LFXP3E-4Q208C

The LFXP3E-4Q208C is a non-volatile LatticeXP family FPGA delivered in a 208‑pin BFQFP surface‑mount package. It integrates approximately 3,000 logic elements and 55,296 bits of on‑chip RAM with flexible I/O to support compact, reconfigurable digital designs for commercial applications.

Built for instant‑on operation and in‑field reconfiguration, the device targets system designs requiring embedded memory, programmable I/O, and low static power modes while operating within a commercial temperature range.

Key Features

• Core Logic – Approximately 3,000 logic elements provide a compact programmable fabric for glue logic, protocol bridging and control functions.
• On‑Chip Memory – 55,296 bits of total RAM on‑chip (approximately 54 Kbits) with the LatticeXP family memory architecture for distributed and block memory use.
• Flexible I/O – 136 I/O pins in a 208‑pin package support a wide range of interface options as defined by the LatticeXP sysIO™ buffer architecture in the family data sheet.
• Clocking and PLLs – Family support for analog PLLs; device class provides the clocking resources needed for clock multiplication, division and phase shifting (LFXP3 devices include 2 PLLs in the family selection).
• Non‑volatile, Reconfigurable Architecture – Instant‑on operation, no external configuration memory required, and in‑system reconfiguration capabilities for updates and design security.
• Low‑Power Modes – Family sleep mode enables significant static current reduction for power‑sensitive designs.
• Package and Mounting – 208‑BFQFP (supplier package 208‑PQFP 28×28) surface‑mount package suitable for compact PCB layouts.
• Power and Temperature – Core supply range 1.14 V to 1.26 V; commercial operating temperature range 0 °C to 85 °C.
• Standards and Support – Family features include IEEE 1149.1 boundary scan and in‑system debug/logging capabilities as documented in the LatticeXP family data.
• RoHS Compliant – Device meets RoHS environmental compliance requirements.

Typical Applications

• Embedded Control – Implement control logic and system glue functions where a compact, reprogrammable device is required.
• Interface Bridging – Translate between peripheral interfaces and buses using flexible I/O and on‑chip memory for buffering.
• User Interface and Peripheral Management – Manage displays, sensors and human‑machine interfaces with soft logic and local memory.
• In‑field Updatable Systems – Systems that benefit from in‑system reconfiguration and instant‑on behavior for rapid deployment and updates.

Unique Advantages

• Instant‑on Non‑Volatile Architecture: Eliminates the need for external configuration memory, reducing BOM and simplifying boot behavior.
• Field Reconfigurability: Supports in‑system updates and logic reconfiguration to extend product lifecycle and enable feature upgrades.
• Integrated Memory and I/O: On‑chip RAM and 136 flexible I/Os reduce external component count and board complexity for mid‑range designs.
• Low Static Power Options: Sleep mode capability reduces static current for energy‑sensitive applications.
• Compact Surface‑Mount Package: 208‑BFQFP (28×28 PQFP footprint) provides a high‑density option for space‑constrained PCBs.
• Commercial Temperature Grade: Designed for systems operating in 0 °C to 85 °C environments commonly found in commercial applications.

Why Choose LFXP3E-4Q208C?

The LFXP3E-4Q208C positions itself as a compact, non‑volatile FPGA option for commercial embedded designs that require reconfigurability, integrated memory and a flexible I/O fabric. With roughly 3,000 logic elements, 55,296 bits of on‑chip RAM and 136 I/Os in a 208‑pin surface‑mount package, it is suitable for mid‑density logic solutions where board space and BOM count are important considerations.

Engineers selecting this device benefit from instant‑on capability, in‑field reconfiguration and family‑level support features such as PLL clocking and boundary scan. It is a practical choice for teams that need scalable, reprogrammable logic with commercial temperature operation and RoHS compliance.

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