LFXP3C-5Q208C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 136 55296 3000 208-BFQFP |
|---|---|
| Quantity | 1,212 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 136 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of LFXP3C-5Q208C – XP Field Programmable Gate Array (FPGA) IC, 136 I/O, 55,296-bit RAM, 3,000 logic elements, 208-BFQFP
The LFXP3C-5Q208C is a member of the LatticeXP family of non-volatile, reconfigurable FPGAs. It combines approximately 3,000 logic elements, on-chip memory and a flexible I/O set in a 208-pin BFQFP package for compact, surface-mount system designs.
Designed for embedded and system-level applications that require instant-on configuration, secure bitstreams and in-field reconfiguration, this device offers a balance of logic density, on-chip RAM and I/O count for moderate-complexity designs.
Key Features
- Core Architecture Non-volatile, infinitely reconfigurable LatticeXP family architecture offering instant-on configuration and in-field reconfiguration capabilities.
- Logic Capacity Approximately 3,000 logic elements (LEs) for implementing combinational and sequential logic.
- On-chip Memory Total on-chip RAM: 55,296 bits (approximately 54 Kbits) of embedded memory for distributed and block memory usage.
- I/O and Interface Flexibility 136 user I/Os with programmable I/O buffer support across multiple signaling standards as provided by the LatticeXP family.
- Reconfiguration & Security Non-volatile configuration (no external configuration memory required), instant-on operation and support for in-field (TransFR™) reconfiguration features described for the LatticeXP family.
- Clocking Two PLLs (per LFXP3 family selection) for clock multiply/divide and phase shifting as defined in the LatticeXP family data.
- Power and Supply Voltage supply range: 1.71 V to 3.465 V. LatticeXP devices operate with common VCC levels including 3.3 V, 2.5 V, 1.8 V and 1.2 V as described for the family.
- Package & Mounting 208‑BFQFP (208‑PQFP, 28 × 28 mm) surface-mount package suitable for compact PCB layouts.
- Temperature & Grade Commercial grade operation from 0 °C to 85 °C.
- Environmental Compliance RoHS compliant.
Typical Applications
- Embedded control and glue logic Implement board-level state machines, bus bridging and interface logic where moderate logic density and on-chip memory are required.
- Interface bridging with DDR support Suitable for designs that require dedicated DDR memory interface support as provided by the LatticeXP family architecture.
- Instant-on, secure systems Systems that benefit from non-volatile configuration and secure bitstream handling without external configuration memory.
- Field-updatable designs Products that require in-field updates or partial reconfiguration while retaining system operation.
Unique Advantages
- Non-volatile, instant-on configuration: Eliminates the need for external configuration memory and reduces system configuration time on power-up.
- In-field reconfiguration capability: Supports system updates and logic changes without full device replacement, enabling long-term product flexibility.
- Balanced logic and memory: Approximately 3,000 logic elements and ~54 Kbits of on-chip RAM provide a compact platform for mid-density designs.
- Flexible I/O count in a compact package: 136 I/Os in a 208‑pin BFQFP give a high I/O-to-package ratio for space-constrained boards.
- Commercial temperature and RoHS compliance: Clear specification for 0 °C to 85 °C operation and environmental compliance for mainstream product lines.
- Vendor tool and IP ecosystem: LatticeXP family support includes design tools and pre‑designed IP modules for efficient implementation and faster time-to-prototype.
Why Choose LFXP3C-5Q208C?
The LFXP3C-5Q208C positions itself as a practical mid-density FPGA option within the LatticeXP family for designers who need non-volatile, instant-on programmable logic with flexible I/O and on-chip memory. Its combination of roughly 3,000 logic elements, about 54 Kbits of RAM and 136 I/Os in a 208‑BFQFP package makes it suitable for embedded control, interface bridging and field-updateable systems operating in commercial environments.
Backed by the LatticeXP family’s configuration and tool support, this device provides a predictable platform for development workflows that leverage vendor IP and design tools to accelerate implementation and deployment.
Request a quote or submit an inquiry to receive pricing, availability and additional procurement details for the LFXP3C-5Q208C.