LFXP3E-4TN144I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 100 55296 3000 144-LQFP |
|---|---|
| Quantity | 1,455 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 100 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of LFXP3E-4TN144I – XP FPGA, 3,000 logic elements, 144-LQFP
The LFXP3E-4TN144I is a non-volatile, reconfigurable FPGA from Lattice Semiconductor’s LatticeXP family, offered in a 144-pin LQFP (20 × 20 mm) package for surface-mount applications. Designed for embedded and industrial systems, this device combines on-chip logic, embedded RAM, and flexible I/O to support instant-on operation, in-field updates and compact board-level integration.
Key Features
- Non-volatile, reconfigurable architecture — ispXP technology provides instant-on operation and eliminates the need for external configuration memory; designs can be reconfigured in-system through JTAG or system ports.
- Logic capacity — approximately 3,000 logic elements suitable for small to mid-density control, glue-logic and interface functions.
- Embedded memory — approximately 55,296 bits (≈54 Kbits) of on-chip RAM to support buffers, FIFOs and small data storage without external SRAM.
- Flexible I/O — up to 100 I/O pins with programmable I/O buffer capability for multiple standards (examples in family data include LVCMOS, LVTTL, LVDS, SSTL, HSTL and others).
- Power and low-power modes — narrow supply range of 1.14 V to 1.26 V and a Sleep Mode that can reduce static current by up to 1,000× for low-power standby operation.
- System-level support — features described for the family include in-field TransFR™ reconfiguration, internal oscillator for configuration, and IEEE 1149.1 boundary-scan plus on-chip debug capability.
- Industrial temperature range — rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- Package and compliance — 144-LQFP (also referenced as 144-TQFP, 20 × 20 mm) surface-mount package; RoHS compliant.
Typical Applications
- Industrial control — compact FPGA logic and embedded RAM for motor control sequencing, sensor interfacing and deterministic I/O aggregation at industrial temperatures.
- Embedded systems — instant-on, non-volatile FPGA capability for control planes, protocol bridging and board-level glue logic without external configuration memory.
- Communications and networking — flexible I/O and on-chip memory suitable for interface conversion, peripheral aggregation and small buffering tasks.
- Instrumentation and test — reconfigurable logic and boundary-scan support for custom measurement front-ends, data conditioning and in-field updates.
Unique Advantages
- Instant-on non-volatile operation: eliminates external configuration storage and enables rapid power-up for systems that require immediate availability.
- Compact, integrated solution: logic plus approximately 54 Kbits of embedded RAM and up to 100 I/Os in a single 144-LQFP package reduces BOM and board area.
- Power-managed deployment: narrow core supply and a Sleep Mode that dramatically reduces static current support energy-conscious designs and long standby life.
- In-field reconfiguration: supports system updates and design changes without removing the device from the board, enabling field upgrades and feature enhancements.
- Industrial temperature capability: specified operation from −40 °C to 100 °C for reliable performance in demanding environments.
- RoHS compliance: conforms to environmental requirements for modern electronics manufacturing.
Why Choose LFXP3E-4TN144I?
The LFXP3E-4TN144I is positioned for engineers who need a compact, non-volatile FPGA with mid-level logic capacity, on-chip RAM and flexible I/O in an industrial-temperature, surface-mount package. Its instant-on architecture, in-field reconfiguration capability and low-power Sleep Mode make it suitable for embedded control, communications interfaces and industrial applications where board space and power management are important.
Buyers and designers benefit from a solution that reduces external components, supports secure configuration without external memory, and delivers the system-level features commonly used in FPGA-based designs—helping simplify integration and extend product longevity through in-field updates.
Request a quote or submit a procurement inquiry to receive pricing, availability and lead-time information for the LFXP3E-4TN144I.