LFXP3E-4T100I

The LFXP3E-4T100I is an industrial-grade, non-volatile FPGA from Lattice’s LatticeXP family. It integrates approximately 3,000 logic elements with on-chip embedded memory and 62 I/O pins in a 100-pin package, targeting compact, reconfigurable control and interface designs that require instant-on capability and field reconfiguration.

This device combines instant-on non-volatile architecture with flexible I/O and embedded memory resources, making it suitable for systems that benefit from in-field updates, secure configuration, and robust operation across a wide temperature range.

Key Features

• Core Architecture — Non-volatile and Infinitely Reconfigurable Instant-on operation with non-volatile configuration memory; in-field reconfiguration and SRAM-based logic updates are supported.
• Logic Capacity Approximately 3,000 logic elements to implement mid-density control, glue logic, and interface functions.
• Embedded Memory Approximately 55 Kbits (55,296 bits) of on-chip RAM for embedded block RAM and distributed memory usage.
• I/O and Interface Flexibility 62 I/Os with programmable sysIO™ buffer support across a wide range of interfaces listed in the family data (including LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS and others).
• Power and Voltage Core supply specified at 1.14 V to 1.26 V; device family supports multi-voltage operation for I/O domains as described in the family data.
• Low-Power Modes Sleep mode reduces static current by up to 1000× for power-sensitive applications.
• Reconfiguration and System Support TransFR™ in-field reconfiguration and JTAG-based configuration plus boundary-scan support and internal debug capability as described in the family documentation.
• Clocking sysCLOCK™ PLL capability described in the family data (analog PLLs for clock multiply/divide and phase shifting).
• Package and Environmental Surface-mount 100-pin package (listed as 100-LQFP; supplier device package shown as 100-TQFP, 14 × 14 mm). RoHS compliant and industrial grade with an operating temperature range of −40 °C to 100 °C.

Typical Applications

• Interface Bridging and Glue Logic Use the 62 I/Os and flexible sysIO buffering to implement protocol conversion, bus interfaces, and board-level glue logic.
• Embedded Control and Sequencing Deploy the 3,000 logic elements and on-chip RAM for compact control firmware, sensor interfacing, and embedded state machines.
• Field-Upgradable Systems Leverage non-volatile instant-on and TransFR reconfiguration to apply updates or feature changes in the field without external configuration memory.
• Industrial Electronics Industrial-grade temperature range (−40 °C to 100 °C) and RoHS compliance make this device suitable for many industrial control and automation applications.
• Memory Interface and Timing Functions Use on-chip memory and the sysCLOCK PLL features from the family documentation to support memory buffering and clock management tasks.

Unique Advantages

• Instant-on Non-volatile Operation: Eliminates external configuration memory and enables rapid power-up without waiting for bitstream loading.
• Field Reconfiguration: TransFR and SRAM reconfiguration allow in-field logic updates while the system is operating, reducing maintenance downtime.
• Compact, Mid-density Integration: Approximately 3,000 logic elements and ~55 Kbits of embedded memory provide a balance of logic and memory for compact system designs.
• Flexible I/O Support: Programmable I/O buffers support a broad set of signaling standards (as specified for the LatticeXP family), simplifying interface design and reducing external components.
• Industrial Reliability: Industrial-grade operating range (−40 °C to 100 °C) and RoHS compliance support deployment in demanding environments.
• Power Management Features: Sleep mode enables major reductions in static current for power-sensitive deployments.

Why Choose LFXP3E-4T100I?

The LFXP3E-4T100I provides a practical, industrial-grade FPGA solution for designers needing a non-volatile, instant-on device with mid-range logic capacity and flexible I/O. Its combination of approximately 3,000 logic elements, roughly 55 Kbits of embedded RAM, and 62 I/Os in a compact 100-pin package makes it well suited to interface-heavy and reconfigurable system designs where board space, configurability, and reliability matter.

Leveraging LatticeXP family capabilities—such as in-field reconfiguration, sleep mode power savings, and programmable I/O—this device offers a scalable option for product lines that may require long-term configurability and secure, on-device configuration storage.

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