LFXP3E-3TN100C

IC FPGA 62 I/O 100TQFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 62 55296 3000 100-LQFP

Quantity 56 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-LQFPNumber of I/O62Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells3000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of LFXP3E-3TN100C – XP Field Programmable Gate Array (FPGA), 3,000 logic elements, 100‑LQFP

The LFXP3E-3TN100C is a commercial‑grade, non‑volatile XP family FPGA from Lattice Semiconductor. It integrates approximately 3,000 logic elements, 55,296 bits of on‑chip RAM, and up to 62 I/Os in a 100‑pin LQFP surface‑mount package.

Designed for compact embedded and system designs, the device delivers instant‑on, reconfigurable logic and system‑level capabilities that reduce external component count and accelerate development cycles.

Key Features

  • Core Logic: Approximately 3,000 logic elements for implementing combinational and sequential logic in a compact device footprint.
  • Embedded Memory: 55,296 bits of on‑chip RAM (approximately 54 Kbits) to support local buffering, state storage, and small memory structures without external SRAM.
  • I/O and Package: 62 general‑purpose I/Os in a 100‑pin LQFP (14 × 14 mm) surface‑mount package, enabling dense signal connectivity in a compact board area.
  • Non‑volatile, Instant‑on Architecture: XP family non‑volatile technology provides instant‑on behavior with no external configuration memory required, and protects configuration data from external read‑back.
  • In‑field Reconfiguration & Power Modes: Supports TransFR™ reconfiguration for in‑field logic updates and includes a Sleep Mode that can reduce static current by up to 1000× as specified by the family datasheet.
  • Clocking and Memory Interface: LFXP3 devices include analog PLLs for clock multiply/divide and phase shifting; the family also provides dedicated DDR memory interface capability up to DDR333.
  • Flexible I/O Standards (family‑level): The XP family supports a wide range of I/O standards via programmable sysIO buffers, enabling interfaces across multiple voltage domains and signaling standards.
  • Power and Thermal: Core voltage specified 1.14 V to 1.26 V; operating temperature range 0 °C to 85 °C; commercial grade and RoHS compliant.
  • Development Ecosystem (family‑level): Supported by Lattice development tools and ispLeverCORE IP to accelerate design implementation and migration across XP family devices.

Typical Applications

  • Embedded controllers: Compact control logic and state machines where instant‑on behavior and on‑chip memory reduce system complexity.
  • Interface bridging and I/O expansion: Implement protocol bridging, custom I/O interfacing, and glue logic using the device’s 62 I/Os in a small LQFP package.
  • Memory interface and buffering: Use the device’s embedded RAM and family‑level DDR support for buffering, FIFOs, and memory interface logic.
  • Field‑updatable systems: In‑field reconfiguration capability (TransFR) enables live updates to logic while the system remains operational.

Unique Advantages

  • Compact integration: 3,000 logic elements and ~55 Kbits of embedded memory in a 100‑pin LQFP package reduce board area and BOM compared with multi‑chip solutions.
  • Instant‑on, secure configuration: Non‑volatile, on‑chip configuration removes the need for external configuration memory and helps protect design IP.
  • In‑field flexibility: TransFR reconfiguration lets you update logic in the field, simplifying product upgrades and feature rollouts.
  • Power management options: Sleep Mode capability documented by the family specification enables significant reductions in static current for low‑power standby.
  • Practical supply and thermal envelope: Narrow core supply range (1.14–1.26 V) and commercial operating range (0 °C to 85 °C) match typical embedded and consumer applications.
  • Toolchain and IP support: Family‑level support with ispLEVER tools and ispLeverCORE IP accelerates design bring‑up and migration.

Why Choose LFXP3E-3TN100C?

The LFXP3E-3TN100C positions itself as a space‑efficient, reconfigurable solution for embedded and system designers who need instant‑on operation, secure on‑chip configuration, and modest logic and memory resources in a commercial‑grade part. Its combination of ~3,000 logic elements, integrated RAM, and flexible I/O in a 100‑pin LQFP package makes it suitable for compact control, interface, and field‑upgradeable designs.

Backed by the XP family feature set and Lattice development tools, this device is a practical choice for teams that require predictable performance, straightforward integration, and in‑field configurability without relying on external configuration memories.

Request a quote or submit an inquiry to check availability, pricing, and lead times for the LFXP3E-3TN100C.

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