LFXP3E-3TN100I

The LFXP3E-3TN100I is a non-volatile LatticeXP family FPGA configured for mid-density embedded logic applications. It combines reprogrammable logic, embedded RAM and flexible I/O in a 100-pin LQFP package, delivering instant-on operation with no external configuration memory required.

Designed for industrial use, this device targets system designs that require in-field reconfiguration, low static-power modes, and a compact package with up to 62 user I/Os. Key value comes from integrated memory, configurable I/O standards and support for rapid configuration and updates.

Key Features

• Non-volatile, instant-on architecture — Powers up in microseconds and does not require external configuration memory, improving boot simplicity and design security.
• Reconfiguration and in-field updates — Supports TransFR™ Reconfiguration for in-field logic updates and can reconfigure SRAM-based logic in milliseconds.
• Logic resources — Approximately 3,000 logic elements organized across 384 logic blocks, suitable for mid-density control and interface tasks.
• Embedded memory — Total on-chip RAM of 55,296 bits (approximately 55 Kbits) for distributed and block memory requirements.
• Flexible I/O support — 62 I/Os with programmable sysIO™ buffer supporting a wide range of interfaces and signaling standards as provided by the LatticeXP family.
• Dedicated clocking — Family-level sysCLOCK PLLs (device-class provides two PLLs) for clock multiply/divide and phase shifting.
• Low-power operation — Sleep mode enables up to 1000× static current reduction for power-sensitive systems.
• Industrial operating range — Rated for operation from -40°C to 100°C.
• Supply voltage — Operates within a core supply range of 1.14 V to 1.26 V.
• Package and mounting — Surface-mount 100-LQFP package (supplier lists 100-pin TQFP 14×14 configuration).
• Regulatory — RoHS compliant.

Typical Applications

• Industrial control and automation — Implement control logic, sensor interfaces and glue logic within industrial temperature operating requirements.
• Embedded systems with in-field updates — Use TransFR™ reconfiguration to update logic while the system remains operational.
• Interface bridging and I/O management — Handle diverse signaling with programmable I/O buffers across multiple standards for system-level integration.
• Memory-backed logic and buffering — Leverage approximately 55 Kbits of on-chip RAM for local buffering, state machines and small embedded memories.

Unique Advantages

• Instant-on, single-chip configuration: Eliminates external configuration memory and enables fast system boot-up and secure bitstream handling.
• Field-updatable logic: TransFR™ reconfiguration and rapid SRAM reprogramming let you deploy updates without full system downtime.
• Power management: Sleep mode delivers significant static current reduction for lowered standby energy consumption.
• Compact industrial package: 100-pin LQFP surface-mount package balances board space and I/O accessibility for embedded designs.
• Integrated memory and clocking: On-chip RAM and device PLLs simplify memory and clock management for common embedded functions.
• RoHS-compliant: Meets RoHS requirements for environmental compliance in commercial and industrial products.

Why Choose LFXP3E-3TN100I?

The LFXP3E-3TN100I offers a balanced combination of non-volatile instant-on behavior, mid-range logic capacity and flexible I/O in a compact industrial package. Its on-chip memory and PLL resources, together with low-power sleep capability and support for in-field reconfiguration, make it well suited for embedded system designers who need reliable, reprogrammable logic with simplified board-level configuration.

This device is appropriate for developers building industrial control, interface bridging, and embedded systems that require deterministic boot behavior, compact packaging and the ability to update logic in the field while minimizing BOM complexity.

Request a quote or submit a product inquiry to discuss availability, lead times and pricing for LFXP3E-3TN100I.