LFXP3E-3QN208C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 136 55296 3000 208-BFQFP |
|---|---|
| Quantity | 917 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 136 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of LFXP3E-3QN208C – XP Field Programmable Gate Array (FPGA) IC 136 55296 3000 208-BFQFP
The LFXP3E-3QN208C is a non-volatile FPGA in a 208-pin PQFP package designed for commercial embedded and system applications. It integrates approximately 3,000 logic elements, roughly 55 Kbits of on‑chip RAM, and 136 user I/Os in a surface-mount 208-BFQFP (208-PQFP, 28×28 mm) package.
Built on the LatticeXP family architecture, the device targets applications that require instant-on non-volatile operation, flexible I/O support and the ability to reconfigure logic in-system while minimizing external BOM components.
Key Features
- Logic Capacity — Approximately 3,000 logic elements suitable for mid-density control, glue-logic and interface tasks.
- Embedded Memory — Total on-chip RAM of 55,296 bits (approximately 55 Kbits) for buffering, small FIFOs and state storage.
- I/O Count & Package — 136 user I/Os in a 208-BFQFP surface-mount package (208-PQFP, 28×28 mm), offering compact integration for board-level designs.
- Non‑volatile, Instant‑On Architecture — LatticeXP family characteristics include non-volatile instant-on operation with no mandatory external configuration memory and protected configuration data.
- In‑field Reconfiguration — Family-level support for system reconfiguration (TransFR™) and SRAM reprogramming in milliseconds, enabling field updates while a system is operational.
- Flexible I/O Standards (family capability) — LatticeXP architecture supports a broad range of interface standards via programmable I/O buffers, including multiple LV/TTL families, SSTL, HSTL, PCI and differential standards such as LVDS.
- Power Supply — Specified operating voltage range of 1.14 V to 1.26 V for core supply on this device.
- Operating Range and Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
- RoHS Compliant — Meets RoHS environmental requirements.
Typical Applications
- Embedded Control — Implement state machines, protocol bridging and custom control logic using the device’s programmable logic and on-chip RAM.
- Interface Bridging — Use the flexible I/O support to adapt between logic families or to implement custom interface adapters on a compact PQFP footprint.
- System Boot & Configuration — Non-volatile instant-on behavior is suited for systems that require quick initialization without external configuration memory.
- In-field Upgrades — Where incremental feature updates or bug fixes are needed, in-system reconfiguration capability enables field updates without board replacement.
Unique Advantages
- Non-volatile instant-on operation: Eliminates the need for external configuration memory, simplifying BOM and system initialization.
- Compact, high‑I/O package: 136 I/Os in a 208-pin PQFP (28×28 mm) provide significant connectivity for mid-density designs in a conventional SMT footprint.
- On-chip memory for buffering: Approximately 55 Kbits of embedded RAM enables local data storage and small FIFO implementations without external SRAM.
- Field reconfigurability: Support for in-field logic updates reduces lifecycle costs and enables design evolution after deployment.
- Commercial temperature rating: 0 °C to 85 °C operation matches standard commercial electronics environments and applications.
- RoHS compliant: Supports environmental regulations for lead-free manufacturing and assembly.
Why Choose LFXP3E-3QN208C?
The LFXP3E-3QN208C combines non-volatile instant-on capability with a balanced mix of logic, embedded memory and a high I/O count in a familiar 208-pin PQFP package. It is well suited for designers who need a compact, reconfigurable platform for mid-density embedded control, interface bridging and systems that benefit from in-field updates.
Selection of this device provides a scalable entry point within the LatticeXP family architecture, offering predictable behavior, commercial-grade temperature operation and RoHS compliance—delivering a pragmatic solution for product lines that require programmable logic without the complexity of external configuration components.
Request a quote or submit a procurement inquiry to receive pricing, availability and lead-time information for LFXP3E-3QN208C.

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