LFXP3E-3T100C

The LFXP3E-3T100C is a commercial-grade Lattice XP family FPGA in a 100‑pin LQFP (14 × 14 mm) package, offering a compact, non-volatile FPGA solution for embedded and edge applications. The device combines approximately 3,000 logic elements with roughly 54 Kbits of on-chip RAM and 62 user I/Os to support control, interface and mid-density logic functions.

Designed around the LatticeXP architecture, this part targets applications that benefit from instant-on non-volatile logic, flexible I/O support across common standards, and in-field reconfiguration capabilities for firmware updates and feature scaling.

Key Features

• Core Logic  Approximately 3,000 logic elements arranged across 384 logic block resources, suitable for mid-density control and glue-logic implementations.
• Embedded Memory  Approximately 54 Kbits (55,296 bits) of on-chip RAM for block and distributed memory requirements.
• I/O Capacity & Flexibility  62 I/Os in the 100‑LQFP package. The LatticeXP family supports a wide range of I/O standards (for family-level reference), enabling common interface options for mixed-voltage systems.
• Non‑volatile, Instant-On Architecture  Family-level non-volatile ispXP technology provides instant-on operation and eliminates the need for external configuration memory.
• Reconfiguration & Field Updates  Family-level TransFR™ reconfiguration and in-field update capabilities allow logic updates while the system is operating.
• Power and Supply  Core voltage supply range specified for this device is 1.14 V to 1.26 V. Device-level sleep mode (family feature) enables significant static current reduction.
• Package & Mounting  100‑LQFP (14 × 14 mm) surface-mount package; supplier package listed as 100‑TQFP (14 × 14).
• Operating Conditions  Commercial grade operation from 0 °C to 85 °C and RoHS compliant.

Typical Applications

• Embedded and Control Systems  Implement board-level control logic, protocol translators and custom state machines where compact form factor and reconfigurability are required.
• Industrial Automation  Drive sensor aggregation, simple motor control interfaces and deterministic glue logic across mixed-voltage I/O environments.
• Communications & Interfaces  Support mid-density I/O interfacing, signal conditioning and protocol adaptation for edge communication nodes.
• Prototyping & Feature Development  Use the device for rapid prototyping, iterative firmware updates and feature scaling enabled by in-field reconfiguration.

Unique Advantages

• Non‑volatile, instant-on operation  Eliminates external configuration memory and enables immediate startup behavior for systems that require fast initialization.
• Field reconfiguration support  In-field update capability reduces maintenance overhead and enables post-deployment feature upgrades without hardware changes.
• Compact package with ample I/O  100‑LQFP packaging provides a small footprint while delivering 62 I/Os for flexible board-level integration.
• Balanced logic and memory resources  Approximately 3,000 logic elements with ~54 Kbits of embedded RAM address a broad set of mid-range FPGA use cases without overprovisioning.
• Commercial‑grade, RoHS compliant  Designed for standard commercial environments with lead-free, RoHS-compliant manufacturing.

Why Choose LFXP3E-3T100C?

The LFXP3E-3T100C delivers a mid-density, non-volatile FPGA option that balances logic resources, embedded memory and I/O capacity in a compact 100‑pin LQFP package. It is well suited for designers needing instant-on behavior, in-field update capabilities and a small BOM footprint for embedded, industrial and communications applications.

Its commercial temperature rating, surface-mount package and RoHS compliance make this device a practical choice for production designs that require scalable logic capacity and family-level features such as flexible I/O standards and reconfiguration support.

Request a quote or submit a purchase inquiry to receive pricing, lead-time information and availability for the LFXP3E-3T100C.