LFXP3E-4TN100I

The LFXP3E-4TN100I is a non-volatile LatticeXP-series FPGA in a 100-pin LQFP package targeted at industrial-grade embedded designs. It combines reconfigurable logic, embedded memory and flexible I/O in a surface-mount 100-LQFP (14 × 14 mm) footprint.

With approximately 3,000 logic elements, 55,296 bits of on-chip RAM, and 62 user I/Os, this device is suited for applications that require instant-on operation, field reconfiguration, and reliable operation across an industrial temperature range.

Key Features

• Core Architecture — Non-volatile & Reconfigurable LatticeXP family technology provides non-volatile, infinitely reconfigurable logic for instant-on operation without external configuration memory.
• Logic Capacity Approximately 3,000 logic elements organized across 384 logic blocks for small-to-medium density designs.
• Embedded Memory Approximately 55,296 bits (≈54 Kbits) of on-chip RAM, combining block and distributed memory resources for buffers, state machines and small data stores.
• I/O and Interface Flexibility 62 user I/Os in a 100-pin package. The LatticeXP family provides a programmable sysIO buffer that supports a broad set of interface standards for mixed-signal system integration.
• Clocking and Memory Support Family-level sysCLOCK PLLs and dedicated DDR memory interface capability (as supported by LatticeXP series) enable common memory and clocking topologies; the LFXP3 device implements the LFXP3-class PLL configuration.
• Power and Temperature Core supply range 1.14 V to 1.26 V and industrial operating temperature range from −40 °C to 100 °C, suitable for extended-temperature embedded systems.
• Low-power and System Features Family features include sleep mode (significant static current reduction) and TransFR™ in-field reconfiguration for live firmware updates without full system downtime.
• Package & Mounting 100-LQFP (14 × 14 mm) surface-mount package for compact board layouts and standard assembly flows.
• Standards & Development Support LatticeXP family-level system features such as IEEE 1149.1 boundary-scan and onboard configuration support (JTAG/ispTRACY) aid debug, programming and production test.

Typical Applications

• Industrial Control Small-to-medium control logic, sensor interfacing and peripheral management where industrial temperature operation (−40 °C to 100 °C) and reconfigurability are required.
• Embedded Systems Instant-on embedded controllers and glue logic that benefit from on-chip RAM and a moderate number of user I/Os in a compact 100-LQFP package.
• Communications & Interface Bridging Protocol adaptation, I/O aggregation and specialized interface functions leveraging the device’s configurable I/O and PLL-based clocking.

Unique Advantages

• Non-volatile, instant-on operation: Eliminates the need for external configuration memory and enables secure, immediate startup behavior.
• Field reconfiguration capability: TransFR™ reconfiguration allows in-field logic updates while the system remains operational, reducing service downtime.
• Compact, industrial-ready package: 100-LQFP SMD footprint with an industrial temperature rating supports compact board designs for harsh environments.
• Integrated memory and I/O: Approximately 55 Kbits of on-chip RAM and 62 user I/Os reduce external component count for common embedded functions.
• System-level debug and test support: Boundary-scan and ispTRACY family features simplify development, programming and production test flows.
• Power management options: Sleep mode capability supports significant static current reduction for low-power standby scenarios.

Why Choose LFXP3E-4TN100I?

The LFXP3E-4TN100I is positioned for developers who need a compact, non-volatile FPGA with modest logic density, dedicated on-chip memory and flexible I/O in an industrial-grade package. Its combination of instant-on capability, field reconfiguration and family-level system features makes it well suited to embedded control, interface bridging and industrial applications where reliability and in-field updates matter.

Choosing this device offers a scalable, integrated solution that reduces BOM complexity by removing external configuration memory and providing embedded RAM and programmable I/O in a common 100-LQFP footprint backed by LatticeXP family capabilities.

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