LFXP3C-5T100C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 62 55296 3000 100-LQFP |
|---|---|
| Quantity | 825 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-LQFP | Number of I/O | 62 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of LFXP3C-5T100C – XP Field Programmable Gate Array (FPGA) IC 62 55296 3000 100-LQFP
The LFXP3C-5T100C is a non-volatile, reconfigurable FPGA in a 100‑pin LQFP package designed for commercial embedded systems. It combines approximately 3,000 logic elements, on‑chip embedded memory and flexible I/O to enable instant-on operation and in-field reconfiguration without external configuration memory.
This device is suited for system designs that require moderate logic density, configurable interfaces and low-power modes, providing a compact solution with a 1.71 V to 3.465 V supply range and a commercial operating temperature range of 0 °C to 85 °C.
Key Features
- Core Logic — Approximately 3,000 logic elements provide mid-range programmable logic capacity for glue logic, protocol handling and control functions.
- Embedded Memory — 55,296 bits (≈55 Kbits) of on-chip RAM for embedded data buffering, FIFOs and small lookup tables.
- I/O Density & Package — 62 general-purpose I/Os in a 100‑LQFP (100‑TQFP, 14×14 mm) package, surface-mountable for compact board layouts.
- Non‑Volatile, Instant‑On Architecture — Family-level features include non‑volatile configuration with instant-on operation and no external configuration memory required.
- Reconfiguration & Debug — Supports in-field reconfiguration and system-level debug capability via JTAG and internal trace/logic analysis features described for the LatticeXP family.
- Flexible I/O Standards — Family-level programmable I/O buffer support for a wide range of interfaces (examples documented for the LatticeXP family include LVCMOS, LVTTL, LVDS, SSTL and others).
- Clocking — Family documentation indicates analog PLL support for clock multiply/divide and phase shifting (LFXP3 family devices include up to 2 PLLs).
- Power & Temperature — Supply range 1.71 V to 3.465 V; commercial grade operation from 0 °C to 85 °C; RoHS compliant.
Typical Applications
- Embedded control — Compact FPGA logic for control, sequencing, and glue logic in embedded systems where instant-on behavior and on-chip configuration are beneficial.
- Interface bridging — Implement protocol bridging and custom I/O interfaces using the device’s flexible I/O buffer options and 62 available I/Os.
- Memory interface support — Use the family’s documented DDR interface capabilities when implementing dedicated DDR memory controllers or buffering elements.
- In-field updates — Systems requiring field reconfiguration and updates can leverage the LatticeXP family’s TransFR reconfiguration and JTAG-based programming features.
Unique Advantages
- Non‑volatile instant-on: Eliminates the need for external configuration memory and enables rapid power-up behavior.
- Compact, surface‑mount package: 100‑LQFP (14×14 mm) package offers a small footprint for space‑constrained boards while providing 62 I/Os.
- On‑chip memory and logic balance: Approximately 3,000 logic elements paired with ≈55 Kbits of embedded RAM supports mid-density designs without external SRAM.
- Flexible voltage window: Operates across a 1.71 V to 3.465 V supply range to accommodate a variety of system power rails.
- Low-power modes and field reconfiguration: Family features include sleep mode for significant static current reduction and in-field reconfiguration capability for live updates.
- Ecosystem and design support: The LatticeXP family is documented with design tools and IP modules to accelerate development and migration across device densities.
Why Choose LFXP3C-5T100C?
The LFXP3C-5T100C positions itself as a compact, non‑volatile FPGA option for commercial embedded designs that need moderate logic density, on‑chip RAM and flexible interfacing in a small LQFP package. Its instant-on capability and on‑device configuration reduce BOM complexity by removing external configuration memory.
Engineers designing mid-density control, interface or memory-support functions will find the device’s combination of approximately 3,000 logic elements, ≈55 Kbits of embedded RAM, 62 I/Os, and family-level features such as reconfiguration and PLLs a practical fit for space‑ and power‑constrained applications.
Request a quote or submit a procurement inquiry to evaluate the LFXP3C-5T100C for your next embedded FPGA design project.