LFXP3E-4T144I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 100 55296 3000 144-LQFP |
|---|---|
| Quantity | 642 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 100 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of LFXP3E-4T144I – XP Field Programmable Gate Array (FPGA) IC 100 55296 3000 144-LQFP
The LFXP3E-4T144I is an industrial-grade FPGA from Lattice's LatticeXP family, built on non-volatile ispXP technology. This surface-mount 144-pin TQFP/LQFP device integrates approximately 3,000 logic elements, about 54 Kbits of embedded RAM, and 100 user I/Os in a compact 20 × 20 mm package, delivering instant-on, reconfigurable logic for embedded and industrial systems.
Designed for applications that require robust operation across -40 °C to 100 °C and a core supply range of 1.14–1.26 V, the device combines on-chip memory, flexible I/O, low-power modes and in-field reconfiguration capabilities to simplify system design and accelerate time to market.
Key Features
- Non-volatile ispXP architecture Instant-on operation with no external configuration memory required and built-in protection against bit-stream read-back.
- Core capacity Approximately 3,000 logic elements organized across 384 logic blocks for compact logic implementation.
- Embedded memory Approximately 55,296 bits (~54 Kbits) of on-chip RAM for distributed and block storage needs.
- Flexible I/O 100 user I/Os on the 144-LQFP package to support a variety of system interfaces and peripheral connections.
- Programmable I/O buffer and interface support (family) Family-level sysIO buffer options support a wide range of standards including multiple LVCMOS levels, LVTTL, SSTL, HSTL, PCI, LVDS and others.
- On-chip clocking Integrated PLL resources (LFXP3 devices provide 2 PLLs) for clock multiply/divide and phase-shifting requirements.
- Low-power operation Sleep mode capability for significant static current reduction during idle or low-power states.
- Reconfiguration and in-field update TransFR™ reconfiguration enables in-field logic updates while the system remains operational; supported configuration and JTAG access for programmability.
- Package and mounting Surface-mount 144-LQFP / 144-TQFP (20 × 20 mm) package suitable for compact PCB designs.
- Industrial temperature range Rated for operation from -40 °C to 100 °C for deployment in industrial environments.
Typical Applications
- Industrial control and automation Instant-on and industrial temperature range make the device suitable for control logic, protocol bridging and machine interface tasks.
- Embedded system glue logic Compact logic capacity and flexible I/O enable integration of custom interfaces and timing control between subsystems.
- Communications and protocol adaptation Programmable I/O buffer options and on-chip PLLs facilitate implementation of protocol conversion and timing-critical interfaces.
- Sensor aggregation and preprocessing On-chip memory and reconfigurable logic allow local data buffering, preprocessing and aggregation of multiple sensor streams.
Unique Advantages
- Instant-on, non-volatile operation Eliminates external configuration memory and enables fast system start-up without additional components.
- Compact, integrated solution Combines logic, embedded RAM and I/Os in a single 144-pin package to reduce board area and BOM complexity.
- In-field reconfigurability TransFR reconfiguration supports logic updates while the system is running, simplifying field upgrades and feature additions.
- Low-power standby Sleep mode enables substantial static current reduction for energy-sensitive applications.
- Industrial reliability Specified for -40 °C to 100 °C operation, suitable for a wide range of industrial environments.
- Toolchain and IP support (family) Supported by the Lattice ispLEVER design environment and available ispLeverCORE IP blocks to accelerate development.
Why Choose LFXP3E-4T144I?
The LFXP3E-4T144I positions itself as a compact, industrial-grade FPGA option for designers who need non-volatile, reconfigurable logic with a small board footprint. With approximately 3,000 logic elements, ~54 Kbits of embedded RAM, 100 I/Os and integrated PLLs, it addresses control, interface and preprocessing needs while minimizing external components.
Its instant-on behavior, sleep-mode low-power capability and in-field reconfiguration support provide flexibility for product updates and energy-efficient operation. Backed by the LatticeXP family toolchain and IP resources, the device is well suited for OEMs and engineers seeking a robust, reprogrammable building block for industrial and embedded applications.
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