LFXP3E-4QN208I

The LFXP3E-4QN208I is a non-volatile LatticeXP family FPGA in a 208-pin BFQFP package designed for industrial applications. It combines reconfigurable logic, embedded RAM and flexible I/O in a single surface-mount device to support embedded control, system glue logic and interface bridging.

Key architectural characteristics include instant-on non-volatile configuration, in-field reconfiguration capability and sleep mode for reduced static current. The device is suited to industrial-temperature designs requiring up to 136 I/Os and approximately 55 Kbits of on-chip RAM.

Key Features

• Core Architecture  Non-volatile, infinitely reconfigurable LatticeXP architecture with instant-on behavior and in-field reconfiguration support as described in the product family datasheet.
• Logic Resources  Provides 384 logic block units and 3000 logic elements for implementing combinational and sequential logic.
• Embedded Memory  Approximately 55 Kbits (55,296 bits) of total on-chip RAM for distributed and block memory needs.
• I/O and Interface Flexibility  136 user I/Os with programmable I/O buffer options in the family supporting multiple standards (including LVCMOS, LVTTL and differential interfaces noted in the datasheet).
• Clocking  Includes PLL resources per the LatticeXP family architecture to support clock multiply/divide and phase shifting (LFXP3 family includes PLL support).
• Power  Core voltage supply specified at 1.14 V to 1.26 V; family-level support for multiple I/O voltages is described in the datasheet.
• Low-Power Modes  Sleep mode capability in the family enables large reductions in static current for power-sensitive designs.
• Package and Mounting  208-BFQFP (supplier package 208-PQFP, 28 × 28 mm) surface-mount package suitable for standard assembly processes.
• Industrial Temperature  Rated for operation from −40 °C to 100 °C, suitable for industrial-environment deployment.
• RoHS Compliant  Device is RoHS compliant.

Typical Applications

• Industrial Control  Use as programmable control and glue logic in industrial automation systems where an industrial temperature range and compact package are required.
• Embedded Systems  Implement custom peripheral interfaces, protocol bridging and control state machines using the device’s logic and embedded RAM.
• Interface and I/O Management  Leverage the 136 I/Os and programmable buffers for mixed-signal interface management, leveling and signal routing in multi-voltage systems.
• In-Field Updatable Systems  Take advantage of non-volatile instant-on configuration and in-field reconfiguration capability for systems that require remote updates or iterative feature upgrades.

Unique Advantages

• Instant-on, non-volatile configuration: Eliminates the need for external configuration memory and enables rapid startup behavior.
• Reconfigurability in-system: Family-level TransFR reconfiguration and SRAM reprogramming enable in-field logic updates without removing the device.
• Compact, surface-mount package: 208-BFQFP (28 × 28 mm) provides a balance of I/O count and PCB footprint for space-constrained designs.
• Industrial temperature capability: Rated −40 °C to 100 °C to meet demanding environmental requirements.
• Balanced resource set: 3000 logic elements with ~55 Kbits of embedded RAM and 136 I/Os support a wide range of mid-density logic functions.
• Power management features: Sleep mode support enables significant static current reduction in standby to preserve system power budgets.

Why Choose LFXP3E-4QN208I?

The LFXP3E-4QN208I positions itself as a mid-density, industrial-grade FPGA that balances reconfigurable logic, on-chip memory and flexible I/O in a single non-volatile device. Its instant-on behavior, in-field reconfiguration capability and sleep mode options make it well suited to embedded and industrial designs that need fast startup, field updates and controlled power consumption.

This device is a fit for engineers and procurement teams seeking a compact, RoHS-compliant FPGA with defined logic and memory resources, industrial temperature rating and a 208-pin BFQFP package for standard surface-mount assembly.

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