LFXP3C-5T100C

IC FPGA 62 I/O 100TQFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 62 55296 3000 100-LQFP

Quantity 825 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-LQFPNumber of I/O62Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells3000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of LFXP3C-5T100C – XP Field Programmable Gate Array (FPGA) IC 62 55296 3000 100-LQFP

The LFXP3C-5T100C is a non-volatile, reconfigurable FPGA in a 100‑pin LQFP package designed for commercial embedded systems. It combines approximately 3,000 logic elements, on‑chip embedded memory and flexible I/O to enable instant-on operation and in-field reconfiguration without external configuration memory.

This device is suited for system designs that require moderate logic density, configurable interfaces and low-power modes, providing a compact solution with a 1.71 V to 3.465 V supply range and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

  • Core Logic — Approximately 3,000 logic elements provide mid-range programmable logic capacity for glue logic, protocol handling and control functions.
  • Embedded Memory — 55,296 bits (≈55 Kbits) of on-chip RAM for embedded data buffering, FIFOs and small lookup tables.
  • I/O Density & Package — 62 general-purpose I/Os in a 100‑LQFP (100‑TQFP, 14×14 mm) package, surface-mountable for compact board layouts.
  • Non‑Volatile, Instant‑On Architecture — Family-level features include non‑volatile configuration with instant-on operation and no external configuration memory required.
  • Reconfiguration & Debug — Supports in-field reconfiguration and system-level debug capability via JTAG and internal trace/logic analysis features described for the LatticeXP family.
  • Flexible I/O Standards — Family-level programmable I/O buffer support for a wide range of interfaces (examples documented for the LatticeXP family include LVCMOS, LVTTL, LVDS, SSTL and others).
  • Clocking — Family documentation indicates analog PLL support for clock multiply/divide and phase shifting (LFXP3 family devices include up to 2 PLLs).
  • Power & Temperature — Supply range 1.71 V to 3.465 V; commercial grade operation from 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • Embedded control — Compact FPGA logic for control, sequencing, and glue logic in embedded systems where instant-on behavior and on-chip configuration are beneficial.
  • Interface bridging — Implement protocol bridging and custom I/O interfaces using the device’s flexible I/O buffer options and 62 available I/Os.
  • Memory interface support — Use the family’s documented DDR interface capabilities when implementing dedicated DDR memory controllers or buffering elements.
  • In-field updates — Systems requiring field reconfiguration and updates can leverage the LatticeXP family’s TransFR reconfiguration and JTAG-based programming features.

Unique Advantages

  • Non‑volatile instant-on: Eliminates the need for external configuration memory and enables rapid power-up behavior.
  • Compact, surface‑mount package: 100‑LQFP (14×14 mm) package offers a small footprint for space‑constrained boards while providing 62 I/Os.
  • On‑chip memory and logic balance: Approximately 3,000 logic elements paired with ≈55 Kbits of embedded RAM supports mid-density designs without external SRAM.
  • Flexible voltage window: Operates across a 1.71 V to 3.465 V supply range to accommodate a variety of system power rails.
  • Low-power modes and field reconfiguration: Family features include sleep mode for significant static current reduction and in-field reconfiguration capability for live updates.
  • Ecosystem and design support: The LatticeXP family is documented with design tools and IP modules to accelerate development and migration across device densities.

Why Choose LFXP3C-5T100C?

The LFXP3C-5T100C positions itself as a compact, non‑volatile FPGA option for commercial embedded designs that need moderate logic density, on‑chip RAM and flexible interfacing in a small LQFP package. Its instant-on capability and on‑device configuration reduce BOM complexity by removing external configuration memory.

Engineers designing mid-density control, interface or memory-support functions will find the device’s combination of approximately 3,000 logic elements, ≈55 Kbits of embedded RAM, 62 I/Os, and family-level features such as reconfiguration and PLLs a practical fit for space‑ and power‑constrained applications.

Request a quote or submit a procurement inquiry to evaluate the LFXP3C-5T100C for your next embedded FPGA design project.

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