LFXP3E-3TN144I

The LFXP3E-3TN144I is a non-volatile LatticeXP family FPGA in a 144-pin LQFP package that integrates reconfigurable logic, on-chip RAM and flexible I/O to support embedded system designs. The device provides 3,000 logic elements, 55,296 bits of on-chip RAM and up to 100 I/O pins, making it suitable for industrial applications and systems that require instant-on, reconfigurable logic with a compact surface-mount package.

Designed for robust operation, the device supports a supply voltage range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C. Family-level capabilities include non-volatile instant-on configuration, in-field reconfiguration and a variety of programmable I/O standards to simplify system integration.

Key Features

• Core Logic  Approximately 3,000 logic elements for implementing combinational and sequential logic functions on-chip.
• Embedded Memory  55,296 bits of on-chip RAM to support data buffering, small frame storage and distributed memory requirements.
• I/O Capacity & Flexibility  Up to 100 I/Os in a 144-LQFP package; programmable sysIO buffers support a wide range of interface standards as described at the family level, enabling diverse signal interfacing.
• Non-Volatile Instant-On  Family-level non-volatile architecture provides immediate configuration at power-up without external configuration memory.
• In-Field Reconfiguration  TransFR™ reconfiguration capability enables in-system logic updates while the system operates (family-level feature).
• Power & Sleep Mode  Family-level sleep mode support can reduce static current significantly for lower-power standby operation.
• Clocking  sysCLOCK PLL support (2 PLLs for the LFXP3 family) for clock multiplication, division and phase shifting at the family level.
• Package & Mounting  Surface-mount 144-LQFP package (supplier device package listed as 144-TQFP, 20 × 20 mm) for compact board-level integration.
• Industrial Temperature Grade  Specified to operate from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Voltage Supply  Device supply specified between 1.14 V and 1.26 V to match system power rails.
• Standards & System Support (Family-level)  Family-level features include IEEE 1149.1 boundary scan, onboard oscillator and JTAG/system configuration ports for programming and debug.

Typical Applications

• Industrial Control  Sensor interfacing, motor control logic and distributed I/O where industrial temperature range and flexible I/O are required.
• Embedded Communications  Protocol bridging and interface logic that benefit from programmable I/O standards and on-chip memory for buffering.
• In-Field Upgradable Systems  Products that require instant-on behavior and the ability to update logic in-system using TransFR reconfiguration.
• Prototyping and Low- to Mid-Density Integration  Compact 144-LQFP packaging and 3,000 logic elements support rapid prototyping and integration into space-constrained boards.

Unique Advantages

• Non-volatile instant-on configuration: Eliminates the need for external configuration memory, simplifying BOM and boot sequence.
• In-field reconfiguration capability: TransFR allows logic updates while the system remains operational, reducing downtime for firmware and logic revisions.
• Compact, industrial-ready package: 144-LQFP surface-mount package combined with −40 °C to 100 °C rating enables deployment in rugged, space-constrained systems.
• Flexible I/O and memory resources: Up to 100 I/Os and 55,296 bits of on-chip RAM provide the connectivity and local storage needed for many embedded tasks without external components.
• Integrated clock management: Family-level PLL support helps implement precise clocking schemes for synchronous interfaces and memory timing.

Why Choose LFXP3E-3TN144I?

The LFXP3E-3TN144I positions itself as a compact, industrial-grade FPGA option for designs that need non-volatile instant-on behavior, in-field reconfiguration and a balance of logic, memory and I/O in a 144-LQFP package. Its 3,000 logic elements, 55,296 bits of on-chip RAM and support for up to 100 I/Os make it suitable for embedded control, communication interface logic and systems requiring reliable operation across a wide temperature range.

Customers building mid-density FPGA designs will find the LFXP3E-3TN144I attractive for reducing external components, enabling rapid updates in the field and integrating flexible I/O standards. The device’s family-level features—such as non-volatile configuration, sleep mode and programmable sysIO buffers—add system-level flexibility and help reduce overall design complexity.

Request a quote or submit an inquiry to obtain pricing, availability and purchasing details for the LFXP3E-3TN144I. Our team can provide volume pricing and lead-time information to support your design and procurement planning.