LFXP3C-4T144I

IC FPGA 100 I/O 144TQFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 100 55296 3000 144-LQFP

Quantity 508 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFPNumber of I/O100Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells3000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of LFXP3C-4T144I – XP Field Programmable Gate Array (FPGA) IC 100 55296 3000 144-LQFP

The LFXP3C-4T144I is a Lattice Semiconductor XP-series FPGA offering a non-volatile, reconfigurable logic fabric in a 144-pin package. It delivers approximately 3,000 logic elements and roughly 54 Kbits of embedded block RAM, along with 100 general-purpose I/Os—positioning it for compact, instant-on embedded and industrial applications that require moderate logic density and flexible I/O.

Designed for industrial use, the device supports a wide supply voltage range (1.71 V to 3.465 V) and an operating temperature range of -40 °C to 100 °C, with RoHS compliance for environmental requirements.

Key Features

  • Programmable Logic Capacity — Approximately 3,000 logic elements enable implementation of moderate-complexity control, interface and glue-logic functions.
  • On‑chip Memory — Approximately 55,296 bits (about 54 Kbits) of embedded RAM for block memory requirements and local buffering.
  • Flexible I/O — 100 I/Os in a 144-pin package provide a broad set of external interface options for sensors, peripherals and bus bridging.
  • Non‑volatile, Instant‑on Architecture — LatticeXP family features include non-volatile configuration with instant-on behavior and no requirement for external configuration memory.
  • Reconfiguration and In‑field Updates — Family-level TransFR™ reconfiguration and support for reprogramming via system configuration and JTAG enable in-field logic updates.
  • Low‑power Modes — Sleep mode capability reduces static current substantially for power‑sensitive systems.
  • Clocking — Family devices provide PLL resources for clock multiplication, division and phase adjustment (LFXP3 devices include 2 PLLs).
  • Package and Mounting — Surface-mount 144-LQFP / 144-TQFP (20 × 20 mm) packaging simplifies PCB integration while supplying up to 100 I/Os.
  • Industrial Temperature and Voltage Support — Rated for -40 °C to 100 °C operation and a supply range from 1.71 V to 3.465 V to match varied system rails.
  • Regulatory — RoHS compliant for environmental and manufacturing requirements.

Typical Applications

  • Industrial Control — Implements control logic, sensor interfacing and deterministic I/O handling in industrial automation and embedded controllers, benefiting from industrial temperature rating.
  • Embedded Systems — Provides instant-on reconfigurable logic for embedded products that require fast startup and local memory for buffering and state machines.
  • Communications and Interface Bridging — Enables protocol bridging and custom I/O adaptation where a moderate number of I/Os and flexible clocking resources are needed.
  • In-field Upgradeable Designs — Supports systems that need in-field logic updates or firmware-style reconfiguration without external configuration memory.

Unique Advantages

  • Non‑volatile Instant‑on: Eliminates the need for external configuration ROM, enabling faster startup and a simplified bill of materials.
  • Compact Integration: 144‑pin package with 100 I/Os provides a balance of I/O density and PCB footprint for space‑constrained designs.
  • Industrial‑rated Robustness: Operating range to 100 °C and industrial grade classification make it suitable for demanding environments.
  • In‑field Reconfiguration: TransFR™ reconfiguration and JTAG/system configuration support enable updates and iterative development after deployment.
  • Power Management: Sleep mode capability allows substantial static current reduction for low‑power standby operation.
  • Design Ecosystem: Part of the LatticeXP family with tool and IP support for accelerating development and migration within the family.

Why Choose LFXP3C-4T144I?

The LFXP3C-4T144I combines non-volatile instant-on operation, moderate logic density and flexible I/O in a compact 144-pin package tailored for industrial and embedded designs. Its on-chip memory, reconfiguration capabilities and industrial temperature range provide a balance of integration and robustness for projects that require quick startup, in-field updates and reliable operation across a wide temperature span.

This device is suited to engineers and procurement teams building compact controllers, interface bridges or embedded systems who need a verified FPGA solution with family-level tool and IP support to shorten development cycles and simplify BOMs.

Request a quote or submit an inquiry to obtain pricing, availability and additional technical information for the LFXP3C-4T144I.

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