LFXP3E-4T144I

IC FPGA 100 I/O 144TQFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 100 55296 3000 144-LQFP

Quantity 642 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFPNumber of I/O100Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells3000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of LFXP3E-4T144I – XP Field Programmable Gate Array (FPGA) IC 100 55296 3000 144-LQFP

The LFXP3E-4T144I is an industrial-grade FPGA from Lattice's LatticeXP family, built on non-volatile ispXP technology. This surface-mount 144-pin TQFP/LQFP device integrates approximately 3,000 logic elements, about 54 Kbits of embedded RAM, and 100 user I/Os in a compact 20 × 20 mm package, delivering instant-on, reconfigurable logic for embedded and industrial systems.

Designed for applications that require robust operation across -40 °C to 100 °C and a core supply range of 1.14–1.26 V, the device combines on-chip memory, flexible I/O, low-power modes and in-field reconfiguration capabilities to simplify system design and accelerate time to market.

Key Features

  • Non-volatile ispXP architecture  Instant-on operation with no external configuration memory required and built-in protection against bit-stream read-back.
  • Core capacity  Approximately 3,000 logic elements organized across 384 logic blocks for compact logic implementation.
  • Embedded memory  Approximately 55,296 bits (~54 Kbits) of on-chip RAM for distributed and block storage needs.
  • Flexible I/O  100 user I/Os on the 144-LQFP package to support a variety of system interfaces and peripheral connections.
  • Programmable I/O buffer and interface support (family)  Family-level sysIO buffer options support a wide range of standards including multiple LVCMOS levels, LVTTL, SSTL, HSTL, PCI, LVDS and others.
  • On-chip clocking  Integrated PLL resources (LFXP3 devices provide 2 PLLs) for clock multiply/divide and phase-shifting requirements.
  • Low-power operation  Sleep mode capability for significant static current reduction during idle or low-power states.
  • Reconfiguration and in-field update  TransFR™ reconfiguration enables in-field logic updates while the system remains operational; supported configuration and JTAG access for programmability.
  • Package and mounting  Surface-mount 144-LQFP / 144-TQFP (20 × 20 mm) package suitable for compact PCB designs.
  • Industrial temperature range  Rated for operation from -40 °C to 100 °C for deployment in industrial environments.

Typical Applications

  • Industrial control and automation  Instant-on and industrial temperature range make the device suitable for control logic, protocol bridging and machine interface tasks.
  • Embedded system glue logic  Compact logic capacity and flexible I/O enable integration of custom interfaces and timing control between subsystems.
  • Communications and protocol adaptation  Programmable I/O buffer options and on-chip PLLs facilitate implementation of protocol conversion and timing-critical interfaces.
  • Sensor aggregation and preprocessing  On-chip memory and reconfigurable logic allow local data buffering, preprocessing and aggregation of multiple sensor streams.

Unique Advantages

  • Instant-on, non-volatile operation  Eliminates external configuration memory and enables fast system start-up without additional components.
  • Compact, integrated solution  Combines logic, embedded RAM and I/Os in a single 144-pin package to reduce board area and BOM complexity.
  • In-field reconfigurability  TransFR reconfiguration supports logic updates while the system is running, simplifying field upgrades and feature additions.
  • Low-power standby  Sleep mode enables substantial static current reduction for energy-sensitive applications.
  • Industrial reliability  Specified for -40 °C to 100 °C operation, suitable for a wide range of industrial environments.
  • Toolchain and IP support (family)  Supported by the Lattice ispLEVER design environment and available ispLeverCORE IP blocks to accelerate development.

Why Choose LFXP3E-4T144I?

The LFXP3E-4T144I positions itself as a compact, industrial-grade FPGA option for designers who need non-volatile, reconfigurable logic with a small board footprint. With approximately 3,000 logic elements, ~54 Kbits of embedded RAM, 100 I/Os and integrated PLLs, it addresses control, interface and preprocessing needs while minimizing external components.

Its instant-on behavior, sleep-mode low-power capability and in-field reconfiguration support provide flexibility for product updates and energy-efficient operation. Backed by the LatticeXP family toolchain and IP resources, the device is well suited for OEMs and engineers seeking a robust, reprogrammable building block for industrial and embedded applications.

Request a quote or submit an inquiry to get pricing, availability and support details for the LFXP3E-4T144I.

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