LFXP3E-4Q208I

The LFXP3E-4Q208I is a non-volatile, infinitely reconfigurable FPGA in a 208‑pin BFQFP package designed for industrial applications. It integrates approximately 3,000 logic elements, on-chip memory, and flexible I/O to support embedded systems, interface bridging and in-field logic updates where instant-on behavior, compact BOM and robust temperature performance matter.

The device supports instant-on operation with no external configuration memory and includes system-level features such as JTAG-based configuration and reconfiguration, making it suitable for designs requiring secure, fast startup and in-field update capability.

Key Features

• Core Logic 
  Approximately 3,000 logic elements and 384 logic blocks provide the programmable fabric for implementing control, glue logic and moderate-density processing functions.
• On‑Chip Memory 
  Total on-chip RAM of 55,296 bits supports distributed and block memory usage within the FPGA design.
• Flexible I/O 
  136 user I/Os in the 208‑BFQFP package enable a wide range of external interfaces and board-level connectivity.
• Programmable I/O Standards 
  Device architecture includes programmable I/O buffer support for LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL and multiple differential standards as documented for the family, enabling versatile interface compatibility.
• Dedicated DDR Memory Support 
  Family-level support for DDR interfaces is provided, enabling implementation of interfaces up to DDR333 where required by the design.
• Clocking 
  Up to four analog PLLs are available for clock multiply/divide and phase shifting to support varied timing requirements.
• Non‑volatile, Instant‑On 
  No external configuration memory is required; the device powers up and configures quickly while protecting design bitstreams from external readback.
• Low‑Power Modes 
  A sleep mode capability provides dramatic static current reduction (up to 1000× as documented for the family) for power-sensitive designs.
• Package & Mounting 
  208‑BFQFP (28 × 28 mm) surface-mount package for high I/O density in a Pb‑free, RoHS‑compliant solution.
• Industrial Temperature Range 
  Rated to operate from −40 °C to 100 °C for industrial environments.
• Supply Voltage 
  Core voltage specified between 1.14 V and 1.26 V for power planning and regulator selection.

Typical Applications

• Industrial Control 
  Implement machine control, protocol bridging and custom logic functions that require industrial temperature operation and robust I/O.
• Embedded Systems 
  Use for compact embedded designs where on-chip memory, instant-on configuration and reprogrammability reduce board-level components and accelerate system startup.
• Interface and Protocol Conversion 
  Flexible I/O standards and ample I/O count make the device suitable for protocol translation, sensor interfaces and mixed-voltage buffering.
• Memory Interface Implementation 
  Support for dedicated DDR interfaces enables integration of external DRAM controllers and buffering where higher bandwidth is required.
• Field Upgradeable Logic 
  In-field reconfiguration capabilities support remote updates and incremental feature upgrades without external configuration memory.

Unique Advantages

• Instant‑on, non‑volatile configuration: Eliminates external configuration memory and enables rapid power-up behavior, simplifying system power sequencing and reducing BOM.
• Compact, integrated solution: On-chip RAM and approximately 3,000 logic elements reduce the need for external glue logic and memory in many mid-density designs.
• Wide I/O flexibility: 136 I/Os and programmable buffer standards allow a single device to handle multiple interface types, minimizing additional level‑shifters or translators.
• Low‑power operation: Sleep mode capability offers substantial static current reduction for energy-conscious industrial and embedded applications.
• Designed for industrial use: Temperature rating from −40 °C to 100 °C and surface‑mount 208‑BFQFP packaging provide deployment options for rugged environments.
• Field reconfiguration and security: Reconfigurable SRAM logic and non‑volatile configuration protect design IP while enabling in-system updates.

Why Choose LFXP3E-4Q208I?

The LFXP3E-4Q208I offers a balanced combination of logic capacity, on-chip memory and flexible I/O in a non-volatile FPGA targeted at industrial and embedded designs. Its instant-on configuration, sleep mode for low static power, and family-level features such as PLLs and DDR memory support allow engineers to implement compact, updateable systems with reduced external components.

This device is well suited to teams designing mid-density programmable logic solutions that require industrial temperature operation, secure on-board configuration and the ability to adapt in the field through reconfiguration.

Request a quote or submit a pricing and availability inquiry to evaluate LFXP3E-4Q208I for your next design.