LFXP3C-5Q208C

IC FPGA 136 I/O 208QFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 136 55296 3000 208-BFQFP

Quantity 1,212 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O136Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells3000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of LFXP3C-5Q208C – XP Field Programmable Gate Array (FPGA) IC, 136 I/O, 55,296-bit RAM, 3,000 logic elements, 208-BFQFP

The LFXP3C-5Q208C is a member of the LatticeXP family of non-volatile, reconfigurable FPGAs. It combines approximately 3,000 logic elements, on-chip memory and a flexible I/O set in a 208-pin BFQFP package for compact, surface-mount system designs.

Designed for embedded and system-level applications that require instant-on configuration, secure bitstreams and in-field reconfiguration, this device offers a balance of logic density, on-chip RAM and I/O count for moderate-complexity designs.

Key Features

  • Core Architecture Non-volatile, infinitely reconfigurable LatticeXP family architecture offering instant-on configuration and in-field reconfiguration capabilities.
  • Logic Capacity Approximately 3,000 logic elements (LEs) for implementing combinational and sequential logic.
  • On-chip Memory Total on-chip RAM: 55,296 bits (approximately 54 Kbits) of embedded memory for distributed and block memory usage.
  • I/O and Interface Flexibility 136 user I/Os with programmable I/O buffer support across multiple signaling standards as provided by the LatticeXP family.
  • Reconfiguration & Security Non-volatile configuration (no external configuration memory required), instant-on operation and support for in-field (TransFR™) reconfiguration features described for the LatticeXP family.
  • Clocking Two PLLs (per LFXP3 family selection) for clock multiply/divide and phase shifting as defined in the LatticeXP family data.
  • Power and Supply Voltage supply range: 1.71 V to 3.465 V. LatticeXP devices operate with common VCC levels including 3.3 V, 2.5 V, 1.8 V and 1.2 V as described for the family.
  • Package & Mounting 208‑BFQFP (208‑PQFP, 28 × 28 mm) surface-mount package suitable for compact PCB layouts.
  • Temperature & Grade Commercial grade operation from 0 °C to 85 °C.
  • Environmental Compliance RoHS compliant.

Typical Applications

  • Embedded control and glue logic Implement board-level state machines, bus bridging and interface logic where moderate logic density and on-chip memory are required.
  • Interface bridging with DDR support Suitable for designs that require dedicated DDR memory interface support as provided by the LatticeXP family architecture.
  • Instant-on, secure systems Systems that benefit from non-volatile configuration and secure bitstream handling without external configuration memory.
  • Field-updatable designs Products that require in-field updates or partial reconfiguration while retaining system operation.

Unique Advantages

  • Non-volatile, instant-on configuration: Eliminates the need for external configuration memory and reduces system configuration time on power-up.
  • In-field reconfiguration capability: Supports system updates and logic changes without full device replacement, enabling long-term product flexibility.
  • Balanced logic and memory: Approximately 3,000 logic elements and ~54 Kbits of on-chip RAM provide a compact platform for mid-density designs.
  • Flexible I/O count in a compact package: 136 I/Os in a 208‑pin BFQFP give a high I/O-to-package ratio for space-constrained boards.
  • Commercial temperature and RoHS compliance: Clear specification for 0 °C to 85 °C operation and environmental compliance for mainstream product lines.
  • Vendor tool and IP ecosystem: LatticeXP family support includes design tools and pre‑designed IP modules for efficient implementation and faster time-to-prototype.

Why Choose LFXP3C-5Q208C?

The LFXP3C-5Q208C positions itself as a practical mid-density FPGA option within the LatticeXP family for designers who need non-volatile, instant-on programmable logic with flexible I/O and on-chip memory. Its combination of roughly 3,000 logic elements, about 54 Kbits of RAM and 136 I/Os in a 208‑BFQFP package makes it suitable for embedded control, interface bridging and field-updateable systems operating in commercial environments.

Backed by the LatticeXP family’s configuration and tool support, this device provides a predictable platform for development workflows that leverage vendor IP and design tools to accelerate implementation and deployment.

Request a quote or submit an inquiry to receive pricing, availability and additional procurement details for the LFXP3C-5Q208C.

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