LFXP3C-4TN100I

The LFXP3C-4TN100I from Lattice Semiconductor Corporation is a non-volatile, reconfigurable XP family field programmable gate array (FPGA) in a 100‑pin LQFP package. The device integrates approximately 3,000 logic elements and approximately 55 Kbits of embedded RAM with up to 62 general-purpose I/Os, making it suitable for industrial embedded control and interface applications that require flexible I/O and on-chip memory.

Built for systems that need instant-on behavior, in-field reconfiguration and a broad supply voltage window, this industrial‑grade FPGA supports varied I/O standards and offers system-level features to simplify integration and maintainability in deployed equipment.

Key Features

• Core Logic – Approximately 3,000 logic elements providing a compact, reprogrammable fabric for glue logic, control state machines and moderate-density user logic.
• Embedded Memory – Approximately 55 Kbits (55,296 bits) of on-chip RAM for data buffering, small FIFOs and lookup tables.
• I/O Capacity & Package – 62 available I/Os in a 100‑LQFP (14 × 14 mm) package, enabling a broad set of peripheral and bus connections in a compact footprint.
• Non‑volatile, Instant‑on Architecture – Family-level non-volatile configuration eliminates the need for external configuration memory and enables rapid power-up of the FPGA fabric.
• In‑field Reconfiguration (TransFR™) – Supports reconfiguration of SRAM-based logic while the system is running for field updates and incremental feature rollout.
• Flexible Voltage Range – Operates across a wide supply range from 1.71 V to 3.465 V to support multiple system power domains.
• Industrial Temperature Range – Rated for operation from −40 °C to 100 °C for industrial applications.
• Programmable Clocking – Family-level support includes analog PLLs for clock multiply/divide and phase shifting (device-specific PLL count applies to family configuration).
• Low‑power Modes – Family features include sleep mode for substantial static current reduction during low-power states.
• Design and Debug Support – Family-level features include boundary-scan (IEEE 1149.1) and internal logic analyzer capability for system test and debug.

Typical Applications

• Industrial Control – Use for machine control, protocol bridging and custom I/O handling where industrial temperature operation and on-chip reprogrammability matter.
• Embedded Systems – Implement glue logic, peripheral controllers and small accelerators that benefit from on-chip RAM and flexible I/O standards.
• Field‑Updatable Equipment – Systems requiring in-field logic updates or incremental feature upgrades can leverage TransFR reconfiguration to update logic while operating.
• Memory Interface and Buffering – Suitable for designs that need dedicated on-chip memory for buffering or small FIFO implementations tied to external interfaces.

Unique Advantages

• Instant-on non‑volatile configuration: Eliminates external configuration memories and enables rapid startup without external ROMs.
• Compact, industrial-grade solution: Combines ~3,000 logic elements and ~55 Kbits of embedded RAM in a 100‑LQFP package with −40 °C to 100 °C rating for robust deployment.
• Flexible supply compatibility: Broad supply range (1.71 V to 3.465 V) allows integration into systems with multiple power rails and legacy I/O voltages.
• In-field reconfiguration capability: Supports updates to SRAM logic while the system runs, reducing downtime for field upgrades.
• Debug and test features: Boundary-scan and internal logic analysis features simplify board bring-up, validation and production testing.

Why Choose LFXP3C-4TN100I?

The LFXP3C-4TN100I delivers a balanced combination of reconfigurable logic, embedded RAM and flexible I/O in a compact, industrial-rated package. Its non-volatile instant-on architecture and in-field reconfiguration capability make it well suited for embedded and industrial systems that require rapid startup, maintainability and the ability to evolve in the field.

This part is a practical choice for designers seeking a mid-density FPGA with on-chip memory, robust operating temperature range and a small-footprint LQFP package—providing integration and lifecycle advantages for deployed equipment.

Request a quote or submit a purchase inquiry to receive pricing and availability for the LFXP3C-4TN100I. Our team can provide lead-time details and support for volume and prototype orders.