LFXP3E-4T100C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 62 55296 3000 100-LQFP |
|---|---|
| Quantity | 1,326 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-LQFP | Number of I/O | 62 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of LFXP3E-4T100C – XP Field Programmable Gate Array, 3000 logic elements, 62 I/Os
The LFXP3E-4T100C is a non-volatile LatticeXP family FPGA offered in a 100-pin LQFP package. It provides a compact, reconfigurable logic fabric with 3,000 logic elements and approximately 55 Kbits of embedded RAM, targeting commercial embedded designs that require instant-on capability, in-field reconfiguration and flexible I/O.
Key Features
- Core Logic 3,000 logic elements implemented in the LatticeXP architecture for moderate-density programmable logic.
- Embedded Memory Approximately 55 Kbits (55,296 bits) of on-chip RAM for embedded and distributed memory needs.
- I/O and Interface Flexibility 62 user I/Os in a 100-pin package; family-level sysIO buffer support covers a wide range of interfaces including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS as documented for the LatticeXP family.
- Non-volatile, Instant-on Configuration LatticeXP family non-volatile technology provides instant-on operation and eliminates the need for external configuration memory.
- In-field Reconfiguration Supports TransFR™ reconfiguration for updating SRAM-based logic in the field while the system operates, and system configuration via JTAG.
- Power and Supply Core supply range specified at 1.14 V to 1.26 V; devices in the family also support multiple I/O supply levels as required by system interfaces.
- Clocking and System Support Family-level sysCLOCK™ analog PLLs provide clock multiply/divide and phase shifting; LatticeXP devices include IEEE 1149.1 boundary scan and onboard configuration oscillator.
- Package and Mounting 100-pin LQFP (100-TQFP, 14 × 14 mm footprint) in a surface-mount package suitable for compact board designs.
- Commercial Temperature Range Rated for operation from 0 °C to 85 °C and designated as commercial grade.
- RoHS Compliant Meets RoHS environmental compliance requirements.
Typical Applications
- Embedded Control Implement control logic and glue logic for consumer and commercial products where instant-on and reconfigurability shorten boot and update cycles.
- Interface Bridging Use flexible I/O and on-chip memory to bridge between differing logic levels and protocol interfaces in compact systems.
- In-field Updatable Systems Systems requiring firmware updates or incremental feature adds can benefit from TransFR reconfiguration and JTAG programmability.
- Prototyping and Small-volume Designs Compact 100-LQFP packaging and moderate logic density make the device suitable for development boards and short-run products.
Unique Advantages
- Instant-on Non-Volatile Operation: Eliminates external configuration memory and enables immediate device availability after power-up.
- In-field Reconfiguration: TransFR capability allows updates to SRAM-based logic while the system remains operational, reducing downtime for feature upgrades.
- Flexible I/O Support: Family-level sysIO buffer options support a wide range of signaling standards, simplifying mixed-signal interface designs.
- Compact Packaging: 100-pin LQFP (14 × 14 mm) surface-mount package enables space-efficient board layouts for size-constrained applications.
- Balanced Resource Set: 3,000 logic elements with ~55 Kbits of embedded RAM and 62 I/Os provide a balanced resource mix for moderate-density designs.
- Commercial Temperature and RoHS Compliance: Commercial temperature rating (0 °C to 85 °C) and RoHS compliance support broad market deployment.
Why Choose LFXP3E-4T100C?
The LFXP3E-4T100C brings LatticeXP family advantages—non-volatile instant-on configuration, in-field reconfiguration, and flexible I/O—into a compact 100-pin LQFP package with 3,000 logic elements and approximately 55 Kbits of embedded RAM. It is well suited for engineers and designers building commercial embedded systems that require fast startup, updateable logic, and a versatile interface set within a small PCB footprint.
With clear electrical and mechanical specifications, including a 1.14–1.26 V supply range for core operation, 62 I/Os and a commercial temperature rating, this device offers a practical balance of integration and reconfigurability for prototyping, small-volume production and deployable commercial products.
Request a quote or submit a pricing inquiry to get availability and lead-time details for the LFXP3E-4T100C.

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