LFXP3C-4TN100C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 62 55296 3000 100-LQFP |
|---|---|
| Quantity | 316 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-LQFP | Number of I/O | 62 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of LFXP3C-4TN100C – XP Field Programmable Gate Array, 3,000 Logic Elements, 62 I/Os, 100-LQFP
The LFXP3C-4TN100C is a non-volatile XP family FPGA from Lattice Semiconductor designed for commercial embedded system applications. It integrates approximately 3,000 logic elements, 55,296 bits of on-chip RAM and 62 general-purpose I/Os in a 100-pin LQFP/TQFP (14 × 14 mm) package for compact system designs.
Built on the LatticeXP architecture, the device delivers instant-on non-volatile operation, in-field reconfiguration capabilities and system-level features that simplify interfacing and memory support for a wide range of commercial designs.
Key Features
- Core & Reconfiguration Non-volatile, infinitely reconfigurable FPGA fabric with instant-on operation and in-field reconfiguration (TransFR™) for live logic updates.
- Logic Capacity Approximately 3,000 logic elements organized across 384 logic blocks to implement mid-density logic and glue functions.
- Embedded Memory Approximately 55 Kbits of on-chip RAM (55,296 total RAM bits) for distributed and block memory needs.
- I/O Flexibility 62 I/Os in the 100-pin package with a programmable sysIO™ buffer architecture supporting a wide range of interface standards described in the LatticeXP family data sheet.
- Clocking Dedicated PLL resources appropriate to the LFXP3 family for clock multiply/divide and phase shifting as described in the family documentation.
- Power & Low-Power Modes Operates over a 1.71 V to 3.465 V supply range and includes a sleep mode capability that can reduce static current by up to 1000× (family feature).
- Package & Mounting Surface-mount 100-pin LQFP (14 × 14 mm) package; supplier package reference 100-TQFP (14×14).
- Commercial Temperature Grade Rated for 0 °C to 85 °C operation and RoHS compliant.
- System-Level Support Family-level features include IEEE 1149.1 boundary scan and onboard debugging capabilities for development and verification.
Typical Applications
- Embedded controllers Implement control logic, protocol bridging and board-level glue where compact, non-volatile FPGA logic is required.
- Consumer electronics Provide instant-on programmable functions and flexible I/O for user interfaces, peripheral control and system integration.
- Memory interface and buffering Use the on-chip RAM and family-supported DDR interface features to implement local buffering and memory control logic.
- High-speed I/O bridging Leverage programmable I/O standards and PLL-based clocking to support interface translation and timing alignment tasks.
Unique Advantages
- Non-volatile instant-on operation: Eliminates the need for external configuration memory and enables immediate start-up.
- In-field reconfiguration: TransFR™ capability (family feature) allows updating logic while the system is running, reducing maintenance downtime.
- Compact, mid-density integration: 3,000 logic elements and ~55 Kbits of embedded RAM in a 100-pin package reduce board area and BOM complexity.
- Flexible I/O and clocking: Programmable sysIO buffers and PLL resources support diverse interface standards and precise timing control.
- Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS compliant for mainstream commercial product deployments.
Why Choose LFXP3C-4TN100C?
The LFXP3C-4TN100C is positioned for commercial embedded designs that require a compact, non-volatile FPGA with mid-range logic capacity and flexible interfacing. Its combination of approximately 3,000 logic elements, ~55 Kbits of on-chip RAM and 62 I/Os in a 100-pin LQFP package makes it well-suited for board-level control, interface bridging and moderate-memory tasks.
Backed by the LatticeXP family architecture and system-level provisions such as boundary-scan and on-chip debugging features, this device offers a practical balance of integration, configurability and development support for commercial product lines where instant-on and in-field updates are valuable.
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