LFXP3C-4TN100C

IC FPGA 62 I/O 100TQFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 62 55296 3000 100-LQFP

Quantity 316 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-LQFPNumber of I/O62Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells3000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of LFXP3C-4TN100C – XP Field Programmable Gate Array, 3,000 Logic Elements, 62 I/Os, 100-LQFP

The LFXP3C-4TN100C is a non-volatile XP family FPGA from Lattice Semiconductor designed for commercial embedded system applications. It integrates approximately 3,000 logic elements, 55,296 bits of on-chip RAM and 62 general-purpose I/Os in a 100-pin LQFP/TQFP (14 × 14 mm) package for compact system designs.

Built on the LatticeXP architecture, the device delivers instant-on non-volatile operation, in-field reconfiguration capabilities and system-level features that simplify interfacing and memory support for a wide range of commercial designs.

Key Features

  • Core & Reconfiguration  Non-volatile, infinitely reconfigurable FPGA fabric with instant-on operation and in-field reconfiguration (TransFR™) for live logic updates.
  • Logic Capacity  Approximately 3,000 logic elements organized across 384 logic blocks to implement mid-density logic and glue functions.
  • Embedded Memory  Approximately 55 Kbits of on-chip RAM (55,296 total RAM bits) for distributed and block memory needs.
  • I/O Flexibility  62 I/Os in the 100-pin package with a programmable sysIO™ buffer architecture supporting a wide range of interface standards described in the LatticeXP family data sheet.
  • Clocking  Dedicated PLL resources appropriate to the LFXP3 family for clock multiply/divide and phase shifting as described in the family documentation.
  • Power & Low-Power Modes  Operates over a 1.71 V to 3.465 V supply range and includes a sleep mode capability that can reduce static current by up to 1000× (family feature).
  • Package & Mounting  Surface-mount 100-pin LQFP (14 × 14 mm) package; supplier package reference 100-TQFP (14×14).
  • Commercial Temperature Grade  Rated for 0 °C to 85 °C operation and RoHS compliant.
  • System-Level Support  Family-level features include IEEE 1149.1 boundary scan and onboard debugging capabilities for development and verification.

Typical Applications

  • Embedded controllers  Implement control logic, protocol bridging and board-level glue where compact, non-volatile FPGA logic is required.
  • Consumer electronics  Provide instant-on programmable functions and flexible I/O for user interfaces, peripheral control and system integration.
  • Memory interface and buffering  Use the on-chip RAM and family-supported DDR interface features to implement local buffering and memory control logic.
  • High-speed I/O bridging  Leverage programmable I/O standards and PLL-based clocking to support interface translation and timing alignment tasks.

Unique Advantages

  • Non-volatile instant-on operation: Eliminates the need for external configuration memory and enables immediate start-up.
  • In-field reconfiguration: TransFR™ capability (family feature) allows updating logic while the system is running, reducing maintenance downtime.
  • Compact, mid-density integration: 3,000 logic elements and ~55 Kbits of embedded RAM in a 100-pin package reduce board area and BOM complexity.
  • Flexible I/O and clocking: Programmable sysIO buffers and PLL resources support diverse interface standards and precise timing control.
  • Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS compliant for mainstream commercial product deployments.

Why Choose LFXP3C-4TN100C?

The LFXP3C-4TN100C is positioned for commercial embedded designs that require a compact, non-volatile FPGA with mid-range logic capacity and flexible interfacing. Its combination of approximately 3,000 logic elements, ~55 Kbits of on-chip RAM and 62 I/Os in a 100-pin LQFP package makes it well-suited for board-level control, interface bridging and moderate-memory tasks.

Backed by the LatticeXP family architecture and system-level provisions such as boundary-scan and on-chip debugging features, this device offers a practical balance of integration, configurability and development support for commercial product lines where instant-on and in-field updates are valuable.

Request a quote or submit an inquiry to receive pricing and availability information for the LFXP3C-4TN100C.

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