliant for regulated manufacturing environments.

Typical Applications

  • Embedded control and glue logic — Implement board-level control, protocol bridging and peripheral interfacing where compact package and moderate I/O count are required.
  • Interface and startup-critical systems — Instant-on, non-volatile configuration enables fast system initialization for equipment that must be operational immediately after power-up.
  • Memory interface support — Suitable for designs requiring dedicated DDR interfaces or memory controllers supported by the family’s DDR memory capability.
  • In-field updates and feature upgrades — Reconfiguration features allow functional updates in deployed systems without external configuration storage.

Unique Advantages

  • Instant-on, secure configuration: Non-volatile architecture eliminates the need for external configuration memory and protects bitstream read-back.
  • Compact, board-friendly package: 144-LQFP surface-mount package provides a balance of I/O and small PCB footprint for space-constrained designs.
  • Balanced resource set: ~3,000 logic elements, 384 logic blocks and ~54 Kbits of embedded RAM enable a wide range of mid-range logic and memory tasks without overprovisioning.
  • Low-voltage core operation: 1.14–1.26 V supply range supports modern low-voltage architectures and power-sensitive applications.
  • Field reconfigurability: In-system reconfiguration capabilities allow feature upgrades and bug fixes in deployed products.
  • Design and debug support: Family-level features such as boundary-scan and internal logic analysis assist verification and bring-up.

Why Choose LFXP3E-3T144C?

The LFXP3E-3T144C offers a practical combination of logic density, embedded memory and I/O in a compact 144-LQFP package for commercial embedded designs. Its non-volatile instant-on architecture and in-field reconfiguration capabilities make it well-suited to applications that demand fast startup, secure configuration and the ability to evolve firmware or logic in the field.

This device is ideal for engineers building mid-complexity systems—such as control modules, interface bridges and memory-backed subsystems—who need a reliable, reprogrammable FPGA solution with a clear set of verified specifications and RoHS compliance.

If you would like pricing, availability or a formal quote for LFXP3E-3T144C, request a quote or submit an inquiry and our team will respond with the information you need.

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