LFXP3E-3T144C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 100 55296 3000 144-LQFP |
|---|---|
| Quantity | 383 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 100 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of LFXP3E-3T144C – XP Field Programmable Gate Array (FPGA) IC 100 55296 3000 144-LQFP
The LFXP3E-3T144C is a mid-density, non-volatile FPGA in a 144-LQFP surface-mount package designed for commercial embedded systems. It combines approximately 3,000 logic elements, 384 logic blocks and roughly 55 Kbits of embedded RAM with up to 100 I/O pins to implement control, interfacing and signal-processing functions.
Based on the LatticeXP family architecture, this device offers instant-on, non-volatile configuration with in-field reconfiguration capability, low-voltage core operation and support for a broad set of I/O standards and memory interfaces suitable for system-level designs that require fast startup and flexible reprogramming.
Key Features
- Non-volatile, instant-on architecture Powers up without external configuration memory and enables immediate start-up behavior for systems that need fast initialization.
- Logic resources Approximately 3,000 logic elements organized across 384 logic blocks to implement medium-complexity control and glue-logic functions.
- Embedded memory Total on-chip RAM of 55,296 bits (approximately 54 Kbits) for distributed and block memory use within designs.
- I/O and package 100 I/O pins in a 144-LQFP (144-TQFP 20×20) surface-mount package, offering a compact footprint for board-level integration.
- Power Core voltage supply range of 1.14 V to 1.26 V to match low-voltage system designs.
- Clocking LatticeXP family support includes dedicated PLL resources; the LFXP3 class provides 2 PLLs for clock multiply/divide and phase shifting.
- System-level features Family-level capabilities include in-system reconfiguration, internal logic analysis and boundary-scan support for verification and debug.
- Commercial temperature and compliance Commercial grade operation from 0 °C to 85 °C and RoHS compliant for regulated manufacturing environments.
Typical Applications
- Embedded control and glue logic — Implement board-level control, protocol bridging and peripheral interfacing where compact package and moderate I/O count are required.
- Interface and startup-critical systems — Instant-on, non-volatile configuration enables fast system initialization for equipment that must be operational immediately after power-up.
- Memory interface support — Suitable for designs requiring dedicated DDR interfaces or memory controllers supported by the family’s DDR memory capability.
- In-field updates and feature upgrades — Reconfiguration features allow functional updates in deployed systems without external configuration storage.
Unique Advantages
- Instant-on, secure configuration: Non-volatile architecture eliminates the need for external configuration memory and protects bitstream read-back.
- Compact, board-friendly package: 144-LQFP surface-mount package provides a balance of I/O and small PCB footprint for space-constrained designs.
- Balanced resource set: ~3,000 logic elements, 384 logic blocks and ~54 Kbits of embedded RAM enable a wide range of mid-range logic and memory tasks without overprovisioning.
- Low-voltage core operation: 1.14–1.26 V supply range supports modern low-voltage architectures and power-sensitive applications.
- Field reconfigurability: In-system reconfiguration capabilities allow feature upgrades and bug fixes in deployed products.
- Design and debug support: Family-level features such as boundary-scan and internal logic analysis assist verification and bring-up.
Why Choose LFXP3E-3T144C?
The LFXP3E-3T144C offers a practical combination of logic density, embedded memory and I/O in a compact 144-LQFP package for commercial embedded designs. Its non-volatile instant-on architecture and in-field reconfiguration capabilities make it well-suited to applications that demand fast startup, secure configuration and the ability to evolve firmware or logic in the field.
This device is ideal for engineers building mid-complexity systems—such as control modules, interface bridges and memory-backed subsystems—who need a reliable, reprogrammable FPGA solution with a clear set of verified specifications and RoHS compliance.
If you would like pricing, availability or a formal quote for LFXP3E-3T144C, request a quote or submit an inquiry and our team will respond with the information you need.